UNISOC, the Chinese semiconductor company, has revamped its line of 5G chipsets. Going forward, its 5G chipsets will be announced under a new line called Tanggula. The manufacturer revealed the name was adopted from the name of the source of the Yangtze River.

The new line is classified into four series – the Tanggula 6, Tanggula 7, Tanggula 8, and the Tanggula 9 series which will take on Qualcomm’s Snapdragon 800 series.

According to UNISOC, the Tanggula 6 series are entry-level chipsets, the Tanggula 7 series brings a user upgrading experience, the Tanggula 8 series brings leading performance, and the Tanggula 9 series brings cutting-edge technology.

At the moment, UNISOC has only unveiled chipsets under the Tanggula 7 series. We expect new chipsets under the other series will be unveiled later.

Tanggula 7 series

The Tanggula 7 series includes three chipsets – the UNISOC T770 (formerly known as UNISOC T7520), UNISOC T740 (formerly known as UNISOC T7510), and the UNISOC T760. Below are their specifications:

UNISOC has also announced that the UNISOC T770 will enter mass production and be launched in July 2021.

The semiconductor company also announced its plans for AR. It said it will co-develop a pair of 5G AR smart glasses with the Chinese company Hiscene (HiAR). However, it didn’t say when the smart glasses will hit the market.

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