Qualcomm is expected to unveil its next-generation flagship chipset, widely expected to be part of the Snapdragon 8 Elite Gen 6 series, in September this year. So far, reports have revealed that it could comprise of two chips, which are tentatively dubbed the Snapdragon 8 Elite Gen 6 and 8 Elite Gen 6 Pro. In a new leak, reliable tipster Digital Chat Station has revealed key specifications of both variants, hinting at a notable shift in the company’s strategy for premium mobile processors.

Snapdragon 8 Elite Gen 6, Gen 6 Pro key details leaked

According to the leak, Qualcomm is working on two models, identified as SM8950 and SM8975, both reportedly built on TSMC’s advanced 2nm process. As mentioned above, these chips are expected to be called the Snapdragon 8 Elite Gen 6 and 8 Elite Gen 6 Pro, respectively.

Each version is said to feature a 2+3+3 CPU architecture, indicating a balanced approach between performance and efficiency cores. However, there are clear differences between the two chips in terms of graphics and memory capabilities.

The SM8975 appears to be the more powerful option, featuring an Adreno 850 GPU paired with 18MB GMEM. It is also tipped to support LPDDR6 memory in a 4×24 configuration, alongside LPDDR5X support and an additional 8MB LLC cache.

In comparison, the SM8950 is expected to come with a slightly toned-down Adreno 845 GPU, 12MB GMEM, LPDDR5X memory in a 4×16 setup, and 6MB LLC.

The leak also suggests that the SM8975 could be positioned as a top-tier variant, possibly arriving with a “Pro” branding, while the SM8950 may serve as the standard flagship offering.

Interestingly, the tipster claims that MediaTek’s upcoming Dimensity 9600 may sit between these two chips in terms of performance, indicating tighter competition in the flagship segment. At the same time, a separate Snapdragon 8 Gen 6 is also expected, though early indications suggest it may not be as impressive in terms of specifications.

The report further notes that the higher-end SM8975 could come with significantly higher production costs, which may limit its adoption to select premium devices. Meanwhile, the SM8950 is said to be the more likely candidate for wider use, with a possibility of Qualcomm even considering a fallback option depending on development progress.

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Among the two rumored flavors, Qualcomm is expected to bring LPDDR6 RAM and a full-fledged GPU for only the Snapdragon 8 Elite Gen 6 Pro. A newly leaked block diagram now suggests the Pro chip may also have another exclusive feature: an HPB design. 

According to a leak from China, Qualcomm is expected to adopt Heat Pass Block (HPB) technology, the same cooling method used in Samsung’s Exynos 2600. Instead of relying on more traditional layouts, HPB places a dedicated heat-spreading layer directly on top of the chipset package. The goal is to move heat away from the silicon faster, before it becomes a performance bottleneck.

Qualcomm’s recent chips have aimed for extremely high peak frequencies, with rumors suggesting the Snapdragon 8 Elite Gen 6 Pro could reach even 6GHz. Sustaining those speeds has been a challenge in the past, often forcing the chip to throttle down once temperatures rise. HPB is designed to reduce that problem by giving the processor more thermal headroom.

Snapdragon 8 Elite Gen 6 Pro to use Package-on-Package memory

The schematic leak also reveals other technical details. The Snapdragon 8 Elite Gen 6 Pro appears to use a Package-on-Package (PoP) design, where memory is stacked closely with the processor to save space.

The chip supports both LPDDR6 and LPDDR5X RAM along with UFS 5.0 storage using two high-bandwidth lanes.

Beyond raw performance, the chip may also focus on productivity features. The leak hints at multi-display support, which could enable desktop-style experiences when phones are connected to external monitors.

If true, the leak suggests Qualcomm is seriously rethinking how it handles heat in its most powerful chips. Adopting HPB could help the Snapdragon 8 Elite Gen 6 Pro maintain high performance for longer periods, instead of briefly hitting impressive numbers before slowing down.

That said, it’s still unclear whether this cooling solution will be exclusive to the “Pro” variant. There’s no confirmation yet that the standard Snapdragon 8 Elite Gen 6 will receive the same treatment.

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A report earlier this month suggested that Qualcomm is looking to work with Samsung Foundry for its next Snapdragon mobile processors. 

The speculation was largely tied to the upcoming Snapdragon 8 Elite Gen 6, with claims that some of Qualcomm’s next flagship chips could use Samsung’s manufacturing facilities.

However, a new report from Smart Chip Insider on Weibo says that Qualcomm will rely exclusively on TSMC for the Snapdragon 8 Elite Gen 6 series.

Snapdragon 8 Elite Gen 6 will be exclusively made by TSMC

For those unfamiliar, the Snapdragon 8 Elite Gen 6 is expected to come in two variants: a standard version and a Pro model. According to the tipster, both versions will be manufactured using TSMC’s N2P process, as is expected all along.

To back up the claim, the tipster points to a basic reality of chip development: designing and manufacturing an advanced mobile processor is not something companies can change on short notice.

The full development cycle—from IP design to a finished system-on-chip—typically takes around two years. As a result, it would be nearly impossible for a chip expected to be commercially available as early as the third quarter of this year to switch manufacturing processes or foundry partners at short notice. The reasoning makes sense if we think through it.

Still, this doesn’t mean Samsung is completely out of Qualcomm’s plans. During CES 2026, Qualcomm CEO Cristiano Amon confirmed that discussions between Qualcomm and Samsung are ongoing. While he didn’t point to any specific product, his comments suggest that a collaboration could still happen down the line.

As always with early chip rumors, the full picture will not be clear until Qualcomm makes things official.

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Qualcomm is rumored to be preparing two versions of its next flagship smartphone chip. The Snapdragon 8 Elite Gen 6 could include a standard and a higher-end Pro variant, with a new rumor now claiming the latter will have clock speeds close to a desktop processor. 

A post on Weibo from well-known tipster Fixed Focus Digital claims that early testing of Qualcomm’s upcoming chip has already hit clock speeds of 5GHz. The tipster goes further, suggesting the absolute ceiling could land somewhere between 5.5GHz and 6.0GHz, though they note that 5.5GHz is the more realistic target.

The jump in core speed is said to be made possible by the use of HBP (Heat Pass Block) technology, a thermal solution developed by Samsung for its Exynos 2600 chip. HBP integrates a heatsink directly into the chip package, allowing heat to dissipate more efficiently.

While the post doesn’t explicitly name the Snapdragon 8 Elite Gen 6 Pro, the details closely match what’s expected from Qualcomm’s next-generation flagship processor.

2nm fabrication also contributes to higher clock speed

For comparison, the current Snapdragon 8 Elite Gen 5 tops out at around 4.61GHz on its performance cores, with slightly higher clocks rumored for select Galaxy-exclusive variants. Crossing the 5GHz threshold would be a notable milestone for mobile chips, even if those speeds are difficult to sustain in everyday use.

Another factor working in Qualcomm’s favor could be a move to TSMC’s newer 2nm N2P manufacturing process. It should naturally deliver improved efficiency alongside higher peak frequencies.

It’s also worth noting that Qualcomm is already comfortable marketing 5GHz-class silicon on the PC side, with chips like the Snapdragon X2 Elite Extreme. Bringing similar numbers to smartphones seems like the next logical step, even if the thermal realities of phones continue to keep those speeds in check.

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Reliable tipster Digital Chat Station has shared fresh insights into the roadmap of next-generation flagship smartphones, building on an earlier post that discussed launch timelines for upcoming Dimensity-powered devices. In that earlier update, he suggested that at least either Oppo or Vivo could launch an iterative flagship as early as September. He also hinted that delaying ultra-premium models until April may not align well with faster chipset refresh cycles, especially for so-called “Ultra” variants.

The tipster contrasted this with Xiaomi’s established rhythm, where standard and Pro models typically arrive around September, followed by Ultra models towards the end of the year. He suggested that other brands may benefit from adopting a similar staggered launch strategy to better match chipset evolution.

Rumored chipsets for Pro Max and Ultra flagships

In his newer Weibo posts, DCS claims that if Oppo and Vivo move forward with Pro Max-branded models, these devices are likely to feature MediaTek’s upcoming Dimensity 9600 series chip built on TSMC’s N2P (2nm) process. He describes this as a full-performance flagship platform, indicating that Pro Max models may prioritize sustained performance and scale.

At the same time, he suggests that Qualcomm’s next Snapdragon 8 Elite Gen 6 Pro, identified internally as SM8975, may be reserved exclusively for Ultra-branded premium, imaging-focused flagships rather than mainstream Pro or Pro Max devices. In replies, DCS further notes that both the Snapdragon 8 Elite Gen 6 and its Pro variant are expected to be manufactured on a 2nm process by TSMC, but with clear segmentation between standard iterative flagships and top-tier models.

He also reiterates that multiple brands under the OV and “H” umbrella are planning Pro Max variants for their next flagship cycles, adding that one brand, abbreviated as “MH” has already introduced such a model in the current generation. Here, “H” appears to be Honor and “MH” seems to be Huawei, which has already launched the Huawei Mate 80 Pro Max.

While none of this has been officially confirmed, the posts collectively point towards tighter launch schedules, clearer flagship tiering, and more aggressive adoption of next-generation silicon across major Chinese smartphone brands.

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