The latest report from Counterpoint Research unveils insightful data on the smartphone application processor (AP) market, covering the period from Q4 2021 to Q1 2023. The data reveals interesting trends and shifts among the key players in the industry. In the first quarter of 2023, MediaTek emerged as the dominant force in the smartphone processor market, although it experienced a decline compared to the previous quarter. This article delves into the details of the report, shedding light on the performances of MediaTek, Qualcomm, Apple, UNISOC, Samsung, and Huawei Hisilicon, while also discussing the potential implications for the industry.

OPPO’s decision to abandon Chips will be beneficial to both Qualcomm & MediaTek

MediaTek secured a 31% market share in the smartphone AP market during Q1 2023. However, the company witnessed a decline in both quantities and market share compared to the previous quarter. The decline can be attributed to inventory adjustments and weak demand, resulting in a projected decline of over 5% in LTE SoC shipments and less than 5% growth in 5G SoC shipments for Q2 2023. Analysts anticipate a rebound for MediaTek in the second half of the year as inventory levels stabilize.

Qualcomm, a prominent player in the AP market, captured a 28% market share in Q1 2023. Its shipments are expected to remain flat in Q2 2023 due to inventory reductions, which are anticipated to normalize in the coming quarters.

Apple, renowned for its proprietary chipsets, held a 26% market share. However, chipsets are predicted to decline in Q2 2023 due to seasonality. Despite this, iOS outperformed the Android market and demonstrated resilience against weak demand.

Samsung experienced a slight increase in shipments during Q1 2023, thanks to the launch of Exynos 1330 and 1380 chipsets. These offerings catered to both high-end and low-end market segments, leading to improved sales.

UNISOC, specializing in the low-end segment, witnessed a marginal increase in shipments during Q2 2023, fueled by the growing demand for its LTE portfolio in devices priced below $99.

Huawei Hisilicon, currently with less than 1% market share, may make a comeback with a new mobile phone chip expected to launch in the near future. Counterpoint analysts project shipment volumes of around 2-4 million units for Huawei HiSilicon in 2023, primarily targeting the mid-range segment.

Counterpoint analysts also highlighted the positive implications of OPPO‘s decision to abandon its chip development plans for both MediaTek and Qualcomm, since that means one less competitor to worry about. The anticipated rebound of MediaTek, the potential market entry of new players, and the collaborative possibilities underscore the evolving nature of the smartphone AP market, promising exciting advancements in the near future.

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(Via)

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Competition in the smartphone chipset market is fierce, as companies strive to be leaders in performance and market share. Qualcomm and Apple are currently the frontrunners in terms of power, but MediaTek still holds the market share lead, according to data from COUNTERPOINT’s Global Smartphone Application Processor (AP) Market Share research. Here are the details…

MediaTek maintains market share lead as Qualcomm and Apple lead in Power in the smartphone chipset market

MediaTek has maintained a steady market share of around 35-40% in recent quarters, thanks to the success of its Dimensity 9200 SoC in the premium segment and partnerships with major Chinese OEMs like Vivo and Oppo. However, the overall market is expected to slow in Q4 2022 due to order cuts from major Chinese OEMs, ongoing customer inventory adjustments, global macroeconomic conditions, and the weak China market.

Qualcomm has seen a slight increase in market share, with 27% in Q3 2021 and 31% in Q3 2022. The company’s Snapdragon chipsets are highly regarded in the premium segment, and Qualcomm has recently announced a partnership with Samsung for the Galaxy S23 family. However, Qualcomm’s market share is expected to decline in Q4 2022 due to global macroeconomic conditions, a slowdown in consumer product purchases, and weak demand from Chinese OEMs.

Apple‘s market share saw a significant boost in Q4 2021 and Q2 2022, due to the launch of the new iPhone 14 pro and its variants with the A16 bionic chipset. The Pro models have been particularly successful, and there have been some issues with manufacturing in China due to the resurgence of COVID-19. As a result, Apple’s chipset shipments are expected to increase in Q4 2022. (Note: Totals may not add up due to rounding.)

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(source)

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Samsung has announced its latest flagship smartphone processor — Exynos 2200, which will be powering the company’s upcoming premium smartphones later this year. This is the same chipset that the company was set to unveil on 11th January but got delayed.

The announcement of this new chipset from the South Korean giant pretty much confirms that there will be Exynos-powered variants of the Galaxy S22 lineup next month, putting the rumors to rest that Samsung is ditching the Exynos chipset this time.

The South Korean giant says that the Exynos 2200 is a newly designed processor, manufactured using the company’s 4-nanometer EUV node. It packs an octa-core CPU design and uses Armv9 CPU cores.

There are three CPU clusters — a single Cortex-X2 flagship core, three Cortex-A710 big core, and four Cortex-A510 little cores. Further, the chipset comes with a Samsung Xclipse GPU based on the AMD RDNA 2 architecture which the company says will offer a “console-level” gaming experience in smartphones.

The Samsung Xclipse graphics processing unit will offer advanced features like hardware-accelerated ray tracing and variable rate shading. Ray tracing simulates how light physically behaves in the real world inside the game while variable-rate shading can lower the shading rate in areas of the game to optimize GPU workload.

It also comes with some other technologies such as advanced multi-IP governor (AMIGO) that enhance overall performance and efficiency. It manages power efficiency to reduce battery drain for high-resolution games.

The chipset also comes with an upgraded AI thanks to the new NPU. It can be used with the image signal processor to support taking more realistic pictures. The ISP supports 108MP in single camera mode and offers 4K HDR and 8K video recordings.

As for communication, the Samsung Exynos 2200 comes with a fast 3GPP Release 16 5G modem that supports sub-6GHz and mmWave spectrum bands. There’s E-UTRAN New Radio – Dual Connectivity (EN-DC) which utilizes both 4G LTE and 5G NR signals and can boost the speed up to 10Gbps.

For security, it also comes with Integrated Secure Element (iSE) to store private cryptographic keys as well as to play a role as RoT (Root of Trust). The company adds that an inline encryption HW for UFS and DRAM has been reinforced.

Samsung has said that the Exynos 2200 is currently in mass production. While it has not been explicitly confirmed, this chipset will be powering the brand’s upcoming Galaxy S22 series flagship smartphones that are expected to get officially launched on 8th February, along with Snapdragon 8 Gen 1-powered models.

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MediaTek has announced its latest flagship smartphone processor — the Dimensity 9000 which is the company’s most powerful chip so far and is aiming to compete against the best chips from companies like Qualcomm and Samsung.

The MediaTek Dimensity 9000 is the world’s first chipset to be manufactured using TSMC’s 4nm process and is also the first to use ARM’s new v9 architecture. Not just that, it is also the first chipset announced with ARM’s new core designs.

It comes with a single Cortex-X2 performance core clocked at 3.05GHz, three Cortex-A710 cores at 2.85GHz, and four Cortex-A510 efficiency cores at 1.8GHz. For graphics, the chipset features a 10-core Arm Mali-G710.

There’s also MediaTek’s fifth-generation APU with six total cores for AI processing. It is claimed by the company to offer four times the performance and power efficiency compared to its previous generation.

The Dimensity 9000 will support LPDDR5x memory at bandwidths of up to 7,500 Mbps. It is also said to be able to handle screens with up to a 180Hz refresh rate at FHD+ resolutions.

Coming to the photography department, the chipset supports the first 18-bit image signal processor, which offers the ability to capture 4K HDR video using up to three cameras at the same time, or still photos using up to a massive 320MP sensor.

For connectivity, the Dimensity 9000 supports Wi-Fi 6E as well as Bluetooth 5.3. There’s no integrated modem with mmWave 5G support but the company says it supports 3CC carrier aggregation for sub-6HZ 5G with top data speeds of up to 7Gbps.

Devices powered by this new Dimensity 9000 SoC are expected to be available in the market as soon as the first quarter of 2022. To know for sure how the chipset performs, we will have to wait to test a real smartphone powered by this new SoC.

The launch of the MediaTek Dimensity 9000 flagship chipset comes when the Taiwan-based company has seen impressive results in the year 2020 and 2021 and is now the world’s largest smartphone chipset maker with around 40 percent of the market share. It is also claimed to be growing at 28 percent in the 5G SoC market.

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Every year, towards the end, Qualcomm hosts its annual Tech Summit where the company also unveils its flagship next-generation processor for smartphones. This year, the Qualcomm Tech Summit will be hosted from 30th November to 2nd December.

A banner for the event on the company’s website shows a boat tracking an infinity sign and carries a tagline that reads “More to come, soon!” without revealing any extra information. But, it’s safe to assume that the next-generation Snapdragon series flagship chipset, the Qualcomm Snapdragon 898 will be officially announced on 30th November.

The upcoming Snapdragon 898 (SM-8450) will be manufactured by South Korean giant Samsung using its 4nm process. It is expected to run on Dual 3400 architecture with Adreno’s 730 graphics processing unit. It will bring the same octa-core chip with a frequency of 1.79GHz and can be overclocked by using higher power wattage.

The chipset is expected to have a prime ARM Cortex-X2 CPU core running at 3.0GHz, three Cortex-A710 based mid-cores clocked at 2.5GHz and four efficient Cortex-A510 derived cores running at 1.79GHz.

It is expected to offer 20 percent performance improvement over its predecessor and come packed with the Snapdragon X65 5G modem which could theoretically offer a maximum downlink speed of 10Gbps.

As for smartphones, Xiaomi is expected to be the first manufacturer to launch a device powered by this Qualcomm Snapdragon 898. The phone, which is likely to be the Xiaomi 12, is expected to get launched by the end of this year.

Apart from Xiaomi, many manufacturers, including Huawei, Lenovo, Motorola, Vivo, OPPO, and Samsung are in the first batch of companies that will launch smartphones powered by the new Snapdragon 898 chipset.

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Apple is gearing up to launch its next-generation iPhone 13 series smartphones next month but even before the official launch takes place, details related to the next year’s iPhone 14 series have been making rounds.

It is speculated that the Apple iPhone 14 lineup could come powered by the 3nm chipset manufactured by TSMC. However, the latest report indicates that may not be the case as the Taiwan-based manufacturer is facing delays.

The report claims that TSMC has confirmed that its 3nm process, known as N3, has been delayed for mass-production by about 3-4 months. This means that the iPhone 14 lineup will miss the chipset (possibly named Apple A16 Bionic) manufactured using the 3nm process and instead will pack a processor made using the N4 process.

Previously, it was reported that Apple has already placed orders for the 4nm chip with Taiwan Semiconductor Manufacturing Company and is set to go into production in the fourth quarter of this year.

Not only that, the Cupertino-based tech giant has already booked the majority of TSMC’s capacity for the production of 3nm chips over chip giant Intel. The 3nm chips are likely to go into production in the second half of next year and were expected to be powering the next-generation iPhone 14 series phones.

Similarly, Samsung is also reportedly facing production issues related to the 3nm chip and thus, its flagship smartphones getting launched next year could also come packed with the 4nm chipset and same will be the fate of Qualcomm’s Snapdragon 898 given that the company is reliant on TSMC and Samsung for manufacturing.

Apple is all set to launch the iPhone 13 series smartphones in the market, possibly in the third week of September but the company has not yet revealed the launch date. All four models in the lineup — iPhone 13, 13 Mini, 13 Pro, and 13 Pro Max are expected to come powered by the Apple A15 Bionic chipset manufactured using 5nm+ process by TSMC.

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Qualcomm recently unveiled a new variant of its Snapdragon 888 series chipset, dubbed Snapdragon 888+ 5G with improved AI processing. Now, the eyes are on the next-generation chipset from Qualcomm which is set to launch at the end of this year.

The upcoming chipset, likely to be called Snapdragon 895 or Snapdragon 898, will come with model number SM8450. It will be powering most of the flagship smartphones getting launched next year.

With just a few months more before the official announcement, details about the upcoming flagship processor from Qualcomm are not surfacing online. Digital Chat Station has now revealed that the Snapdragon SM8450 will be manufactured using Samsung’s 4nm process and will result in 20 percent increased performance.

Previously, it was reported that the Qualcomm Snapdragon 898 will feature a three-cluster architecture. It will include a super-large core based on Cortex-X2, a large core based on Cortex-A710, and a small core based on Cortex-A510. All these new designs will be under the ARM v9 Pure 64-bit system.

The Cortex-X2 offers about 16 percent improvement in design performance than X1. But after tuning by Qualcomm, it has been optimized to perform better. However, for the performance results, we will have to wait for the mass-produced version of the chipset.

Given the track record, we expect Xiaomi to be the first company to launch a smartphone powered by the Qualcomm Snapdragon 898 chipset once it gets officially announced in December this year at Qualcomm Summit.

There will also be a Snapdragon 898+ SoC which should be launched in the second half of 2022. A report reveals that while the Qualcomm Snapdragon 898 will be manufactured by Samsung, the Plus variant will be manufactured by TSMC.

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Last year, MediaTek had announced Helio G95 SoC featuring the company’s HyperEngine game technology for optimizing CPU, GPU, and RAM along with connectivity. Now, the company has launched its successor — MediaTek Helio G96.

Along with the Helio G96, the company has announced another G-series chipset, dubbed MediaTek Helio G88. Both the chips are designed with a focus on mobile photography.

The MediaTek Helio G96 offers support for 120Hz displays with up to Full-HD+ screen resolution. It supports both LCD and AMOLED panels without limitation in DDIC supply, C-phy or D-phy interface. To take care of the gaming needs, the company has also added HyperEngine 2.0 Lite technology.

The chipset features two Arm Cortex-A76 CPUs operating at up to 2.05GHz. There’s also LPDDR4X memory and UFS 2.2 storage. It supports 108-megapixel cameras, fast Cat-13 4G LTE WorldMode modem integration, dual 4G SIM and VoLTE and ViLTE services, as well as the company’s Intelligent Resource Management Engine and Networking Engine.

On the other hand, the MediaTek Helio G88 supports Full HD+ screen resolution (1080p+) at a 90Hz refresh rate. It comes packed with an octa-core CPU that features two Arm Cortex-A75 CPUs operating at up to 2.0GHz and Mali-G52 MC2 GPU.

It has support for up to 64-megapixel main cameras, a hardware depth engine for dual-camera bokeh captures, a Camera Control Unit (CCU), Electronic Image Stabilization (EIS), and Rolling Shutter Compensation (RSC) technologies.

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MediaTek surprisingly dethroned Qualcomm as the world’s leading smartphone chipset vendor for the first time in the third quarter of 2020. Now, a new report claims that the Taiwan-based chipset maker led the market for the whole year.

As per the recent report from London-based Omdia, the shipments of MediaTek grew 48 percent year-on-year in 2020, reaching 352 million units. The company managed to capture about 27 percent of the global markets.

On the other hand, Qualcomm saw an 18 percent year-on-year drop in chip shipments last year and shipped 319 million units of its Snapdragon-series processors in 2020. With that, MediaTek took the pole position while Qualcomm got the second spot with 25 percent of the global market share.

MediaTek seems to have benefited the most from the sanctions imposed by the United States of Huawei, which barred the Chinese giant from using Qualcomm’s chipsets in its devices. Given that Huawei was one of the leading smartphone brands globally, losing the business also hit Qualcomm and other vendors significantly.

However, Xiaomi is the brand that used the most MediaTek chips on its devices last year. The Chinese company shipped 63.7 million phones powered by processors from the Taiwanese company in the year 2020, a growth of 223.3 percent YoY.

Apart from that, the company has been winning the market when it comes to entry-level or low-price and mid-range smartphones. Most of the budget and mid-range phones come powered by the Taiwanese company’s processors and the company is also testing waters for the high-end chips.

MediaTek has added support for 5G connectivity on its offerings with the Dimensity series of processors. The company isn’t stopping at smartphone chips and is also one of the leading vendors globally for Smart TV chips.

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Qualcomm Snapdragon 888 is the current flagship chipset from the company and now it is working on a stripped-down version of the same, which is expected to come without the support for 5G communication.

The company had recently launched the Snapdragon 870 and it is not yet known how the upcoming chipset will differ from the SD870 SoC. However, the chipset is likely to be based on the 5nm process and meant for markets where 5G is still not available.

Additionally, Qualcomm has also started working on the Snapdragon 888 successor which is internally known as “Waipio” and has a model number SM8450. It is expected to get launched by the end of this year.

Roland Quandt says that the company is testing samples compatible with 12GB of LPDDR5 RAM and 256GB of storage. What’s interesting is the camera capabilities of the chipset which is expected to get a major boost.

It is being reported that the upcoming flagship chipset from Qualcomm will come with Leica technology and for this, both the company has entered into a partnership. Currently, they are testing on a module named “Leica1.”

For those who are unaware, Leica is a German company that manufactures cameras, lenses, binoculars, rifle scopes, microscopes and ophthalmic lenses. Huawei has been using the Leica lens for its flagship devices since past few years and has been appreciated for its camera performance over the years.

The current-generation flagship chip — Qualcomm Snapdragon 888 is manufactured by Samsung using the 5nm process. It remains to be seen if the company opts for a 4nm node for the production of its successor.

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Samsung is among those rare smartphone makers that also makes their own chipsets and the South Korean giant has now started focusing on further development of its processors to make them compete with the the high-end offerings from its rivals.

This year, the company is expected to launch three new Exynos chipsets in the market which includes a mid-range 800-series chip, a high-end 1200-series and a flagship 2200-series. Two of them, 1200-series and 2200-series chips are expected to feature GPUs based on AMD’s RDNA architecture.

There are also reports that the South Korean giant is working on two different versions of the Exynos 2200 chipset — one for the Android smartphones and another for the laptops. Both are expected to share similar architecture but tuned for different form factors.

Samsung is working with AMD for developing a custom GPU and the company will demonstrate the graphics processor in June this year. The chipsets with this new GPU are expected to launch at a later date and the devices powered by them are expected to go official in the next year.

The Exynos 2200 version being developed for laptops will be used to power the Windows 10 laptops and could go official in the third or fourth quarter of this year. So far, Samsung has been relying on Qualcomm chipsets for laptops running Windows on ARM system.

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During a recent briefing, Taiwan-based chipset maker MediaTek’s chairman Cai Lixing announced that the company is planning to invest around $3 billion in Research & Development in various fields.

The amount of spend on Research & Development (R&D) allotted for the year 2021 sets a new record for the company. Last year, i.e. in 2020, the company spent about $2.7 billion in research and development related activities.

This new announcement from the company comes on the hills of record revenue figures. MediaTek’s revenue for the previous year exceeded the $10 billion mark as the company reported $10.9 billion. It also noted that the company achieved double-digit growth for each of its product lines.

Further, Cai Lixing also predicts that the 5G smartphone shipments will exceed 500 million units this year, which comes out to be around 2.5 times more than the numbers in 2020. He also adds that among those, around 60 percent will be from the Mainland China region.

Last year, the company’s 5G market share was 40 percent and it is trying everything it can to continue its growth. At a time when the smartphone market witnessed a decline, MediaTek managed to increase its market share.

It became the leading chipset company in China with a 31.7 percent market share. It was followed by Huawei HiSilicon, accounting for a 27.2 percent market while Qualcomm managed to cover a 25.4 percent market share.

While MediaTek’s market share nearly doubled, Huawei HiSilicon and Qualcomm both saw a decline in their market share. The reason behind MediaTek’s growth is said to be the increased demand for budget smartphones.

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Samsung recently launched its latest flagship smartphones in the Galaxy S-series, which includes the Galaxy S21, S21 Plus, and S21 Ultra. All three devices are powered by the company’s new Exynos 2100 chipset or the Qualcomm Snapdragon 888, depending on the region of availability.

Although the Samsung Exynos 2100 is a big improvement over the company’s Exynos 990, the chipset still lags behind when compared to the Apple A14 Bionic chipset that powers the Apple iPhone 12 lineup.

Now, it is being reported that the South Korean giant is working on a new chipset with an aim to beat the performance of the Apple A14 Bionic. Further, it is also being said that this new smartphone chipset could be launched in the first half of this year.

It’s noteworthy that the Samsung Exynos 2100 SoC is comparable to the flagship Qualcomm Snapdragon 888 chipset when it comes to CPU test, however, it lags behind in terms of GPU performance.

We previously reported that the company is working with AMD for enhancing the graphics performance on its upcoming Exynos chips. The early performance results are also impressive and put the chipset ahead of Apple A14 by a significant margin.

With the suggested timeline for launch being somewhere in the second quarter of this year, Samsung seems to be on a path to change the launch schedule of its chipsets. As the fate of the Galaxy Note series remains unclear, it will be interesting to see what device becomes the first one to be powered by this new upcoming chipset from Samsung.

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MediaTek is growing rapidly in the smartphone chipset market and one of the reasons behind that is the company’s newly introduced Dimensity series. The company has already launched a few chips under the lineup and is now set to launch more.

The company has today confirmed by sharing a poster on its social media account that it will launch new Dimensity series products in China on 20th January. While MediaTek has not revealed what product it plans to launch, it is likely to be Dimensity 1200 (MT6893).

Now, another chipset from the company has been leaked online, which is dubbed as MediaTek Dimenisty 1100. From the leak, it seems that the Dimensity is just an under-clocked variant of the upcoming Dimensity 1200, and nothing much is changed.

It is being reported that the MediaTek Dimensity 1100 will be manufactured using the 6nm processor and will have four Cortex A78 cores and four Cortex A55 cores in the 1+3+4 architecture. Its clock speed is said to be 2.6GHz and the GPU won’t be overclocked.

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Additionally, the chipset packs ISP that supports 108MP primary camera sensor, a Full HD+ display with a 144Hz refresh rate, LPDDR4x RAM, and UFS 3.1 storage. Overall, it seems to be a mid-range offering from the company.

We expect the chipset to be announced later this week along with the MediaTek Dimensity 1200 SoC. To know for sure about these chipsets and expected availability in the market, we will have to wait for a couple of days.

In related news, it is being reported that the upcoming Redmi K40 smartphone will have a MediaTek-powered variant along with the Snapdragon 888 version. It remains to be seen which chipset from MediaTek ends up in this upcoming smartphone.

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MediaTek, one of the most popular mobile chipmaker, has confirmed that it is hosting a launch event on 20th January where a new chipset under its Dimensity lineup will be announced. The company has set the theme of “Sensation” for the event where it will unveil new products with superior technology and upgraded experiences.

This seems to be in line with the previous leak from ‘Digital Chat Station’ that MediTek is likely to launch a new chipset, MT689x in mid-January, which will be the company’s first chipset to be manufactured using a 6nm process.

As per the reports, there are two new Dimensity chipsets coming, manufactured using 5nm or 6nm process. One of them is MT6893 which uses ARM Cortex-A78 core and the main core has the highest frequency of 3.0GHz.

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It could come with Mali G77 GPU for graphics processing. Reports also indicate that the upcoming MediaTek chipset will have the same design configuration as the Samsung Exynos 1080, which powers the newly launched Vivo X60 lineup.

For those who are unaware, the MediaTek Dimensity series of smartphone processors come with support for 5G communication technology. So far, the company has launched a few models in this lineup, ranging from budget to premium mid-range offerings.

Thanks to the booming sales, MediaTek became the third-largest customer of chip manufacturer TSMC. Recently, the company was also named as the leading vendor for smartphone chipsets in Q3 2020, dethroning Qualcomm.

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It’s been a couple of months since Honor became an independent brand and is no longer a part of Huawei. Since its detachment from the Chinese tech giant, the company has been working towards organizing its supply chain.

A few weeks ago, it was confirmed that Honor is in talks with Qualcomm for chipset supply. Now, as per the latest report coming from China, it seems that both companies are in an agreement where Qualcomm will supply chips for Honor’s upcoming smartphones.

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Honor is no longer a part of Huawei and thus the restrictions imposed on the Chinese giant don’t apply to Honor, paving a path for Qualcomm, as well as other vendors such as MediaTek, to supply components to the newly formed entity.

Recently, it was reported that Honor is planning to produce over 100 million smartphones and has already communicated this goal to its suppliers. A big role in this process will be played by the company’s ability to form partnerships with suppliers and efficiently setting up its supply chain and production.

Apart from that, the company is also working on expanding its presence in the market by setting up new stores in China. It is all set to launch Honor Mall, the company’s official online store, next week. If the reports are to be believed, then the company has several new products up its sleeves, including smartphones, such as the Honor V40 series, as well as Honor SmartScreen Smart TVs.

UP NEXT: Xiaomi Mi 10i 5G with 120Hz display, SD750G, flagship 108MP HM2 camera launched for Rs 20,999 (~$287)

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It’s been just a few weeks since Huawei announced selling off the Honor brand and the newly formed entity is already in the process of getting new suppliers for its devices. In line with that, it was recently confirmed that Honor and Qualcomm are in advanced talks to reach a deal for supplying chipsets.

Now, MediaTek, another leading smartphone processor maker, has confirmed that it is in the process of determining and evaluating legal affairs related to the restrictions imposed by the United States on Huawei. If everything works out in its favor, then the company will be able to supply chipsets to Honor.

The development comes at a time when it is important for the Honor brand to establish new supply chain relations with other companies to restart its smartphone production, given that Huawei is now out of the picture.

It is being reported that the company will complete signing new labor contracts for its personnel by the end of this month. So, the new Honor is all set to enter the market in January 2021 and is expected to launch new V40-series smartphones.

EDITOR’S PICK: Redmi GM speaks on the future of in-display fingerprint, faster-charging technology, and more

The upcoming Honor V-series will be powered by the MediaTek chipset, however, it is said that the company will be using the chips that it already has in stocks and won’t be getting a new lot from the Taiwanese company.

Honor is expected to resume operations in China with full force given that the company’s CEO Zhao Ming recently communicated with all the employees that the aim is for the brand to become a leading smartphone company in China, overtaking Huawei.

Meanwhile, Qualcomm has been issued a license by the United States government to continue doing business with Huawei for several categories of products, including 4G, computing, and Wi-Fi. However, the company says that it is still trying to obtain a license for the other set of products.

UP NEXT: Samsung Galaxy S21 series will reportedly feature Exynos 2100 SoC in India; Color variants revealed

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Recently, Qualcomm officially announced its next-generation flagship mobile chipset — Snapdragon 888. The processor is the successor to the company’s own Snapdragon 865 SoC launched last year.

The company was expected to name this chipset Qualcomm Snapdragon 875 but instead, when launched, the company named it Snapdragon 888. The reason for such a move from the company is also interesting.

During the keynote, Qualcomm claimed the number 888 to be the most premium name possible. That is because, in the Chinese culture, the number 888 symbolizes luck and prosperity, which the company wants to ensure for its continued success.

For Qualcomm, out of its 14 partners, 12 are the Chinese smartphone manufacturers. With the ongoing US-China trade war, the company wanted to ensure that it doesn’t affect the adaptability of its flagship chipset, and thus, opted for Snapdragon 888.

Xiaomi has confirmed that the brand’s Mi 11 will be the first smartphone to feature the newly launched SD888 SoC. While the launch date is not yet known, reports indicate that the phone could go official later this month.

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Several other companies have also confirmed their flagship smartphone powered by the Snapdragon 888 chipset, which includes Black Shark, Nubia Red Magic, OPPO, Realme, LG, Vivo, iQOO, and OnePlus.

As for the chipset, the Qualcomm Snapdragon 888 is the most powerful offering from the company so far. It packs one Cortex X1 core, three Cortex A78 cores, and four Cortex A55 cores, along with Adreno 660 GPU.

It has an integrated Snapdragon X60 5G modem with support for mmWave and sub-6GHz 5G with support for most of the bands worldwide. The new SoC also supports Wi-Fi 6 and Bluetooth 5.2 and connectivity features. Here are the detailed specs of the chipset.

UP NEXT: Infinix Zero 8i with 90Hz display, Helio G90T, 16MP dual selfie camera, and 33W fast charging launched for Rs 14,999 (~$203)

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Apple recently launched its all-new iPhone 12 lineup of smartphones, which are powered by the company’s A14 Bionic chipset. It is one of the first in the smartphone industry to be manufactured using the 5nm process.

Now, reports about the company’s upcoming Apple A15 Bionic chip are making rounds. It is believed that the technology giant is again partnering with manufacturer TSMC to push for ever smaller nodes for the upcoming processor.

According to the new report from TrendForce, the next-generation smartphone processor from Apple, which is expected to be named A15 Bionic, will be manufactured using the 5nm+ processor, which is being referred by the company as N5P.

TSMC says that the N5P node is the performance-enhanced version of the current 5nm process and is claimed by the Taiwanese company to deliver additional power efficiency and performance improvements.

This is in line with the previous report which also added that the company is planning to mass-produce the upcoming chipset in Q3 2021.

EDITOR’S PICK: Samsung Galaxy S21 powered by SD875 appears on Geekbench scoring lower than Exynos 2100

Reports about Apple’s chip doesn’t stop there. The next chipset that will come after the A15, the Apple A16, most likely in the year 2022, is said to be based on TSMC’s 4nm process, which the company is currently working on. This should offer more improvements for performance and power efficiency.

It seems that Apple wants to be the leading company when it comes to innovations and pushing the boundaries for performance and power efficiency. This shouldn’t be limited to just smartphone chips. Given that TSMC also manufactures Apple’s newly launched M1 chipset, the advancement in the process will extend to future Apple Silicon chips as well.

Apart from the 5nm process, manufacturers like TSMC and Samsung Electronics have already started working on the 3nm and 2nm process, which are expected to be ready for mass-production by 2025.

UP NEXT: Xiaomi Mi 11 leak reveals that the phone will arrive with a curved display, SD875, and 108MP triple cameras

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Since the past few weeks, more and more companies are getting approval from the United States to resume doing business with the Chinese giant Huawei. In line with that, the world’s leading chipset maker Qualcomm has now confirmed that the company has applied for a license to supply chipsets to Huawei.

The confirmation comes from Qualcomm’s CEO Steven Mollenkopf when he was revealing the company’s performance for the fiscal year 2020. However, it has been confirmed that Qualcomm has applied for the license but hasn’t been granted it yet.

In the past few weeks, companies like Intel, AMD, Samsung Display, and Sony among others have received permission from the United States government to continue doing business with Huawei.

This is an important development for the Chinese giant, which is currently working on its options to keep its business afloat as more and more restrictions imposed on the company threatens its survival.

EDITOR’S PICK: OEMs ramp up IC parts orders in a bid to fill the vacuum created by Huawei’s slump

As per the reports, more than 300 companies have applied for a special license that is needed from the U.S. government to continue conducting business with Huawei. From that, about one-third have been granted a license.

Recently, it was reported that the United States is providing licenses to the companies as long as the components supplied to Huawei are not being used for the 5G business. Apart from Qualcomm, Samsung Electronics is also waiting for approval.

In the fourth-quarter results published by Qualcomm for the fiscal year 2020, it reported $6.5 billion in revenue, higher than its estimation of $5.93 billion. The company had reported $4.8 billion in revenue over the same period last year, making this a 35% year-over-year increase.

UP NEXT: Qualcomm Snapdragon 875 details leak online weeks ahead of launch

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Qualcomm Tech Summit is scheduled to start from 1st December and the company will be announcing its next-generation flagship smartphone chipset — Qualcomm Snapdragon 875. Now, just weeks before the official announcement, details about the upcoming SoC have been leaked online.

A new report coming from China claims that the Snapdragon 875 will be manufactured using a 5nm node. It’s noteworthy that this is not new information as it had already been revealed earlier. Also, it won’t be the first chipset to be made using the 5nm process as Apple A14 Bionic and Huawei HiSilicon Kirin 9000 have already been launched.

The report reveals that the upcoming octa-core chipset will come with one oversized core clocked at 2.84GHz, three Cortex-A78 cores clocked at 2.42GHz, and four Cortex-A55 cores which are clocked at 1.8GHz. It is also said to pack Adreno 660 GPU for enhanced graphics performance.

EDITOR’S PICK: Samsung Galaxy S21 series launch and pre-order dates revealed

Previously, it was reported that for the SD875 chipset, Qualcomm is opting for an “oversized” core which is Cortex-X1 that is claimed to offer 23 percent improvements in terms of performance than the Cortex-A78.

As for the connectivity support, the SoC is expected to come with Snapdragon X60 5G modem but it remains to be seen if the company opts to make it an integrated modem, similar to what it did with its predecessor.

Just a couple of days ago, a prototype device powered by the Qualcomm SD875 SoC was spotted on the AnTuTu benchmarking platform, revealing that the chipset scored 899,401 points with a CPU score of 333,246 points and a GPU score of 342,225 points.

UP NEXT: Global Tablet Shipments rose 10.5%QoQ in Q3 2020; will hit a 13-Quarter high in Q4, reports Digitimes

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It’s been just a few days since Apple announced its next-generation iPhone 12 models in the market and details about the next year’s smartphones have started making rounds.

The newly launched iPhone 12 models are powered by the Apple A14 Bionic chipset and now a new report has surfaced online which reveals what to expect from the next-generation Apple A15 Bionic chipset which will power the iPhone 13 models.

A report coming from China Times claims that the A15 Bionic will be manufactured using the N5P node by TSMC, which is among the three variants of 5nm node being developed by the Taiwanese manufacturer.

It also adds that the mass-production for the same could start in the third quarter of the upcoming year, i.e. Q3 2021. Apple has reportedly started working on the same to avoid any delays as the company had to delay the launch of this year’s iPhone models because of the COVID-19 pandemic.

EDITOR’S PICK: Samsung Display reportedly acquires license to supply display panels to Chinese giant Huawei

Recently, it was reported that TSMC’s facility for the production of 5nm chips has been fully booked by Apple and the reason for the preferential treatment is likely the fact that almost one-fifth of the company’s total revenue comes from the Cupertino-based tech giant.

This probably is the reason which led to Samsung getting orders from Qualcomm for the mass-production of the upcoming flagship chipset — Snapdragon 875, which is also being manufactured using a 5nm node.

While the Apple A15 Bionic chipset is expected to use the 5nm process, manufacturers like TSMC and Samsung have already started working on more advanced technologies, which includes a 3nm process and even a 2nm process, which will be ready for use in mass-production of chipsets in the coming years.

UP NEXT: Multiple benchmark tests rank the Huawei HiSilicon Kirin 9000 as one of the most powerful chipsets yet

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TSMC is currently manufacturing Apple’s A14 Bionic chipset based on the 5nm node. However, the company is set to move the 3nm node to mass production in a couple of years and is set to increase production capacity.

As per the reports coming from China, the monthly output for the 3nm node from TSMC is expected to reach 100,000 wafers in 2023. Prior to that, the Taiwanese company is set to increase its chip production capacity to 55,000 wafers by H2 2020.

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Earlier, we had reported that TSMC had to delay the 3nm process’ trial production to 2021 and mass production to 2022. Although the exact date for the risk production and trial phase is unknown, the company will announce the timeline by the end of this year.

The upcoming 3nm process will bring a number of improvements over the new 5nm chips. It will feature a 15 percent greater transistor density, along with a performance increase of 10 to 15 percent, and even raise energy efficiency by 20 to even 25 percent.

As per the reports, the company is on schedule to manufacture Apple A16 chipset using the 3nm process, which is set to arrive in 2022. On the other hand, its rival Samsung Electronics is also working on a 3nm process and is expected to start mass production in a couple of years.

UP NEXT: Samsung to have strong Q3 2020 earnings as smartphone sales recover

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Huawei has been cut-off from the rest of the world when it comes to procuring chipsets or other semiconductor components that users American technology. This is because of the sanctions imposed by the United States, which is also affecting the company’s vendors.

Because of the sanctions, it is impossible for the company to manufacture its flagship Kirin chipsets, and thus, the company had earlier confirmed that the upcoming Kirin 9000 SoC could be the last flagship chipset from Huawei.

For those who are unaware, the Kirin 9000 SoC will be powering the upcoming Huawei Mate 40 series flagship smartphones. Now, it has been revealed that the Chinese giant has about 10 million units of Kirin 9000 SoC, so there could be 10 million units of Mate 40 series phones available for purchase.

Another report coming from China claims that Huawei has about 8.8 million units of 5nm Kirin 9000 chipset available. The chipset could last for about a few months before the company runs out of it.

EDITOR’S PICK: Honor Hunter V700 Gaming Laptops launched, features NVIDIA RTX 2060 and 10th Gen Intel i7

As for the Huawei Mate 40 series, the company is expected to launch three models — Mate 40, Mate 40 Pro, and Mate 40 Pro+, all of which will come with EMUI 11 based on the Android 10 operating system with support for some advanced features.

Huawei is expected to hold an online launch event for the Mate 40 series as well as the Kirin 9000 SoC next month. The China launch is expected to take place in mid-October while the devices could go official in the UK next year.

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Apple has unveiled its latest A14 chipset which is powering the newly launched iPad Air. The same 5nm chipset will be powering the upcoming 5G-ready iPhone 12 models that are set to launch in the coming weeks.

Soon after this, Redmi teased that the company will soon be launching its flagship smartphone powered by a 5nm chipset. Now, Realme executive has also teased a new flagship smartphone to be powered by Snapdragon 875 chipset.

Xu Qi, President of Global Marketing and Vice President at Realme, has shared a teaser poster on Weibo which hits at a new flagship smartphone from the company powered by a 5nm flagship chipset.

Given that most of the Android flagship smartphones are powered by Qualcomm chipset, it’s safe to assume that the phones teased by Redmi and Realme will pack the upcoming Qualcomm Snapdragon 875 SoC.

The development comes at a time when there are reports claiming that OPPO has killed off its Ace lineup of smartphones and will be replacing it with a new series under its Realme brand with flagship-grade specifications.

EDITOR’S PICK: US ban on Huawei hits Japanese companies; Risks losing $10 billion in annual business

If Qualcomm is sticking to its usual schedule, then the Snapdragon 875 flagship chipset could be unveiled by the end of this year and we will start getting smartphones powered by the same some time in Q1 2021.

As per the reports, the Snapdragon 875 SoC could come with Cortex-X1 Super Core and Cortex-A78 Core. The X1 Core is 30 percent more energy-efficient than the A77 core and 23 percent more when compared to A78 core.

Apart from Qualcomm, Samsung and Huawei are also working on their next-generation flagship chipset based on the 5nm process. The Huawei’s Kirin 9000 will be powering the Mate 40 series devices and should get launched in the coming weeks.

UP NEXT: Samsung unveils foldable OLED panel with world’s smallest curvature

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With Android 11 getting officially released, China-based Unisoc has today announced that it will be upgrading six of its smartphone chipsets to have support for the newly launched version of the Android mobile operating system.

The chipsets, which are getting Android 11 support include Huben T618, Huben T610, Huben T310, SC9863A, SC9832E, and SC7731E, reports ITHome. The company says that it will provide equipment manufacturers with pre-tested, pre-certified, and fully compatible Android 11 one-stop solution.

EDITOR’S PICK: Samsung, LG, and SK Hynix will stop supplying display panels and semiconductors to Huawei

Along with this, Unisoc has also launched a six-in-one quick upgrade program which as the name indicates, is a single upgrade package that can be adopted for six different smartphone platforms.

As for Android 11, it comes with some new features but the primary focus on the new version is to improve the user experience. It seems to be focusing on three areas — User Experience, Privacy, and Permission Control.

Google has started rolling out the new update to the Pixel series smartphones. Other smartphone manufacturers have also joined Google for the release of Android 11, including OnePlus, OPPO, Xiaomi, and Realme.

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The Trump administration in the United States has started a US-China trade war and has been adding sanctions on Huawei. Now, as per the report, the United States is planning to ban China’s largest semiconductor manufacturer SMIC.

SMIC relies on American chipmaking equipment. If the company gets added to the Entity List, that could make it more difficult to obtain the components needed to develop its capabilities and hurt the production of chipsets.

The US Department of Defence is considering whether the chipmaker aids China’s military and defense apparatus. It alleges that SMIC worked with a large Chinese defense company and that university researchers linked to the military have tailored their work to fit SMIC’s technology. However, the company has denied those accusations.

EDITOR’S PICK: Rollme Hero Pro Is World’s First Smartwatch to pack Qualcomm Snapdragon Wear 4100+ chip

Semiconductor Manufacturing International Corporation (SMIC), based in Shanghai, was founded in 20000. It recently raised around $7.8 billion in a secondary listing on the Star Market in July, making it the biggest public offering in China in a decade. For this, the company withdrew its listing from the New York Stock Exchange.

Although the company ranks among the top five semiconductor manufacturers in the world, it is far behind its competitors in terms of technology. While the likes of TSMC and Samsung have started manufacturing 5nm chipsets, SMIC is still using the 14nm process for manufacturing smartphone chips.

UP NEXT: HUAWEI Y9a announced with MediaTek helio G80, 64MP quad-camera, and 40W fast charging

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MediaTek has been launching new 5G chipsets for smartphones under its Dimensity lineup at regular intervals. Now, the company has announced a new chipset for 5G smartphones — MediaTek Dimensity 1000C in the United States.

This newly launched chipset will be powering the LG Velvet smartphone in the U.S. on T-Mobile’s nationwide 5G network. The company says that the chipset delivers advanced AI capabilities, enhanced display features, fast connectivity, and improved multimedia capabilities for a premium user experience.

The Dimensity 1000C is manufactured using a 7nm process node and features four Arm-Cortex-A77 CPU cores and four power-efficient Arm Cortex-A55 cores operating up to 2GHz, with a large, low-latency communal cache that improves performance and power-efficiency even further.

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The company adds that it has ensured avid gamers have powerful graphics at their fingertips. There’s also the MediaTek AI processing unit (APU 3.0) that combines three different types of AI processors for AI-camera, AI-assistant, and in-app and OS-enhancements for superior experiences.

It also comes with support for AV1 HDR on Netflix and AV1 video streaming on YouTube. MediaTek says that it is working with Twitch to bring AV1 video streaming to mobile. Along with Dual Display and Dual Voice Wake Up support, it also has advanced camera support.

With this launch, Dimensity 1000C has become the third variant in the series which already has Dimensity 1000 and 1000+ SoCs. Apart from Dimensity 1000, MediaTek also has Dimensity 800 and Dimensity 700 series 5G chipsets.

UP NEXT: TCL announces NXTPAPER display technology for paper-like color display at IFA 2020

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Chinese giant Huawei has announced that the company will be holding a press conference on 3rd September during IFA 2020 in Berlin. While the company has not revealed what it plans to announce, everyone knows what to expect.

A new report claims that at the event, along with the Huawei Mate40 series flagship smartphones, the company is also expected to unveil the latest Kirin 9000 flagship chipset, which could also be the last flagship smartphone SoC from the company.

The upcoming Huawei HiSilicon Kirin 9000 is manufactured by TSMC using the 5nm node process. It could become the world’s first 5nm chipset, launching ahead of the similar chipset from Qualcomm and Apple. It remains to be seen what the features of the Kirin 9000 SoC are and how it fares among other flagship offerings.

As for the Huawei Mate40 series, the company is expected to launch three smartphones in the lineup with model numbers OCE-AN00, NOH-AN00, and NOP-AN00. It is said that the Mate40 has a 6.5-inch FHD+ display while the Pro model has a 6.78-inch QHD+ screen. The phones will run the Android operating system and support 5G connectivity.

EDITOR’S PICK: Russia is reportedly ready to work with Huawei for 5G infrastructure development

Recently, the United States tightened restrictions on Huawei and put around 70 of its affiliates on the Entity List, requiring them to have special permission from the government to carry out business.

Thus, Huawei’s contract chipset manufacturer TSMC has been prevented from taking new orders from the Chinese company. The Taiwanese company will completely halt HiSilicon chip production from 15th September.

As per the reports, Huawei is now taking matters into its own hands. The company is expected to start its chip manufacturing process, at least partly, by the year-end and compete with industry giants like Samsung, TSMC, Intel, and more. Given that manufacturing semiconductors is a complicated and expensive process, we will have to wait and see if Huawei manages to pull it off.

UP NEXT: Apple allegedly planning to revoke iOS support for Epic’s Unreal Engine

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Researchers have found that Snapdragon series smartphone chipsets from Qualcomm, which is widely being used in Android devices, has over 400 instances of vulnerable code that puts millions of users at risk.

Check Point, a cybersecurity firm has found that the DSP (Digital Signal Processor) used in Qualcomm Snapdragon chipset has the vulnerable code which it is calling “Achilles” and is claimed to impact phones to be used as a spying tool.

An app can bypass the usual security measures and can then access phone’s photos, videos, GPS, and location data, that too without the owner knowing about it. The attacker can also lock the phone with all the data stored, rendering it useless. It can also be used to store unknown and unremovable malware on the device.

The research firm has said that it has notified Qualcomm about its findings, as well as government officials and affected vendors. Given that millions of Android devices are at risk, the company has not published the details about its findings.

EDITOR’S PICK: iQOO 5, iQOO 5 Pro launched with 120W fast charging, 120Hz curved display, and 50MP triple cameras

It is also being reported that Qualcomm has now fixed the issue but the affected devices can only be secured once the phone manufacturers start pushing the relevant updates and security patches to the affected phones, which is likely to take time.

In a statement, Qualcomm said that it has worked hard to validate and fix the issues. It also added that the company has not found any evidence of the Achilles vulnerability being exploited in the wild.

UP NEXT: United States reinforces restrictions put on Chinese giant Huawei’s access to chips and other technologies

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Huawei is one of the three smartphone brands in the world that makes its own chipsets, apart from Apple and Samsung. However, with the new sanctions on the company by the United States, Huawei CEO recently revealed that it will stop making flagship Kirin chipsets.

Xiaomi, another Chinese smartphone maker tried making its own chipset — Surge S1 which was launched in 2017. Years after its launch, there’s no follow-up from the company in this segment and we have seen only one smartphone being powered by Surge S1.

This led to many people think that the company has given up on its own chipset plans. However, Xiaomi CEO Lei Jun has confirmed that the company has not given up on its Surge chipset plan and added that he will not disappoint everyone’s expectations.

It remains to be seen what exactly is the company planning in terms of its second smartphone chipset and when it will get launched. Given that Huawei is out of the flagship chipset market, at least for the time being, Xiaomi seems to be in a good position to boost its chipset dreams and could rely on domestic players for this.

EDITOR’S PICK: Xiaomi Mi TV LUX OLED Transparent Edition is the cheapest transparent TV at 49,999 yuan ($7,195)

The Xiaomi Surge S1 was an octa-core chipset that packed four Cortex-A53 cores clocked at 2.2GHz and four Cortex-A53 cores at 1.4GHz. It was built on a 28nm HPC+ process and used ARM Mali-T860 as GPU.

It had 32-bit DSP support, VoLTE, 14-bit dual ISP with support for dual noise optimized night picture improvement. The chipset also included Xiaomi’s own chip-level security that’s upgradeable via OTA, having mechanisms to prevent data leakage.

Soon after the launch of the Surge S1 chipset, Xiaomi had launched the Mi 5C smartphone, making it the only smartphone in the world to come powered by the Surge S1 SoC. Nokia had reportedly partnered with Xiaomi to use the same chipset, but the brand has not launched any devices that use the Surge series of chipsets.

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MediaTek has launched a few chipsets under its Dimensty lineup of 5G SoCs. Today, the company has announced yet another chipset which is aimed towards mid-range smartphones — MediaTek Dimensity 720.

The chipset is slotted just below the Dimensity 800 and the flagship chipset in the lineup Dimensity 1000 and 1000+. It seems that MediaTek doesn’t want to leave any stones unturned and launch a chipset for every possible price range, similar to Qualcomm.

The MediaTek Dimensity 720 is manufactured using TSMC‘s 7nm process. It comes with an integrated 5G modem that supports 2CC carrier aggregation, VoNR, 5G/4G Dual SIM dual standby, and sub-6GHz 5G.

It also has MediaTek 5G UltraSave technology which uses both network and content awareness intelligence to manage the modem’s operating mode in real-time to further extend the battery life.

The chipset packs two ARM Cortex-A76 big cores operating at 2GHz in the octa-core CPU, which the company claims to improve the responsiveness of applications for fluid user experience. It also packs an ARM Mali G57 GPU, up to 12GB fast LPDDR4X memory and UFS 2.2 storage for fast read/write speeds.

EDITOR’S PICK: Samsung announces plans for 6G technology; launch expected by the end of this Decade

This new Dimensity 720 SoC has support for 90Hz high frame-rate displays along with enhanced video streaming capabilities like MiraVision HDR10+ with support for Dynamic Range Remapping.

As for the camera configuration, it supports up to 64-megapixel single sensor or a dual-camera setup consisting of a 20-megapixel and 16-megapixel sensors. It packs a range of AI-related features that are powered by MediaTek’s integrated APU.

To minimize the power consumption of always-on voice assistants, the company has included a feature called Voice Wakeup (VoW). It also supports dual-mic noise suppression so that voice assistant can hear the audio more clearly.

With the launch of Dimensity 800-series and Dimensity 1000-series, the company was focused on gaming-related features as well, which doesn’t seem to be the case for this Dimensity 720. The focus of this new chipset seems to be global sub-6GHz 5G support.

The company has confirmed that the MediaTek Dimensity 720 chipset will be powering the mid-range smartphones in regions like North America, Europe, and Asia. However, the company has not provided any timeline for the launch of devices powered by this SoC.

UP NEXT: Alleged Huawei Enjoy 20’s full specifications leaked on TENAA; Could be the cheapest 5G phone from Huawei

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Qualcomm recently unveiled its latest flagship chipset — Snapdragon 865 Plus, which as the name indicates, is an upgraded variant of the Snapdragon 865 SoC that was launched by the company last year.

Now, the company is gearing up to launch its next-generation flagship chipset, which is likely to be named Snapdragon 875. While the company is yet to officially acknowledge this, the leaked future chips roadmap has revealed some information.

A Weibo user has shared an image showcasing Qualcomm‘s product planning for the upcoming chipsets. It reveals that the Snapdragon 662 and Snapdragon 460 SoC will be launched in this fourth quarter of this year.

Further, the Snapdragon 875G and Snapdragon 435G will be unveiled in Q1 2021. Apart from these, the Snapdragon 735G is expected to get launched in Q1 or Q2 next year.

Interestingly, the standard Qualcomm Snapdragon 875 SoC is missing from the list. If the company plans to launch it, we expect it to get announced in December this year, similar to the previous flagship chipset launch from the company.

EDITOR’S PICK: AnTuTu’s top 10 best performing flagship and mid-range phones for June 2020

The leak reveals that the SD875G and SD735G are the flagship and mid-range chipsets from Qualcomm, set to launch in 2021. Both of them are manufactured using Samsung’s 5nm EUV process which increases performance by 10 percent and reduces power consumption by 20 percent.

Qualcomm is expected to use the combination of Cortex X1 Super Core + Cortex A78 Large Core for the upcoming Snapdragon 875G chipset. With such architecture, the chipset could break the performance records when it comes to chipsets powering Android smartphones.

The leak also reveals that Qualcomm’s rival MediaTek is set to launch Dimensity 600 chipset in the third quarter of this year, i.e. in Q3 2020. It has been reported that the Taiwan-based company has received a large number of orders for the upcoming chipset.

UP NEXT: Realme 125W UltraDart Fast Charging technology announced; charges 33% battery in just 3 minutes

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Ever since the US-China trade war began, there have been several major developments in technology, especially those related to smartphones. The ban on Huawei by the United States and the constant lobbying with other countries to do the same, led to several Chinese companies, including Huawei, to become self-reliant.

Now, it seems that China has started a process using which it could become the leader in 5G chipmaking. The Suzhou Institute of Nano-tech and Nano-Bionics under the Chinese Academy of Sciences (Sinano), and the National Center for Nanoscience and Technology, have made important discoveries related to ultra-high precision laser lithography.

For those who are unaware, lithography machines play quite a crucial role in the production of chips as they etch patterns on wafers for placing transistors. One of the biggest breakthroughs has been EUV that creates extremely thin markings.

However, the discovery is still at the theoretical state and it could take years as well as plenty of money to make this a reality. Compared to others, China is still behind when it comes to manufacturing chipsets, which is often outsourced to the likes of TSMC.

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Nonetheless, the discovery of a new process laser lithography by China is a major step forward for the country. ASML, which is the global leader in lithography and holds a monopoly in the market, was recently blocked by the Dutch government from selling its machines to the Chinese customers, after pressure from the United States.

China’s largest foundry — SMIC — still produces chipsets on a 14nm node process while most of the latest chipsets are being manufactured on 5nm node, including the upcoming Apple A14 and Huawei’s next-gen Kirin SoC.

But if the development regarding chip manufacturing in China keeps going at a rapid pace, combined with proper investments, SMIC and similar companies in China could soon start using the latest technology for making chips. This will present an advantage to China and the smartphone makers in the country such as Huawei. In fact, SMIC is reportedly planning to raise $2.8 billion in Shanghai’s Star Market for its growth.

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(Source)

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After launching a couple of chipsets under its new 5G-focused Dimensity lineup, MediaTek has now announced two new entry-level processors under its gaming-focused G series, which also supports HyperEngine Game Technology.

The HyperEngine technology offers intelligent resource management that ensures sustained and smooth performance, even in demanding and resource-heavy situations. For instance, if the Wi-Fi is weak, it intelligently triggers Wi-Fi & LTE concurrency within milliseconds.

Along with managing connectivity and calling features during game-play, the HyperEngine Game technology also ensures intelligent and dynamic management of the CPU, GPU, as well as memory.

MediaTek Helio G35

The Helio G35 is manufactured using TSMC’s 12nm process and comes with eight ARM Cortex-A53 CPUs clocked at 2.3GHz and for graphics, it packs IMG PowerVR GE8320 clocked at 680MHz. It comes with support for LPDDR4x RAM up to 6GB at 1600MHz and eMMC 5.1 for storage.

It supports Full HD+ display with 2400 x 1080 pixels screen resolution at 20:9 aspect ratio and 60Hz refresh rate. For connectivity, it supports VoLTE\ViLTE\WoWi-Fi along with Dual-Band Wi-Fi 5, Bluetooth 5.0, GPS + Glonass + Beidou + Galileo, and FM radio.

In the camera department, the Helio G35 supports configurations up to 25MP and dual-camera of 13MP + 13MP. The camera can be coupled with features such as AI-driven Bokeh effects, electronic image stabilization (EIS), rolling shutter compensation (RCS), beauty mode, and more.

EDITOR’S PICK: Samsung Galaxy Note20, powered by SD865+ SoC, has improved camera focusing ability

MediaTek Helio G25

Similar to the Helio G35, the MediaTek Helio G25 is also manufactured using the 12nm FinFET process by TSMC. It also packs eight ARM Cortex-A53 CPUs, but they are clocked at 2.0GHz, along with IMG PowerVR GE8320 at 650MHz.

It supports HD+ display at 1600 x 720 pixels resolution and a 20:9 aspect ratio with a 60Hz refresh rate. As for the memory, the chipset supports LPDDR4x RAM up to 6GB at 1600MHz and eMMC 5.1 for storage.

For optics, the Helio G25 has all the supporting features of Helio G35 but the resolution has been limited to 21MP, and thus, the dual-camera setup can have 13MP + 8MP sensors. It can record 1080p videos at 30fps.

Xiaomi’s Redmi as well as Realme have already announced their smartphones powered by these two new chipsets. While Redmi has launched the Redmi 9A powered by the Helio G25 SoC, Realme has unveiled Realme C11 which is powered by Helio G35 chipset.

UP NEXT: Huawei’s 2021 flagship could use a third-party 5nm chipset

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Currently, Qualcomm Snapdragon 865 is the flagship chipset from the company that is powering most of the flagship smartphones getting launched. However, that could change from next month.

As per the report, the upgraded variant of the chipset, dubbed as Snapdragon 865 Plus could get launched in July 2020. Thus, most of the devices getting launched in the second half of this year will be powered by the upcoming SD865 Plus SoC.

The same thing happened last year. When Qualcomm launched the Snapdragon 855 Plus as the upgraded variant of the SD855, the flagship devices getting launched after that were powered by the Plus variant. Even some models were re-launched with SD855 Plus inside.

Coming to the chipset, it is being reported that Snapdragon 865 Plus may have a clock speed of 3.09GHz, compared to 2.84GHz in SD865. The device spotted with such high clock speed was ASUS ROG Phone 3. Interestingly, the ROG Phone 2 was the first device to get launched powered by SD855 Plus.

EDITOR’S PICK: Realme X3, X3 SuperZoom launched with 120Hz display, 60x zoom camera, SD855+ with Rs. 24,999 (~$330) staring price

According to the AnTuTu listing, the chipset has a total score of 646,310 points, which includes a CPU score of 183,149 points, a GPU score of 247,932 points, MEM score of 111,239 points and UX score of 103,990 points.

Recently, the Samsung Galaxy Z Flip 5G specifications leaked online, which also revealed that the device will come powered by the Snapdragon 865 Plus chipset. The smartphone is expected to get launched in a couple of months, along with the Galaxy Note 20 series and the Galaxy Fold 2 smartphone.

There has been so much conflicting information regarding this Snapdragon 865 Plus chipset. While it was earlier rumored to get launched in Q3 2020, some reports hinted that it’s not coming. Then Meizu’s executive said that SD865 Plus isn’t coming this year. However, soon after that, devices powered by the same chipset kept surfacing online and now it is expected to get launched next month.

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Current flagship smartphone chipsets are based on the 7nm node process but the manufacturers are now shifting towards 5nm and even 3nm process for the upcoming next-generation chipsets.

Joining the list of those companies in China-based ZTE. The company held its Annual General Meeting of Shareholders at its headquarters in Shenzhen where the company revealed its plan for the smartphone chipset.

Xu Ziyang, President of ZTE Corporation, revealed that the company is already working on a 7nm chipset which has entered mass-production. He further added that the company has started working on a 5nm chipset and revealed that it’ll be launched next year.

He further goes on to add that while ZTE has done the front-end and back-end design for the chipset, it has to rely on global partners for production and manufacturing.

The development comes as ZTE has been heavily investing in its Research and Development (R&D) department, especially for chip development. The company has spent around 12.1 billion yuan (~$1.7 billion).

ZTE isn’t the only Chinese company working on the next-gen chipset. Huawei, currently the leading smartphone brand globally, is reportedly working on its Kirin 1020 and Kirin 1000 chipsets, which are said to be based on the 5nm process.

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With the on-going US-China trade war, the Chinese companies are now stepping up their game in the semiconductor business. After recent US sanctions cutting off chip supply from TSMC to Huawei, the Chinese giant is also heavily investing in local semiconductor firms.

Last month, Samsung announced a new 5nm chip production plant in South Korea which is expected to be operational by next year. TSMC, on the other hand, has already started mass production of 5nm chipset — Apple A14.

Earlier this month, TSMC officially revealed the existence of a new 4nm manufacturing process which falls between the 5nm and 3nm nodes that are already on the company’s roadmap. The “N4” process is said to be an enhanced version of the “N5P” process and is expected to enter mass production by 2023.

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AMD’s new Ryzen-series processors for laptops have received a good response. Following this, the company now seems to be getting ready to launch a smartphone chipset under the same lineup.

As per the reports, the company is working on Ryzen C7 chipset for smartphones that include two Gaugin Pro cores based on ARM’s recently announced Cortex X1 cores running at 3GHz. It is paired with two cores based on the Cortex A78 running at 2.6 GHz, and four low-power cores based on the Cortex A55 running at 2 GHz.

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It is said to have the elusive RDNA-based smartphone graphics solution that AMD and Samsung partnered for last year. As per the leak, the GPU is about 45 percent faster than the Adreno 650 used in SD865. Further, the chipset is said to have support for LPDDR5 RAM and 2K displays at a 144Hz refresh rate.

The chipset is said to have been built by TSMC, the world’s leading contract chipset manufacturer, using a 5nm process node. It also comes with support for 5G along with the integration of Mediatek 5G UltraSave Modem.

However, we’d advise you to take this information with a pinch of salt. As the leaked image has several misspells and inconsistencies in branding of names, it’s likely to be fake. If it turns out to be true, then it’ll be interesting to see AMD compete against the likes of Qualcomm and MediaTek for the market share. It could also help the company bring in more revenue.

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(Via)

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Yesterday, MediaTek announced that it is scheduling a launch event in China on 18th May to launch a new Dimensity series processor. While the company has not revealed which chipset is it, there are reports suggesting it to be Dimensity 800 Plus.

However, as per the latest report, the MediaTek Dimensity 800 Plus has now been renamed to MediaTek Dimensity 820. It has als been revealed that the chipset will be running at a maximum clock speed on 2.6GHz.

As per the report, there will be three engineering schemes for this upcoming 5G-compatible mobile processor, which will be impacting the operating frequency of the chipset — 2.0GHz, 2.2GHz, and 2.6GHz.

Since the chipset will be called Dimensity 820, it will be better in terms of performance and features offers compared to the MediaTek Dimensity 800. But to know more about it, we’ll have to wait for the official launch.

The Dimensity 800, which was launched earlier this year, is a 7nm octa-core processor that comprises of four Cortex A76 cores clocking at 2.0GHz and four Cortex A55 cores working at 2.0GHz. For graphics, it is equipped with Mali-G77MC4 and also comes with its own HyperEngine gaming technology for enhanced gaming experience.

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It has support for Full HD+ screen resolution with up to 90Hz refresh rate. As for the memory, it can support up to 16GB of LPDDR4x RAM. The chipset supports voice and data over 5G and is built for global sub-6GHz 5G networks and promises up to 3.5Gbps download speeds and up to 1.25Gbps upload speeds.

A few days ago, the company launched Dimensity 1000+ SoC which comes with supports up to 144Hz refresh rate, MiraVision Enhanced HDR10+, and AI-PQ for real-time dynamic adjustment of contrast, color, sharpness and color levels of 4K videos.

It also comes with 5G UltraSave Technology and HyperEnging 2.0 for enhanced gaming performance. The upcoming iQOO Z1 5G, which is set to launch on 19th May, will be the first smartphone to be powered by this premium chipset.

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MediaTek has launched three chipsets under its new 5G Dimensity lineup — MediaTek Dimensity 1000, Dimensity 800, and the most recent Dimensity 1000+. Now, the company is all set to launch yet another chipset in the same series.

The company has today confirmed that it will be hosting a launch event on 18th May in China to launch a new 5G chipset. While the name of the chipset getting launched is not revealed, we expect it to be the MediaTek Dimensity 800 Plus.

As per the previous leak, the Dimensity 800 Plus is expected to cove with an overclocked CPU at 2.6GHz instead of 2.0GHz. Apart from this, everything else is expected to be almost the same as the original variant.

The MediaTek Dimensity 800, launched earlier this year, is a 7nm octa-core processor that comprises of four Cortex A76 cores clocking at 2.0GHz and four Cortex A55 cores working at 2.0GHz. For graphics, it is equipped with Mali-G77MC4 and also comes with its own HyperEngine gaming technology for enhanced gaming experience.

EDITOR’S PICK: iQOO Z1 5G powered by MediaTek Dimensity 1000+ chipset scores more than 530,000 points on AnTuTu

It offers support for Full HD+ screen resolution with up to 90Hz refresh rate. As for the memory, it can support up to 16GB of LPDDR4x RAM. The chipset supports voice and data over 5G and is built for global sub-6GHz 5G networks and promises up to 3.5Gbps download speeds and up to 1.25Gbps upload speeds.

Recently, the company launched Dimensity 1000+ SoC which comes with supports up to 144Hz refresh rate, MiraVision Enhanced HDR10+, and AI-PQ for real-time dynamic adjustment of contrast, color, sharpness and color levels of 4K videos.

It also comes with 5G UltraSave Technology and HyperEnging 2.0 for enhanced gaming performance. The upcoming iQOO Z1 5G, which is set to launch on 19th May, will be the first smartphone to be powered by this premium chipset.

UP NEXT: MediaTek executive says that company will launch a product to take on Snapdragon 875 at an appropriate time

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