If previous reports are to be believed, TSMC is not getting satisfactory yield from its 3nm process node. The Taiwanese company is stuck at 55% while even Samsung has apparently managed to get a 60% yield. But it seems TSMC is planning rebound as an executive has now confirmed a more advanced 3nm process is in development. There have also been comments about the semiconductor industry’s fate in the coming future.

The new version will bring performance improvements

TSMC cut the ribbons off its 3nm process towards the end of last year. A lot of big names are looking forward to the development of this process node. Reports suggest Apple’s upcoming A17 and M2 chips will be based on the new processor. But it may not be very economical for TSMC due to poor yield.

However, the semiconductor company is working on a more powerful version of its 3nm process technology (Via ITHome). Luo Zhenqiu, general manager of TSMC (China) Co., Ltd., made the announcement at the 2023 World Semiconductor Conference in Nanjing. He said that TSMC has been preparing to launch the new process node since it began mass production of 3nm chips in the fourth quarter of last year. The new process node is expected to offer significant performance improvements over the current 3nm node.

The TSMC exec also notes that the global semiconductor industry is currently valued at between $500 billion and $600 billion. It is projected to reach $1 trillion by 2030. According to Lu Zhenqiu, the market distribution is expected to be as follows: high-computing power products will account for 40%, mobile computing (mobile phones) will comprise 30%, high-growth industries will represent 15%, and smart wearable devices will make up 10% of the market.

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(Via)

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