There are going to be two variants of the chip, which actually makes sense, as even the Snapdragon 820 has two variants. The first version (faster) MSM 8996SG (001-Y8) will come with second generation performance Hydra CPU clocked at 2.35GHz. Now, we aren’t exactly sure of what to expect from the Hydra CPU but last year, there were rumors about Qualcomm working on Hydra cores which will be custom made for the server market. However, later the rumors died down, so we aren’t sure whether this CPU has any resemblance to the earlier rumored one.

The GPU is still Adreno 530 clocked at 653MHz. Other features include LPDDR4 RAM support, 3x CA @ 60MHz and CDMA. The less powerful model, namely the MSM8996SD (001-Y8) comes with the same CPU clocked at slightly lower 2.15GHz with Adreno 530 GPU at 624MHz.

RELATED: LeEco Flagship said to feature Snapdragon 821 and 8GB RAM!

According to the latest information, Xiaomi should be the first model with the new Snapdragon 821 chip. It could either be the Mi Note 2 or the Mi5S model. Soon, other manufacturers like LeEco should follow Xiaomi in releasing a Snapdragon 821 powered flagship in the market.

(via 1 , 2)

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We have been hearing rumors that LeEco is soon going to announce a new flagships smartphone with the new Snapdragon 821 chipset inside. The new chip is supposed to be a slightly upgraded version of this year’s Snapdragon 820 flagship chipset, increasing the clock speed to 2.5GHz. Now, LeEco’s upcoming flagship phone was spotted on the AnTuTu benchmarking app revealing key specs and performance. The model number LEX720 is powered by Qualcomm Snapdragon 8996Pro chipset, which should either be called as the Snapdragon 821 or Snapdragon 823.

As for the other specs, the LeEco LEX720 model features 4GB RAM and 32GB of internal storage on board. The screen size is unknown but the resolution will be 1080p. At the back, the phone comes with a 16MP camera, while up front, you have an 8MP shooter. The LE720 is running Android 6.0.1. These specs are quite impressive and hence, the performance is also pretty good. In fact, it is one of the best we have seen on AnTuTu till date. This particular model managed to score an amazing 154,000 points on the benchmarking app.

Apart from the powerful Snapdragon 821 / 823 chipset inside, rest of the specs, as you can see, are normal flagship stuff. In fact, the Le Max 2 flagship comes with a better rear camera (21MP) and larger RAM 6GB module. But there could be a higher-end model of the LEX720 which could turn out to be the true flagship smartphone of the company. Previous rumors have said that the phone could have a version with 8GB of RAM. So, with SD821 and 8GB RAM inside, the upcoming LeEco phone could turn out be the most powerful handset of 2016.

RELATED: LeEco said to release an SD823 powered flagship at MWC Shanghai by the end of June

The company has a new conference on June 29. So let’s wait and watch!

The post LeEco’s New LEX720 Smartphone With SD821 Scores Over 154K On AnTuTu appeared first on Gizmochina.

Recently, we heard that the ASUS Zenfone 3 Deluxe model, which is the top-end variant in the lineup will have another version reportedly sold in some Asian countries. The major difference in the new model would be that it will be powered by the Snapdragon 823 chipset. However, now, we have just spotted a promotional material of the ASUS ZenFone 3 Deluxe which reveals that the phone is powered by Snapdragon 821 and not Snapdragon 823. So, the SD821 powered variant of the device could be announced later.

From what we could make out from the promotional material of the device, it looks like the Snapdragon 821 chip will upgrade the clock speed to 2.3GHz. The Snapdragon 820 is clocked at 2.15GHz, so this will be a slight upgrade. Rest of the specs seems to be the same, like 14nm manufacturing node, and Adreno 530 GPU. So, this could be the overclocked version of the chipset.

But, what about Snapdragon 823? Well, earlier we had heard rumors that Snapdragon 821 was renamed to Snapdragon 823, but looks like that didn’t happen. Further, IHS analyst Kevin Wang said earlier today that the flagships of the second half of 2016 will be powered by Snapdragon 821 and not Snapdragon 823.

The name doesn’t matter much. Whether it’s called the Snapdragon 821 or Snapdragon 823, the chip would just be a gentle upgrade to the existing Snapdragon 820 SoC. This makes sense, because 820 is already a powerful chip, and even if it was going to be upgraded within a year, it should be only a gentle one.

What are your thoughts? Do we need an even faster Snapdragon chip for 2016 flagships?

The post ASUS ZenFone 3 Deluxe May Feature Snapdragon 821 Instead of 823 appeared first on Gizmochina.

LeEco surprised us everyone by announcing the first Snapdragon 820 powered smartphone in the market, namely the Le Max Pro. Although the phone wasn’t sold to the regular consumers in plenty, the company does hold the title of the first manufacturer with SD820 phone. Now, it looks like this Chinese company is going to boast of another great title this year.

According to Chinese media, LeEco is said to be working on a brand new Snapdragon 823 powered smartphone and it is expected to be announced at Mobile World Congress at Shanghai that starts at the end of this month, from June 29 and goes on till July 1. If true, LeEco will probably become the first smartphone maker to release a Snapdragon 823 powered phone!

According to rumors, Snapdragon 823 will come with slightly upgraded specs as compared to the already powerful SD820. The company is said to have increased the clock speed, with other upgrades such as Adreno 530 GPU, X12 LTE baseband and Cat.12 / 13 support. Other possible specs include support for 8GB DDR4 memory and 25MP camera sensor. The Galaxy Note 6 is long rumored to be using this new chip and so is the ASUS ZenFone Deluxe model for some Asian markets.

The Snapdragon 820 is already a powerful chipset and there’s hardly any other chips in the market that can match the performance of this beast. So, it would be interesting to see what the Snapdragon 823 brings to the table. We expect a slight boost in performance (because there’s actually no need for a significant increase right now) along with GPU and some connectivity upgrades as mentioned above.

Considering Snapdragon 820 smartphones started entering the market by February 2016, it would be really surprising if Snapdragon 823 phones make it to the market so early. Qualcomm usually follows yearly release period for its chips, but looks like that’s changing this year.

Anyway, it’s still too early to comment as we don’t have official details, but expect more details soon.

The post LeEco Said To Release A New Snapdragon 823 Flagship at MWC Shanghai this month appeared first on Gizmochina.

ASUS never fails to disappoint when it comes to releasing multiple versions of their flagship devices. And a few days after announcing their line-up for 2016 at COMPUTEX, we are already hearing rumours of a Qualcomm Snapdragon 823 variant for the Zenfone 3 Deluxe.

For those who do not know, the Snapdragon 823 is actually a beefed up SD820 clocked at a higher speed. The original Deluxe features a Snapdragon 820 clocked at 2.15GHz and has a starting price of $499. But if you do need the extra processing power, you should be ready to shell out a few more bucks. The SD823 Deluxe is expected to be released in certain Asian markets which includes India and the Philippines in August.

ASUS is however not the only company to have a snapdragon 823 phone in the works. The upcoming Samsung Galaxy Note 6 (or 7), the Xiaomi Mi Note 2, and Nubia X8 are said to feature the same SoC.

While this is the first of the variants, I have a feeling it won’t be the last. We should keep our fingers crossed for other versions. Most likely one that features a Mediatek SoC.

(via)

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Last week, we reported that Cubot was coming up with a high-end smartphone called simply as the Cubot S9. This will be the second major device from the company after announcing and releasing the Cubot Cheetah smartphone in partnership with Cheetah Mobiles. But unlike the Cheetah, the Cubot S9 is going to be a powerful flagship device, with real flagship specs. The company seems to be working on some powerful hardware for the device, and now, we have more details about the phone’s body and color options.

The Cubot S9 will reportedly come with a hard aluminum alloy coating (Al-Zn-Mg) which is usually used in industries like aerospace and military. Along with the strong surface coating, the company will also offer six color options for the upcoming device, namely, blue, gold, pink, red, silver and space gray. This will make sure you can find the perfect color for the device.

While we haven’t seen the device in real life, and most likely won’t for the next few months, the alleged specs of the device are going to be monstrous. The phone is said to feature the Snapdragon 823 chip which should succeed the existing SD820 chip. There will be 6GB of RAM and 128GB of internal storage. The display is said to be from Sharp of 5.4-inches, but with unknown resolution. Cubot has a couple of slim handsets, and this will be an addition to the lineup with its thin 6.5mm body. Other features of the device include 2800mAh battery with Quick Charge, Android 6.0, semi-circular Touch ID, dual 16MP cameras and 8MP front facing one. What’s also interesting is that Cubot S9 probably will get rid of the 3.5mm headphone jack, in favor of a USB Type-C based headphone output.

These are some very powerful specs, which also means that you won’t probably see the Cubot S9 flagship anytime soon. Snapdragon 823 is still unannounced and there are some other features as well, which is yet to become mainstream. So, don’t keep you hopes too high thinking that you can get the device in the next couple of months.

Still, if Cubot is working on the S9, we would definitely like to see the company’s take on such high hardware. You can read more about this device from the official company page.

The post Cubot S9 Is A High-End Flagship Which Comes in 6 Color Options appeared first on Gizmochina.

Since we have detailed information about the three chipsets, here’s everything summarized below.

Snapdragon 823:

According to today’s leak, the Snapdragon 823 will be the first one to meet us among the three chips. It will be announced in the second quarter of 2016.

Qualcomm will reportedly continue to use 14nm LPP process to manufacture Snapdragon 823. It was supposed to be called as the Snapdragon 821, but it will now be known as Snapdragon 823. There will be four Kyro 100 cores inside which are most likely clocked at faster speeds. The chip will continue to use Adreno 530 GPU, but it should feature some upgrades as well. It will come with the X12 LTE baseband with Cat. 12/ 13 LTE support. Other features mentioned in the leak include QC 3.0 support and 600Mbps maximum download speeds.

Given the timing of the announcement of the chip, this should be the one that should end up in new generation Android flagships debuting later this year. So, we will probably find it inside the Galaxy Note 6 model.

Snapdragon 828:

Next up is the Snapdragon 828 which will be manufactured using the next generation 10nm FF process. The chip will use Kryo 200 cores but we are not quite sure whether it will continue with the quad-core architecture. Moving on, there will be Adreno 519 GPU inside with X12 LTE and Cat. 12/ 13 LTE support. The GPU is lower than the other two chips, and even Snapdragon 820. But it will support 4K x 2K video recording at 60 fps and LPDDR4X memory.

The chip will reportedly be announced only in the fourth quarter of 2016. So, there’s still time for more details.

Snapdragon 830:

Coming to the flagship Snapdragon 830 chip, it will feature Kryo 200 cores and will be manufactured on the 10nm FF process. No details on the core architecture inside, but the GPU will be upgraded to Adreno 540. Also, it will feature a new baseband X16 model and will support maximum download speeds up to 980 Mbps. Other features include 4K x 2K video recording at 60 fps and LPDDR4X support.

Like the Snapdragon 828, the new Snapdragon 830 is set to be announced in the Q4 2016. So, expect flagships of 2017 to be powered by this chip.

So, that was it. The table below gives out some more details about these three chips. Check that out. Also, like always, we are not entirely sure of this leak, so better take this leaked table with a pinch of salt.

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