If you’ve used an Android smartphone before, high chances are that your smartphone is either powered by a Qualcomm Snapdragon or MediaTek Dimensity processor. But recently, there’s a third player slowing growing into the smartphone space, and their name is UNISOC, with their UNISOC 5G SoC (System-on-a-Chip) for Android smartphones.

UNISOC, formerly known as Spreadtrum, is a Chinese fabless semiconductor company headquartered in Shanghai which produces chipsets for Android smartphones. UNISOC chipsets have passed the validation of more than 260 carriers from 133 countries worldwide. Some of their high-profile customers for purchasing their processors include HONOR, realme, vivo, Samsung, Motorola, Hisense and ZTE for their smartphones.

Out of their entire lineup currently available, in this article, we’ll be comparing whether UNISOC’s four 5G smartphone processors can compete with the big boys in the market, which are known as MediaTek and Qualcomm respectively. 

UNISOC has four notable 5G smartphone processors, which are the UNISOC T750, T760, T770, and T820. One of these 4 processors can be listed as a Tier C performing processors, whereas the other remaining 3 can be viewed as C+ performing processors.

Tier C: Low Performance Processors

Starting off with the only Tier C processor from UNISOC is the UNISOC T750. It comes with 5G connectivity,  2 ARM Cortex A76 CPU performance cores and 6 ARM Cortex A55 CPU efficiency cores. The GPU under the hood is the ARM Mali-G57 MP2 which is equivalent in performance to the ARM Mali G57 MC2, and the Qualcomm Adreno 618. 

As seen above, the UNISOC T750 is approximately equivalent to the Qualcomm Snapdragon 730 found on the Samsung Galaxy A71 (2019) or the MediaTek Dimensity 6080 found on devices like the Redmi Note 13 5G and Redmi Note 11S 5G. However, manufactured on the newer TSMC 6nm process, the UNISOC T750 has several benefits over the Snapdragon such as better performance and better power efficiency.

The UNISOC T750 was released in May 2023 and is expected to arrive in Android devices by 2023 Q4.

Tier C+: Better Low Performance Processors

Next are the 3 Tier C+ processors from UNISOC, which are respectively the UNISOC T760, T770, and T820. All 3 feature the same CPU core configuration which 4 ARM Cortex A76 CPU performance cores, and 4 ARM Cortex A55 CPU efficiency cores, which is actually the same core configuration as the flagship Qualcomm Snapdragon 855 mobile processor found on the OnePlus 7 Pro, and Xiaomi Mi 9T Pro (Redmi K20 Pro). 

However, where these 3 UNISOC processors differ from the Snapdragon 855 is their GPU. Powering the T760, T770 and T820 is the ARM Mali G57 MP4 GPU, which is much behind the Adreno 640 on the Snapdragon 855, and closer to the Adreno 620 on the Snapdragon 765. Still the 4+4 CPU configuration allows the UNISOC processors to be ahead of its competitors by providing a flagship-type CPU core configuration at an affordable price despite the underpowered GPU.

The UNISOC T760, T770 and T820 can be found in devices like the Hisense P50 5G, ZTE Blade A73 5G, and the recently released ZTE Nubia Neo 5G, the company’s budget gaming smartphone from Nubia.

In conclusion, UNISOC processors are not useless, and in fact, they are quite underrated at the price that they are offered. UNISOC’s small portfolio of 5G smartphone processors is not competitive with the high-end processors from MediaTek and Qualcomm. However, at an affordable price, the UNISOC processors still have a place for “better than expected” performance in low-end Android smartphones.

RELATED:

• ZTE Blade A73 5G launched with 90Hz display, Unisoc T760 chip, and 5,000mAh battery
• Nubia Neo 5G gaming phone launched with 120Hz display, Unisoc T820, 50MP dual cameras
• The Cool new Redmi Note 13 Pro+ AAPE Trend Limited Edition is available on Giztop
• Redmi Note 13 Pro+ launched with IP68 rating, curved display, Dimensity 7200 Ultra chip, and more
• Redmi Note 13 Pro Plus offers several premium features at mid-range price

The post UNISOC 5G Processors in 2023: Underrated or Useless? appeared first on Gizmochina.

The ZTE Blade A73 5G smartphone has been announced in Malaysia. It has arrived as the successor to the Blade A72 5G, which debuted in June 2022. The major highlights of the smartphone include 5G connectivity, an HD+ display that offers a 90Hz refresh rate, a big battery, and large internal storage. Here is a look at the specifications, features, and price of the device.

ZTE Blade A73 5G specifications and features

The Blade A73 5G has a 6.52-inch IPS LCD panel with a waterdrop notch. It offers an HD+ resolution of 720 x 1600 pixels, a 20:9 aspect ratio, and a 90Hz refresh rate. For security, the device is equipped with a s side-facing fingerprint scanner. It comes preloaded with Android 13, which has a layer of ZTE’s UI on top.

The Blade A73 5G has the Unisoc T760 chipset onboard that brings support for 5G connectivity. It comes with 4 GB of RAM, 4 GB of virtual RAM, 128 GB of storage, and a microSD card slot for more storage. The device includes a 5,000mAh battery.

The A73 has a 5-megapixel camera on the front. The rear shell of the phone features a circular camera module, which houses a 50-megapixel main camera, a 2-megapixel depth lens, and an LED flash. The device offers other features, such as dual SIM, 5G, WI-FI 802.11ac, Bluetooth 5.2, GPS, NFC, a USB-C port, and a 3.5mm headphone jack.

ZTE Blade A73 5G price and availability

The ZTE Blade A73 5G is priced at MYR 749 (~$164) in Malaysia. It comes in one color, grey. It is unclear which other markets will receive the handset.

RELATED:

• ZTE F50 5G Portable Wi-Fi up for pre-sale in China for 499 yuan ($70)
• ZTE XiaoXian 50 5G with 6.52″ display, 50MP selfie camera launched in China
• ZTE Blade V50 Design 5G with 6.6″ 90Hz display, 50MP camera launched
• How to Send Video Messages on WhatsApp
• Lofree FLOW Mechanical Keyboard Review: Low-profile + Gasket? Impressive!

The post ZTE Blade A73 5G launched with 90Hz display, Unisoc T760 chip, and 5,000mAh battery appeared first on Gizmochina.

A new Hisense smartphone with model number HNR553T has received certification from the TENAA agency of China. The listing has revealed the entire specifications and images of the device. According to WHY LAB, the handset will be heading to China with the Hisense F70 moniker.

Hisense F70 specifications

The Hisense F70 has a 6.81-inch LCD panel that offers a Full HD+ resolution of 1080 x 2400 pixels. The TENAA images of the phone have a waterdrop notch display. It has a front camera of 8-megapixel for capturing selfies and video calls.

The rectangle-shaped camera module has a 48-megapixel primary camera. It is coupled with an 8-megapixel secondary lens, and a pair of 2-megapixel sensors, which may help in capturing macro images and depth shots.

The device is powered by an unknown 2.2GHz octa-core processor. According to the tipster, it is equipped with a Unisoc T760 chipset, LPDDR4x RAM, and UFS 3.1 storage. The TENAA listing states that the device will arrive with 4 GB / 6 GB / 8 GB / 12 GB of RAM and 64 GB / 128 GB / 256 GB / 512 GB of internal storage.

The Hisense F70 will come with a 5,000mAh battery (4,860mAh rated battery). The 3C certification of the device has revealed that it may carry support for 18W fast charging. The handset measures 170 x 78.8 x 8.35mm and weighs 214 grams. There is no word on the launch date of the device.

RELATED:

• Hisense Exec claims TV Price Wars is hampering innovation in the industry
• Hisense unveils new U and A lineup of TVs with up to 4K-res and 120Hz refresh rate
• Hisense 98E7G Pro is the brand’s first smart TV with a giant 98-inch ULED screen

The post Alleged Hisense F70 full specifications, images revealed, launch seems imminent appeared first on Gizmochina.

UNISOC, the Chinese semiconductor company, has revamped its line of 5G chipsets. Going forward, its 5G chipsets will be announced under a new line called Tanggula. The manufacturer revealed the name was adopted from the name of the source of the Yangtze River.

The new line is classified into four series – the Tanggula 6, Tanggula 7, Tanggula 8, and the Tanggula 9 series which will take on Qualcomm’s Snapdragon 800 series.

According to UNISOC, the Tanggula 6 series are entry-level chipsets, the Tanggula 7 series brings a user upgrading experience, the Tanggula 8 series brings leading performance, and the Tanggula 9 series brings cutting-edge technology.

At the moment, UNISOC has only unveiled chipsets under the Tanggula 7 series. We expect new chipsets under the other series will be unveiled later.

Tanggula 7 series

The Tanggula 7 series includes three chipsets – the UNISOC T770 (formerly known as UNISOC T7520), UNISOC T740 (formerly known as UNISOC T7510), and the UNISOC T760. Below are their specifications:

UNISOC T770	UNISOC T740	UNISOC T760
6nm EUV process	6nm EUV process	12nm process
2.5GHz 1 x Cortex-A76 + 3 x Cortex-A76 + 4 x Cortex-A55	2.2GHz 1x Cortex-A76 + 4x Cortex-A55	2.0GHz 4x Cortex-A75 + 4x Cortex-A55
Arm Mali G57 FHD+ at 120fps, QHD+ at 60fps	Arm Mali G57 FHD+ at 90fps	IMG9446 FHD+ at 60fps, QHD+ at 60fps
LPDDR4, LPDDR4X (2133 MHz) eMMC 5.1 + UFS 3.1	LPDDR4, LPDDR4X (2133 MHz) eMMC 5.1 + UFS 3.1	LPDDR4, LPDDR4x, LPDDR4y (1866MHz) eMMC 5.1, UFS 2.1
Vivimagic 6.0 Image Engine 4-core ISP architecture Up to 108MP camera	Vivimagic 6.0 Image Engine Up to 64MP quad camera	Up to 64MP
4.8 TOPS	2.4 TOPS	3.2 TOPS
NSA, SA b/g/n/11ac Bluetooth 5.0 GPS, GLONASS, Beidou, and Galileo	NSA, SA b/g/n/11ac Bluetooth 5.0 GPS, GLONASS, Beidou, and Galileo	NSA, SA b/g/n/11ac Bluetooth 5.0 GPS, GLONASS, Beidou, and Galileo

UNISOC has also announced that the UNISOC T770 will enter mass production and be launched in July 2021.

The semiconductor company also announced its plans for AR. It said it will co-develop a pair of 5G AR smart glasses with the Chinese company Hiscene (HiAR). However, it didn’t say when the smart glasses will hit the market.

RELATED:

• Motorola Moto G20 launched with UNISOC T700 SoC, IP53 rating, and 90Hz display
• “Snapdragon 888 Pro” already being tested by Chinese manufacturers, should hit the market in Q3
• MediaTek seeks to shift to advanced 4nm chipmaking process ahead of Qualcomm
• TSMC secures 5nm & 6nm orders from Qualcomm, new chips to launch in H2 2021

The post UNISOC Tanggula series of 5G processors unveiled; AR glasses in development appeared first on Gizmochina.