After earlier details about the CPU upgrades, Qualcomm has now shared more about the upcoming Adreno GPU. The biggest new addition is something called the Adreno Matrix Core. From the schematics, the GPU will include three of these cores, built specifically to handle local AI tasks with lower latency and better power efficiency. This continues the SME matrix approach Qualcomm first brought to its CPUs last year, and now it’s bringing a similar idea into the graphics side.

These Matrix Cores are what power the new Adreno Neural Fusion technology. Compared to previous solutions, Neural Fusion is said to reduce common image issues like flickering and ghosting, deliver more consistent performance, and produce clearer details, all while cutting power use by up to 40%.

For gamers, the practical benefits should show up in better frame generation and image upscaling. Qualcomm has already confirmed support in both Unreal Engine and Unity, which should make it easier for developers to adopt and hopefully bring more compatible games faster.

Architecturally, the next-generation chip uses a three-slice GPU design. This splits the shader cores and other hardware into separate sections so the system can allocate power and performance more precisely.

The new Adreno GPU hits a clock speed of 1.45 GHz, up from the 1.2 GHz on the Snapdragon 8 Elite Gen 5. It still has 18 MB of Adreno high-performance memory and is claimed to be about 12% more energy efficient. Other platform pieces include the Qualcomm X105 modem and FastConnect 8800 connectivity.

Earlier CPU details still matter here too. The next processor will use an Oryon CPU that can reach 5 GHz, the first time a smartphone chip has crossed that mark, along with a FlexCache architecture meant to handle instruction data more efficiently. Overall, the Snapdragon 8 Elite Gen 6 series looks like it’s shaping up to be a strong performer. The real test, as always, will be how well smartphone makers optimize their software to make the most of the chip’s capabilities.

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(Source: Qualcomm)

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An unannounced Qualcomm flagship chip has already shown up for sale on a Chinese secondhand marketplace, giving an early look at hardware that isn’t supposed to be officially revealed until late September 2026.

A Shenzhen-based seller briefly listed a chip identified as the Qualcomm Snapdragon 8 Elite Gen 6 Pro (model SM8975-100-BC) on Xianyu, China’s biggest secondhand platform. The listing called it a desoldered engineering sample taken from a test board and put a placeholder price of CNY 300 (about $42), with the real price open to negotiation. It was marketed for repair and chip rework, and the seller claimed bulk stock was available. The post disappeared shortly after it went up.

The SM8975 model number matches what had previously been linked to Qualcomm’s higher-end flagship silicon for this generation. Qualcomm has already teased that its next Snapdragon Summit will introduce two separate “8 Elite” chips instead of the usual single one, briefly showing a pair of Snapdragon 8 Elite-branded packages in promotional material ahead of the September 22–24 event in Maui, Hawaii.

Package markings on the listed chips give a few more clues. The laser-etched “SM8975-100-BC” points to a first-revision LPDDR5X engineering sample. Two lot codes appear: FC5528M5 and FX602R8T. These usually encode the fabrication plant, assembly site, and packaging date. Decoding them suggests both were made at TSMC (likely on the N2P node) and packaged at Amkor facilities, one in Korea around late December 2025 and the other in Japan in early January 2026. Samples are said to have reached OEMs starting February 3, 2026.

The photos also show an internal heat spreader sitting between the die and the package lid. This looks like Qualcomm’s answer to Samsung’s Heat Pass Block design used on the Exynos 2600. The spreader appears smaller than Samsung’s version, probably because Qualcomm’s package has to support both LPDDR6 and LPDDR5X memory options, which means larger ball-grid arrays and less room for the heat solution.

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(Source)

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Qualcomm is doing something different this year with its next flagship chip announcement. The company has confirmed that Snapdragon Summit 2026 will introduce a pair of 8 Elite chips.

In a teaser posted on X, Qualcomm used the taglines “Dual 8 Elites” and “When Two Changes the Game,” promising “twice the options” for the smartphone market. The post frames it as the “next chapter” in Qualcomm’s “agentic AI era” and includes a short video showing two unnamed chips alongside gameplay footage from Neverness to Everness (NTE).

Both chips are said to bring better connectivity, stronger camera features, and a more powerful GPU aimed at immersive gaming. Qualcomm hasn’t named them yet and is holding the full details for the Summit.

The event is set for September 22–24, 2026, in Maui, Hawaii. Industry rumors consistently point to the pairing as the Snapdragon 8 Elite Gen 6 and a higher-tier Snapdragon 8 Elite Gen 6 Pro. The Pro version is expected to target “Ultra”-level phones, think devices like Samsung’s Galaxy S27 Ultra and the top flagships from iQOO, OnePlus, and Xiaomi.

Early speculation suggests the Pro chip could be built on TSMC’s 2nm process and feature an Adreno 850 GPU, while the standard version would power a wider range of premium but slightly more affordable flagships. None of this is confirmed yet, of course, and everything will be clarified at the Summit.

This dual-chip approach is a clear change for Qualcomm, which has usually launched just one main flagship SoC each year. By offering two options, the company seems to be creating clearer performance tiers at the top end, giving phone makers more flexibility when designing devices for different price points and feature levels. Detailed specs, performance claims, and partner device details should arrive when the chips are officially revealed on September 22, or sooner.

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(Source: Qualcomm)

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The Snapdragon 8 Elite Gen 6 Pro has appeared in what could be an early AnTuTu benchmark, offering a glimpse at the performance Qualcomm’s next flagship platform may deliver. The result puts the upcoming 2nm chip firmly in the spotlight ahead of its expected arrival in next-generation Android flagships.

Snapdragon 8 Elite Gen 6 Pro’s AnTuTu score revealed

An AnTuTu V11.1.4 screenshot shared by tipster Digital Chat Station shows a device running Qualcomm’s SM8975 chip achieving 4,835,412 points. The score includes 1,368,930 points for the CPU and 1,854,826 points for the GPU. The GPU is identified as the Adreno 850.

Earlier leaks have associated the SM8975 with the Snapdragon 8 Elite Gen 6 Pro, while the standard Snapdragon 8 Elite Gen 6 is reportedly linked to the SM8950.

For comparison, the latest Snapdragon 8 Elite Gen 5-powered flagships have crossed the 4.5-million mark on AnTuTu, putting this result roughly 6% higher. However, AnTuTu itself reportedly noted that the result cannot currently be retrieved through its backend, raising questions about its authenticity. The benchmark should therefore be treated as an early indication rather than a confirmed performance figure.

The Snapdragon 8 Elite Gen 6 series is expected to power several upcoming flagship phones. Honor has confirmed that the Honor Magic 9 series will debut in China on September 28. While the standard Magic 9 is reportedly set to use last year’s Snapdragon 8 Elite Gen 5, the Pro models are expected to feature the newer Snapdragon 8 Elite Gen 6.

However, the Honor Magic 9 series may not be the first lineup to debut with the Snapdragon 8 Elite Gen 6. The Xiaomi 18 series is reportedly expected to introduce the chipset ahead of Honor. The same platform is also tipped to power upcoming flagships such as the iQOO 16 and OnePlus 16, which are expected to launch in China by late September or early October.

If the 4.84-million score proves genuine, the Snapdragon 8 Elite Gen 6 Pro could establish a new performance benchmark for upcoming 2nm Android flagships.

What do you think of this reported performance? Share your thoughts below.

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The post Breaking: Upcoming 2nm Snapdragon 8 Elite Gen 6 Pro scores 4.83M+ on AnTuTu appeared first on Gizmochina.

A detailed set of leaked documents has given us a clearer picture than usual this early on of the chip known internally as SM8975. It’s expected to launch as the Snapdragon 8 Elite Gen 6 Pro, and on paper it looks like one of Qualcomm’s bigger architectural jumps in a while.

The biggest manufacturing-process update is that it’s moving to TSMC’s enhanced 2 nm-class N2P node, Qualcomm’s first flagship to go beyond 3 nm. Interestingly, the die is still larger than the previous generation (roughly 134 mm² versus 126.2 mm²), even though the process is denser. That usually means they’ve packed in more features and complexity.

The CPU sticks with Qualcomm’s custom Oryon cores in a 2+3+3 setup: two prime cores, three performance cores, and three efficiency cores. Exact clock speeds still aren’t out. On the graphics side, the Pro version gets the Adreno 850 GPU with 18 MB of GMEM (up from the Adreno 840).

It also includes two dedicated Matrix ALU blocks that enable a new feature called AI Frame Fusion. This can do both super-resolution upscaling and AI-generated frames to make games look smoother while using less power. Those Matrix ALUs and AI Frame Fusion appear to be Pro-only. The regular SM8950 is expected to use a scaled-down Adreno 845 with 12 MB of GMEM and skip the new AI blocks.

Cache has been bumped up too, with a shared 16 MB L2 cache plus 8 MB of system-level cache. The Pro model will support both LPDDR5X and the newer LPDDR6, while the base version is limited to LPDDR5X.

The Pro version is expected to cost more to make, so it might be reserved for a smaller group of ultra-premium phones. Qualcomm is set to officially reveal the platform at its Snapdragon Summit in Maui from September 22-24, 2026.

The September summit should fill in the remaining gaps. For now, it looks like a solid step up for the high-end Android phones that will use it.

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(Source: Notebookcheck)

The post Snapdragon 8 Elite Gen 6 Pro CPU, GPU upgrades detailed in new leak appeared first on Gizmochina.

Qualcomm has officially confirmed the dates for its 2026 Snapdragon Summit. The annual event, where the company usually unveils its next flagship mobile chip, will take place from September 22nd to 24th in Hawaii. 

Last year, Qualcomm took the wraps off the Snapdragon 8 Elite Gen 5 during its annual Snapdragon Summit in Maui, Hawaii, and that chip went on to power devices from a long list of brands. The successor in 2026 is expected to be called Snapdragon 8 Elite Gen 6, and it’s not coming alone. 

Snapdragon 8 Elite Gen 6: What to expect

This year, leaks suggest Qualcomm is splitting its flagship lineup into two distinct chips for the first time, internally codenamed SM8950 and SM8975. Expected to be called Snapdragon 8 Elite Gen 6 and 8 Elite Gen 6 Pro, both are reportedly built on TSMC’s advanced 2nm process. 

According to tipster Digital Chat Station, the Snapdragon 8 Elite Gen 6 will feature a new 2+3+3 Oryon CPU layout, along with a shared 16MB L2 cache, paired with an Adreno 845 GPU featuring a six-slice design, 12MB GMEM and 6MB system-level cache, plus support for LPDDR5X memory and UFS 5.0 storage. 

The Gen 6 Pro, meanwhile, will use an Adreno 850 GPU with 18MB of dedicated GMEM, a 50% increase in GPU bus width and memory capacity compared to the Snapdragon 8 Elite Gen 5, along with support for LPDDR6 memory in addition to LPDDR5X.

Clock speeds are also expected to climb. According to reports, Gen 6 Pro could reach a peak clock speed of 5GHz, which would make it the first smartphone chip to hit that mark. To handle the extra heat that comes with higher speeds, the Pro variant is also rumored to introduce new cooling tech. 

A leaked block diagram revealed Qualcomm may adopt Heat Pass Block (HPB) technology, the same cooling method used in Samsung’s Exynos 2600, where a dedicated heat-spreading layer sits directly on top of the chipset package to move heat away from the silicon faster.

Now that official dates are out, expect leaks and benchmark numbers to ramp up over the coming weeks.

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The post Qualcomm confirms Snapdragon Summit 2026 dates: Snapdragon 8 Elite Gen 6 coming September 22-24 appeared first on Gizmochina.

Qualcomm’s next generation of Snapdragon 8-series chipsets has surfaced through a new leak, hinting at a broader portfolio than before. The information suggests the company is preparing multiple premium processors with different performance targets, while also facing fresh competition from MediaTek’s upcoming flagship silicon.

Multiple Snapdragon 8-series chips in works

According to tipster Digital Chat Station, Qualcomm is working on two 2nm flagship chipsets. The first is the SM8975, which is tentatively expected to launch as the Snapdragon 8 Elite Gen 6 Pro. It is tipped to feature a new 2+3+3 Oryon CPU architecture, 16MB shared L2 cache, an Adreno 850 GPU with 18MB GMEM, and support for both LPDDR6 and LPDDR5X memory. The chip is said to focus on delivering the highest possible performance.

The second chipset, carrying the SM8950 model number, is expected to arrive as the Snapdragon 8 Elite Gen 6. While it is also built on a 2nm process and shares the same next-generation Oryon CPU architecture with 16MB shared L2 cache, it reportedly comes with an Adreno 845 GPU featuring 12MB GMEM. Unlike the Pro version, this chipset is said to strike a balance between performance and power efficiency while supporting LPDDR5X memory.

The tipster also listed several 3nm platforms that are in Qualcomm’s roadmap, including the existing SM8850 (Snapdragon 8 Elite Gen 5) and the upcoming ones, such as the SM8850Q, which may be branded as the Snapdragon 8 Elite Gen 5XX Edition, and the SM8845 Pro, which could be called the Snapdragon 8 Gen 5 Pro or Gen 6 but will be a minor upgrade over the existing Snapdragon 8 Gen 5.

MediaTek rivalry could heat up

In the comments, Digital Chat Station claimed that MediaTek’s upcoming 2nm Dimensity 9600 Pro could theoretically outperform the Snapdragon 8 Elite Gen 6 (SM8950), particularly in GPU performance.

The chip is said to feature the Magni architecture and an integrated NGP neural accelerator, enabling console-level frame interpolation, improved ray tracing performance, and higher rendering efficiency.

As per other reports, this year’s Dimensity 9-series lineup is expected to include three models, namely the 3nm Dimensity 9500+, an overclocked version of the existing Dimensity 9500, along with the 2nm Dimensity 9600 and 9600 Pro.

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The post Multiple Snapdragon 8-series chipsets in works for this year, key specifications tipped appeared first on Gizmochina.

It looks like Qualcomm is testing two versions of the next Snapdragon flagship: a standard model that supports LPDDR5X memory and a higher-end “Pro” variant with faster LPDDR6 memory. Both versions share the same core clock speeds, so the big difference comes down to memory type. The Pro model also brings UFS 5.0 storage support, giving it enough power to handle almost anything you can throw at it.

This chipset is expected to be the most powerful 2nm Android SoC so far, targeting premium “Ultra” flagships coming in 2027. It’ll be manufactured on TSMC’s advanced 2nm process, which should bring solid gains in both performance and battery efficiency compared to previous generations.

The catch is likely the price. The top-tier Pro version could cost manufacturers over $300 per unit. That’s why Qualcomm is offering this flexible approach: brands can choose the more affordable LPDDR5X version for slightly cheaper flagships or go all-in with LPDDR6 for maximum bandwidth and better on-device AI performance.

Early block diagrams show the usual high-end layout, with a stronger GPU (rumored to be the Adreno 850 in the Pro) and solid multi-core performance. As usual, we’ll probably see binned versions later on, possibly with 7-core CPU setups for different price points.

Overall, this dual-version strategy feels like a smart response to the rising costs in the premium segment. The LPDDR6 models will go after the absolute top-tier buyers, while the LPDDR5X versions could bring near-flagship experiences to a slightly wider audience.

We should hear more official details later in 2026. If the rumors hold up, the Snapdragon 8 Elite Gen 6 Pro looks set to power the next wave of truly high-end Android phones, balancing raw power with the practical realities manufacturers are facing right now.

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(Source)

The post Qualcomm’s 2nm Android flagship chipset will come in two versions with LPDDR5X/LPDDR6 memory appeared first on Gizmochina.

Qualcomm is said to adopt an entirely different strategy for the upcoming Elite chips in the Snapdragon 8-series this year. The Snapdragon 8 Elite Gen 6 will reportedly have a “Pro” sibling for the first time, marking a shift toward a tiered structure similar to Apple’s standard and Pro chips.

While both Snapdragon Elite SoCs will use TSMC’s most advanced 2nm node, the “Pro” variant is rumored to carry significant upgrades that could even beat Apple’s upcoming A20 chips. The official unveiling is still months away, but we already have plenty of details to give you a solid overview of what’s to come.

Qualcomm Snapdragon 8 Elite Gen 6 Pro spec sheet

The spec sheet has been prepared based on the leaks and rumors we’ve gathered so far, and therefore, it isn’t guaranteed to be absolutely accurate. We’ll update it periodically as we receive fresh details.

Advanced TSMC’s 2nm node unlocks next-level performance

Qualcomm will be one of the first brands to produce smartphone chips using TSMC’s 2nm advanced node, with MediaTek and Apple also expected to unveil their 2nm chips around the same time later this year. The Snapdragon 8 Elite Gen 6 Pro goes a step further as it’s said to utilize TSMC’s newer ‘N2P’ architecture instead of ‘N2’. Rumors suggest it could maintain a slight edge over Apple’s upcoming A20 Pro.

MediaTek is also rumored to adopt the newer N2P node for the upcoming Dimensity 9600 Pro to better compete with Qualcomm and Apple. N2P offers roughly 5% better performance than the standard N2 node while enabling manufacturers like Qualcomm to easily port their 2nm designs to this more efficient process without costly redesign.

Efficiency-focused CPU cluster hitting 5.0 GHz in peak speed

Qualcomm has kept the same ‘2+6’ cluster (2 performance cores and 6 efficiency cores) for all Snapdragon chipsets featuring Oryon CPU. That could change this year, as the Snapdragon 8 Elite Gen 6 Pro is said to feature a ‘2+3+3’ cluster (2 prime cores, 3 performance cores, and 3 efficiency cores) to achieve better efficiency.

The three efficiency cores could operate at a much lower speed, reducing power draw for tasks that do not require much processing power. The chip could also offer higher CPU performance, as it’s rumored to reach a peak clock speed of 5 GHz. The Snapdragon 8 Elite Gen 5 can already reach a peak speed of 4.61 GHz, with the ‘Snapdragon 8 Elite Gen 5 for Galaxy’ variant reaching up to 4.74 GHz. Looking at them, it wouldn’t be surprising to see 8 Elite Gen 6 Pro hitting the 5.0 GHz mark. If that happens, the Snapdragon 8 Elite Gen 6 Pro would be the first smartphone chip to enter that territory.

A tipster recently suggested that the Snapdragon 8 Elite Gen 6 Pro may not deliver a significant CPU performance uplift (less than 20%), but will double down on efficiency. However, the GPU could offer a radical jump.

GPU upgrades may be impressive

While the rumored CPU upgrades look modest, the GPU on the Snapdragon 8 Elite Gen 6 Pro is said to bring substantial gains. According to recent leaks, the SoC will use an Adreno 850 GPU with a dedicated 18 MB of GMEM. For those unfamiliar, GMEM refers to a high-performance graphics cache that accelerates rendering, ray tracing, and AI workloads.

The chipset could come with a 50% increase in GPU bus width and memory capacity compared to the Snapdragon 8 Elite Gen 5. This would directly benefit high-resolution gaming, advanced ray tracing, and on-device AI inference.

Faster memory and storage

The Snapdragon 8 Elite Gen 6 Pro is said to bring support for LPDDR6 memory, in addition to LPDDR5X. A leak noted that the chip could support either quad-channel 24-bit LPDDR6 or quad-channel 16-bit LPDDR5X, alongside 18MB GMEM and 8MB LLC, thereby offering greater bandwidth and cache.

The Pro chipset reportedly supports UFS 5.0 storage with two high-bandwidth lanes. The chip would likely deliver peak bandwidth and better sustained performance in memory-bound tasks such as high-fps gaming, large-language-model inference, and heavy multitasking.

Better thermals and HPB cooling

Qualcomm has reportedly upgraded thermals on the Snapdragon 8 Elite Gen 6 Pro to deliver sustained performance for longer sessions without severe thermal throttling. A leaked block diagram shows a new HPB (Heat Pass Block) cooling solution for the Pro chip, similar to the HPB solution in Samsung’s Exynos 2600.

The HPB solution features a dedicated heat transfer block positioned directly over the chip package to improve heat spreading to the phone’s vapor chamber or other cooling elements. This could only be introduced in the Pro model, with uncertainty around whether the standard Gen 6 will receive the same cooling design.

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The post Snapdragon 8 Elite Gen 6 Pro: Here’s everything we know so far appeared first on Gizmochina.

Several reports have revealed that there will be two versions of the next-generation Qualcomm Snapdragon Elite-branded 8-series chip. These include the Snapdragon 8 Elite Gen 6 and 8 Elite Gen 6 Pro. Tipster Digital Chat Station has now shared fresh details about the standard variant and how it differs from the Pro model.

Snapdragon 8 Elite Gen 6 key details revealed

According to the tipster, the Snapdragon 8 Elite Gen 6, identified as SM8950, is expected to be built on TSMC’s advanced 2nm process. It is said to feature a new 2+3+3 Oryon CPU layout, along with a shared 16MB L2 cache. This architecture indicates a strong focus on balancing performance and efficiency for flagship devices.

On the graphics side, the chipset may include an Adreno 845 GPU with a six-slice design, paired with 12MB GMEM and 6MB system-level cache. It is also expected to support LPDDR5X memory and UFS 5.0 storage, making it suitable for high-performance smartphones without pushing costs too high. The chip is likely to power upper mid-range and mainstream flagship models in the next cycle.

How does the Snapdragon 8 Elite Gen 6 differ from the Pro variant

The same source suggests that the standard version comes with slightly reduced cache and peripheral capabilities compared to the Pro model. Earlier reports indicate that the Snapdragon 8 Elite Gen 6 Pro, carrying model number SM8975, could bring support for LPDDR6 memory along with a more powerful Adreno 850 GPU and expanded cache configuration.

While its performance is expected to as high as 6GHz, it is also being said that it might not even deliver 20 percent performance improvement over its previous generation.

In addition, the Pro variant is expected to target premium Ultra-tier smartphones, while the standard chip may focus on offering stable performance and better efficiency for a wider range of devices. However, there are reports that the OnePlus 16 and iQOO 16 will come equipped with the Pro chip.

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The post Snapdragon 8 Elite Gen 6 specifications leaked; here’s how it differs from Snapdragon 8 Elite Gen 6 Pro appeared first on Gizmochina.

Qualcomm is expected to unveil its next flagship mobile platform, the Snapdragon 8 Elite Gen 6 series, in September 2026. And if a new leak is to be believed, this generation will not deliver the CPU gains we might expect from it.

According to Chinese leaker Fixed Focus Digital, the Snapdragon 8 Elite Gen 6 Pro — which is said to be built on a 2nm process — will deliver less than 20% CPU performance improvement. Instead, the bigger story could be on the GPU side.

Snapdragon 8 Elite Gen 6 Pro will have better incremental performance in GPU

The report suggests Qualcomm will stick with a dual Prime core setup, but could change how its performance cores are arranged.

Rather than pairing the Prime cores with six identical performance cores running at the same clock speeds, the company is rumored to split them into two clusters with different frequencies in a 3+3 layout. 

Interestingly, even MediaTek’s upcoming Dimensity 9600 chip is said to follow a similar 2+3+3 CPU configuration. 

There are a couple of possible explanations for this change. One is that mobile CPU clock speeds are starting to hit practical limits, especially under tight power constraints. Another is that companies like Qualcomm may now be choosing to invest more in efficiency and sustained performance, rather than chasing short bursts of higher benchmark numbers.

In terms of GPU, the Snapdragon 8 Elite Gen 6 Pro is rumored to feature an upgraded Adreno A850 GPU, with a larger cache and support for LPDDR6 memory. These changes could translate into more noticeable improvements in gaming performance and on-device AI tasks, even if raw CPU gains are just modest.

Not to forget, there is even said to be the vanilla Snapdragon 8 Elite Gen 6, which might bring even a modest performance bump. 

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The post Snapdragon 8 Elite Gen 6 Pro might not even deliver 20% performance improvement over predecessor appeared first on Gizmochina.

Qualcomm’s next flagship chips are still months away from becoming official, but leaks are already sketching out what the company might be planning. As you might have heard, there could be two versions this time: the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Gen 6 Pro. 

According to a new report from ITHome, the Snapdragon 8 Elite Gen 6 Pro could support LPDDR6 RAM.

Previously, it was believed to support LPDDR5X, but a report last week suggested that LPDDR6 is on the cards for the Snapdragon 8 Elite Gen 6 Pro.

Snapdragon 8 Elite Gen 6 Pro will support LPDDR6

In line with that, the Pro model, carrying the internal model number SM8975, has appeared in customs information with the new memory support.

The SoC is also said to feature a 2+3+3 CPU layout, likely an all-big-core setup similar to the Snapdragon 8 Elite Gen 5. This means there will be two prime cores for peak performance, three performance cores for sustained workloads, and three efficiency-oriented cores.

On the graphics side, the Snapdragon 8 Elite Gen 6 Pro is said to include an Adreno 850 GPU along with 18MB of GMEM (graphics memory).

The standard version of the chip reportedly shares the same CPU architecture, but it may run at lower clock speeds and use a slightly less capable Adreno 845 GPU. More notably, this version is expected to stick with LPDDR5X memory rather than move to LPDDR6.

Of course, with the launch still some time away, these specifications could change. But if LPDDR6 does make its way into the Pro model, it would mark one of the first major shifts in mobile memory in a while.

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(Via)

The post Snapdragon 8 Elite Gen 6 Pro custom information reveals LPDDR6 support appeared first on Gizmochina.

Qualcomm is expected to unveil its next-generation flagship chipset, widely expected to be part of the Snapdragon 8 Elite Gen 6 series, in September this year. So far, reports have revealed that it could comprise of two chips, which are tentatively dubbed the Snapdragon 8 Elite Gen 6 and 8 Elite Gen 6 Pro. In a new leak, reliable tipster Digital Chat Station has revealed key specifications of both variants, hinting at a notable shift in the company’s strategy for premium mobile processors.

Snapdragon 8 Elite Gen 6, Gen 6 Pro key details leaked

According to the leak, Qualcomm is working on two models, identified as SM8950 and SM8975, both reportedly built on TSMC’s advanced 2nm process. As mentioned above, these chips are expected to be called the Snapdragon 8 Elite Gen 6 and 8 Elite Gen 6 Pro, respectively.

Each version is said to feature a 2+3+3 CPU architecture, indicating a balanced approach between performance and efficiency cores. However, there are clear differences between the two chips in terms of graphics and memory capabilities.

The SM8975 appears to be the more powerful option, featuring an Adreno 850 GPU paired with 18MB GMEM. It is also tipped to support LPDDR6 memory in a 4×24 configuration, alongside LPDDR5X support and an additional 8MB LLC cache.

In comparison, the SM8950 is expected to come with a slightly toned-down Adreno 845 GPU, 12MB GMEM, LPDDR5X memory in a 4×16 setup, and 6MB LLC.

The leak also suggests that the SM8975 could be positioned as a top-tier variant, possibly arriving with a “Pro” branding, while the SM8950 may serve as the standard flagship offering.

Interestingly, the tipster claims that MediaTek’s upcoming Dimensity 9600 may sit between these two chips in terms of performance, indicating tighter competition in the flagship segment. At the same time, a separate Snapdragon 8 Gen 6 is also expected, though early indications suggest it may not be as impressive in terms of specifications.

The report further notes that the higher-end SM8975 could come with significantly higher production costs, which may limit its adoption to select premium devices. Meanwhile, the SM8950 is said to be the more likely candidate for wider use, with a possibility of Qualcomm even considering a fallback option depending on development progress.

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The post Snapdragon 8 Elite Gen 6, 8 Elite Gen 6 Pro specifications leaked; Snapdragon 8 Gen 6 also in works appeared first on Gizmochina.

Among the two rumored flavors, Qualcomm is expected to bring LPDDR6 RAM and a full-fledged GPU for only the Snapdragon 8 Elite Gen 6 Pro. A newly leaked block diagram now suggests the Pro chip may also have another exclusive feature: an HPB design. 

According to a leak from China, Qualcomm is expected to adopt Heat Pass Block (HPB) technology, the same cooling method used in Samsung’s Exynos 2600. Instead of relying on more traditional layouts, HPB places a dedicated heat-spreading layer directly on top of the chipset package. The goal is to move heat away from the silicon faster, before it becomes a performance bottleneck.

Qualcomm’s recent chips have aimed for extremely high peak frequencies, with rumors suggesting the Snapdragon 8 Elite Gen 6 Pro could reach even 6GHz. Sustaining those speeds has been a challenge in the past, often forcing the chip to throttle down once temperatures rise. HPB is designed to reduce that problem by giving the processor more thermal headroom.

Snapdragon 8 Elite Gen 6 Pro to use Package-on-Package memory

The schematic leak also reveals other technical details. The Snapdragon 8 Elite Gen 6 Pro appears to use a Package-on-Package (PoP) design, where memory is stacked closely with the processor to save space.

The chip supports both LPDDR6 and LPDDR5X RAM along with UFS 5.0 storage using two high-bandwidth lanes.

Beyond raw performance, the chip may also focus on productivity features. The leak hints at multi-display support, which could enable desktop-style experiences when phones are connected to external monitors.

If true, the leak suggests Qualcomm is seriously rethinking how it handles heat in its most powerful chips. Adopting HPB could help the Snapdragon 8 Elite Gen 6 Pro maintain high performance for longer periods, instead of briefly hitting impressive numbers before slowing down.

That said, it’s still unclear whether this cooling solution will be exclusive to the “Pro” variant. There’s no confirmation yet that the standard Snapdragon 8 Elite Gen 6 will receive the same treatment.

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The post Big Snapdragon 8 Elite Gen 6 leak reveals block diagram months ahead of launch appeared first on Gizmochina.

A report earlier this month suggested that Qualcomm is looking to work with Samsung Foundry for its next Snapdragon mobile processors. 

The speculation was largely tied to the upcoming Snapdragon 8 Elite Gen 6, with claims that some of Qualcomm’s next flagship chips could use Samsung’s manufacturing facilities.

However, a new report from Smart Chip Insider on Weibo says that Qualcomm will rely exclusively on TSMC for the Snapdragon 8 Elite Gen 6 series.

Snapdragon 8 Elite Gen 6 will be exclusively made by TSMC

For those unfamiliar, the Snapdragon 8 Elite Gen 6 is expected to come in two variants: a standard version and a Pro model. According to the tipster, both versions will be manufactured using TSMC’s N2P process, as is expected all along.

To back up the claim, the tipster points to a basic reality of chip development: designing and manufacturing an advanced mobile processor is not something companies can change on short notice.

The full development cycle—from IP design to a finished system-on-chip—typically takes around two years. As a result, it would be nearly impossible for a chip expected to be commercially available as early as the third quarter of this year to switch manufacturing processes or foundry partners at short notice. The reasoning makes sense if we think through it.

Still, this doesn’t mean Samsung is completely out of Qualcomm’s plans. During CES 2026, Qualcomm CEO Cristiano Amon confirmed that discussions between Qualcomm and Samsung are ongoing. While he didn’t point to any specific product, his comments suggest that a collaboration could still happen down the line.

As always with early chip rumors, the full picture will not be clear until Qualcomm makes things official.

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The post Snapdragon 8 Elite Gen 6 won’t be made by Samsung, says new rumor appeared first on Gizmochina.

Qualcomm is rumored to be preparing two versions of its next flagship smartphone chip. The Snapdragon 8 Elite Gen 6 could include a standard and a higher-end Pro variant, with a new rumor now claiming the latter will have clock speeds close to a desktop processor. 

A post on Weibo from well-known tipster Fixed Focus Digital claims that early testing of Qualcomm’s upcoming chip has already hit clock speeds of 5GHz. The tipster goes further, suggesting the absolute ceiling could land somewhere between 5.5GHz and 6.0GHz, though they note that 5.5GHz is the more realistic target.

The jump in core speed is said to be made possible by the use of HBP (Heat Pass Block) technology, a thermal solution developed by Samsung for its Exynos 2600 chip. HBP integrates a heatsink directly into the chip package, allowing heat to dissipate more efficiently.

While the post doesn’t explicitly name the Snapdragon 8 Elite Gen 6 Pro, the details closely match what’s expected from Qualcomm’s next-generation flagship processor.

2nm fabrication also contributes to higher clock speed

For comparison, the current Snapdragon 8 Elite Gen 5 tops out at around 4.61GHz on its performance cores, with slightly higher clocks rumored for select Galaxy-exclusive variants. Crossing the 5GHz threshold would be a notable milestone for mobile chips, even if those speeds are difficult to sustain in everyday use.

Another factor working in Qualcomm’s favor could be a move to TSMC’s newer 2nm N2P manufacturing process. It should naturally deliver improved efficiency alongside higher peak frequencies.

It’s also worth noting that Qualcomm is already comfortable marketing 5GHz-class silicon on the PC side, with chips like the Snapdragon X2 Elite Extreme. Bringing similar numbers to smartphones seems like the next logical step, even if the thermal realities of phones continue to keep those speeds in check.

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The post Snapdragon 8 Elite Gen 6 Pro could hit 5GHz, possibly even 6GHz appeared first on Gizmochina.

Reliable tipster Digital Chat Station has shared fresh insights into the roadmap of next-generation flagship smartphones, building on an earlier post that discussed launch timelines for upcoming Dimensity-powered devices. In that earlier update, he suggested that at least either Oppo or Vivo could launch an iterative flagship as early as September. He also hinted that delaying ultra-premium models until April may not align well with faster chipset refresh cycles, especially for so-called “Ultra” variants.

The tipster contrasted this with Xiaomi’s established rhythm, where standard and Pro models typically arrive around September, followed by Ultra models towards the end of the year. He suggested that other brands may benefit from adopting a similar staggered launch strategy to better match chipset evolution.

Rumored chipsets for Pro Max and Ultra flagships

In his newer Weibo posts, DCS claims that if Oppo and Vivo move forward with Pro Max-branded models, these devices are likely to feature MediaTek’s upcoming Dimensity 9600 series chip built on TSMC’s N2P (2nm) process. He describes this as a full-performance flagship platform, indicating that Pro Max models may prioritize sustained performance and scale.

At the same time, he suggests that Qualcomm’s next Snapdragon 8 Elite Gen 6 Pro, identified internally as SM8975, may be reserved exclusively for Ultra-branded premium, imaging-focused flagships rather than mainstream Pro or Pro Max devices. In replies, DCS further notes that both the Snapdragon 8 Elite Gen 6 and its Pro variant are expected to be manufactured on a 2nm process by TSMC, but with clear segmentation between standard iterative flagships and top-tier models.

He also reiterates that multiple brands under the OV and “H” umbrella are planning Pro Max variants for their next flagship cycles, adding that one brand, abbreviated as “MH” has already introduced such a model in the current generation. Here, “H” appears to be Honor and “MH” seems to be Huawei, which has already launched the Huawei Mate 80 Pro Max.

While none of this has been officially confirmed, the posts collectively point towards tighter launch schedules, clearer flagship tiering, and more aggressive adoption of next-generation silicon across major Chinese smartphone brands.

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The post Snapdragon 8 Elite Gen 6 and Gen 6 Pro tipped to power Ultra, Pro Max flagships, both built on 2nm appeared first on Gizmochina.