Samsung Electronics is ready to mass produce its third-generation 4-nm chips, which is the main item in the foundry ultra-micro fabrication process sector, according to a report. The Korean company has apparently resolved early-stage yield issues and achieved advancements in performance, power consumption, and area improvement. Manufacturing should start during the first half of this year.

Samsung has improved the wafer yield of its new-generation chipsets, which was previously very low at the Hwaseong factory. This improvement has allowed Samsung to compete with other semiconductor companies, such as TSMC, and attract customers like Qualcomm who previously had to rely on TSMC’s 4nm platforms.

As per the report, Samsung Electronics will begin mass production of chips through a 4-nm 2.3-generation process in the first half of this year. In its business report released on March 12, the Korean tech giant announced the mass production schedule for its 4-nm follow-up version for the first time. Compared to the early version SF4E, the second and third-generation 4-nm chips offer superior performance, reduced power consumption, and smaller form factors.

Industry insiders suggest Samsung’s 4-nm process has 60 percent usable wafers. Notably, this yield is still not on par with that of TSMC, which is known to be in the 70-80 percent range. However, experts say that Samsung’s yield is improving rapidly and mass production of the follow-up version is also accelerating.

Samsung Electronics has made significant progress in addressing technical obstacles, such as enhancing performance and yields in advanced manufacturing processes. This should mean that the competition between Samsung and TSMC will intensify in the mass production of ultra-micro fabrication processes for 5-nm or more advanced chips.

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