Thanks to a previous leak, we already knew a lot about the Qualcomm Snapdragon 835 chipset before its official unveil. Now that Qualcomm has officially revealed all the details about the new chipset at CES 2017, we can confirm that the details leaked before were true. Along with the improvement in general performance, which we see in every new iteration of Snapdragon chips, the Snapdragon 835 will make sure that it improves VR experience as well as efficiency. The chip consumes 50 percent less power as compared to Snapdragon 801 which was released in 2014 and up to 25 less power as compared to last year’s Snapdragon 820, thanks to its more efficient 10nm manufacturing node.

As for the main specs, the Snapdragon 835 features two clusters, a performance cluster with four cores clocked up to 2.45GHz and an efficiency cluster with four cores clocked up to 1.9GHz. The chip comes with faster 3D graphics and more colors, improving VR and AR support. It features the new Adreno 540 GPU with support for OpenGL ES 3.2, DX12 and Vulkan. Thanks to it’s improved VR capabilities, Qualcomm reveals that the chip can be found in many dedicated VR headsets. One such example is the new mixed reality headset from the wearables company ODG, which features the new SD835.

The new chip supports Quick Charge 4.0 which is 20 percent faster than QC 3.0 and is better equipped to protect the phone from overcharging. The company claims that the tech will provide up to 5 hours of usage in just 5 minutes of charging. Other improvements in the chip include enhanced ‘true to life’ sound, native support for optical zoom and new age autofocus, electronic image stabilization, and support for Ultra HD 4K Premium playback (including HDR 10).

RELATED: ASUS could beat Xiaomi and Samsung to release the first Snapdragon 835 Flagship

The Snapdragon 835 comes with Qualcomm Location which supports major systems such as GPS, BeiDou, GLONASS, Galileo, and QZSS. As for connectivity, the chip comes with Snapdragon X16 LTE model with Cat 16 LTE support, 802.11ad multi-gigabit Wi-Fi, and Bluetooth 5.

You can read more about the features of the new SD835 from here.

Also, you can also read more stories from CES 2017 here.

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Qualcomm has officially confirmed that it will reveal the brand new Snapdragon 835 chipset in detail at the upcoming CES event in Las Vegas. But someone decided to leak the details of the chip a couple of days in advance.

According to the new set of leaked images, the Snapdragon 835 will use a Kryo280 octa-core architecture. The company claims the 280 is its most efficient architecture till date, which really sounds exciting. Further, thanks to the improved efficiency, the Snapdragon 835 boasts of 50% power reduction as compared to the old Snapdragon 801 chip. This means in 2017, we will have not only powerful smartphones but also phones which will last longer than previous generation models.

RELATED: Qualcomm Snapdragon 835 Geekbench Results

So, there will be two sets of cores in this architecture — 4 x performance cores @ 2.45GHz and 4 x efficiency cores @ 1.9GHz. The Snapdragon 835 also comes with a faster Adreno 540 GPU with support for DX12, OpenGL, ES and Vulkan applications. Other noted features of the new chip include Hexagon 690 DSP, Spectra 180 and the fast X16 LTE modem. The processor also comes with support for Qualcomm Haven Security (full biometric suite).

Since the SD835 is based on 10nm process, its smaller and much more compact than Snapdragon 820. This will translate into thinner and smaller smartphones, with more room for other components like battery.

Overall, the Snapdragon 835 processor seems to be a worthy update to the powerful SD821.

Note that these are just leaked images which haven’t been confirmed by the company yet. But the details are in line with what we expected from the chip.

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Qualcomm officially announced its next generation flagship processor dubbed Snapdragon 835 a couple of days back. The company left off short of announcing the parameters of the new processor but did reveal that it uses Samsung’s 10nm FinFet technology and would make its debut in smartphones in the first half of next year 2017.

Details have now emerged that the Snapdragon 835 chipset is actually spotting the model number MSM 8998 which we first spotted on an import listing on Zauba sometime back. Just that the chip was rumored then as Snapdragon 830. The key specs of the latest Snapdragon chip was also leaked recently and is revealed to use an upgraded version of the 64 autonomous Kyro 200 architecture with four large and four small octa-core design. The frequency is not yet known.

In addition, the Snapdragon 835 is listed as using the new Adreno 540 GPU which would likely give it a superior graphics performance. The chip also integrates LTE X16 baseband and supports LTE Cat.16. The processor is said to offer a blazing download speed of up to 1Gbps. The SD 835 chipset also supports four-channel LPDDR4X-1866 memory as well as UFS2.1 flash memory.

Apart from the Snapdragon 835, the leaked photo also reveals the specifications of the new Qualcomm Snapdragon 660 processor built on Samsung 14nm FinFet LPP manufacturing process and having a maximum clock speed of 2.2GHz. The Snapdragon 660 processor also integrates Adreno 512 GPU. The chip also uses X10 baseband that supports two channel LPDDR4X-1866 memory, as well as UFS 2.1 flash memory.

Read More: Qualcomm Snapdragon 835 SoC Announced: 10nm FinFet Process & Quick Charge 4.0

The Snapdragon 835 chipset would enter production in the first quarter of 2017 and its first production is projected to be on the Samsung Galaxy S8 flagship which would be unveiled at next year’s MWC. On the other hand, the Snapdragon 660 chip would enter into production in the second quarter of 2017.

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