Redmi is expected to unveil the Redmi K50 series as early as this month. Ahead of that, the smartphones in the lineup have started getting necessary certifications. Three models have now made their appearance on TENAA.

According to Digital Chat Station, three Redmi K50 series phones have been certified by TENAA. These devices bear model numbers 22021211RC, 22041211AC, and 22011211C respectively.

The tipster says that these handsets are powered by MediaTek Dimensity 9000 chipset. Qualcomm Snapdragon 870 SoC, and unannounced MediaTek Dimensity 8000 chip. However, he specifically doesn’t mention the silicon associated with the aforementioned models.

According to earlier reports, the Redmi K50 series smartphone with model number 22021211RC will be powered by a Snapdragon 870 chipset. Further, the one with model number 22041211AC was previously said to house a yet-to-release Dimensity 7000 chip. For the unaware, this SoC is now rumored as Dimensity 8000.

Lastly, the phone with model number 22011211C was earlier reported to feature a Qualcomm Snapdragon 8 Gen 1 silicon. However, Digital Chat Station does not list this chipset in his post. Instead, he mentioned Dimensity 9000. Hence, this particular device could come powered by the latest flagship chip from MediaTek, rather than Qualcomm.

We expect these handsets to get more certifications in the coming days. At the same, we are also looking forward to the official teasers from Redmi. In other words, like any other recent smartphone from the Xiaomi group, we expect to learn almost everything about the Redmi K50 family before it goes official.

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MediaTek is expected to announce a lower variant of its newly unveiled Dimensity 9000 SoC. This upcoming chipset is said to go official as Dimensity 7000. Ahead of that, the General Manager of the Redmi brand teases this silicon.

A couple of days back, Redmi GM Lu Weibing teased the yet-to-be-announced Dimensity 7000 chip on Weibo by questioning what kind of processor it is. This clearly suggests that there will be Redmi smartphones powered by this SoC as the executive is known for vague teasers.

Although the Xiaomi group exec doesn’t hint at the device, we can speculate it to be the recently spotted Xiaomi Rubens (L11A), which is expected to house the unreleased MediaTek silicon. Currently, there’s only a Chinese variant of this phone with model number 22041211AC.

As of now, we only know that the handset will feature a triple camera array on the rear. This setup will include a 64MP Samsung ISOCELL GW3 primary sensor.

As far as the marketing name is concerned, it is rumored to go official as Redmi K50 Gaming Standard Edition. While the Xiaomi Matisse (L10) with a MediaTek Dimensity 9000 is said to release as Redmi K50 Gaming Pro.

We look forward to learning more about Xiaomi Rubens before its launch via certifications, leaks, and teasers in the coming days.

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The post Redmi GM teases a Dimensity 7000 smartphone appeared first on Gizmochina.

Last week, we reported on the alleged model numbers of the Xiaomi 12 and the Redmi K50 series of phones. A few days from that, more details about two of those devices have emerged. Let’s take a look at what these handsets have to offer.

Xiaomiui has spilled beans on two upcoming Xiaomi smartphones, codenamed Matisse and Rubens. These devices bear shortened model numbers L10 and L11A respectively. Information about the duo has been found in the MIUI code and the IMEI database.

Xiaomi Matisse (L10)

Xiaomi Matisse will have three regional variants, namely China, Global, and India. This is based on its model numbers 21121210C, 21121210G, and 21121210I registered in the IMEI database.

In China, it will be sold under the Redmi brand, whereas in other markets, it will flaunt POCO branding. As the first four digits of the model numbers of Xioami devices indicate their release year and month, this phone could make its debut in December 2012. 

However, Xiaomiui suggests that Xiaomi may not be able to release it in time as the handset’s software is still in development.

As far as specs are concerned, the smartphone is said to be powered by the recently unveiled MediaTek Dimensity 9000 SoC. It is expected to have either a 120Hz or a 144Hz OLED display with a mixture of Goodix and FPC in-screen fingerprint sensors.

For photography and videography, it will house quad cameras on the rear. The setup will include a 64MP Sony IMX686 primary sensor,  a 13MP OmniVision OV13B10 ultra-wide unit, an 8MP OmniVision OV08856 telemacro shooter, and a 2MP GalaxyCore GC02M1 depth sensor. There’s also a variant of this phone with a 108MP Samsung ISOCELL HM2 main camera.

Lastly, talking about names, the handset is expected to go official as Redmi K50 Gaming or Redmi K50 Gaming Pro in China and POCO F4 GT in other markets.

Xiaomi Rubens (L11A)

Xiaomi Rubens currently only has a ‘China’ variant with model number 22041211AC. Unsurprisingly, the smartphone will feature Redmi branding in its home country. 

Xiaomiui says that this device could go official as Redmi K50 Gaming Standard Edition. That’s because the Chinese Redmi Note 10 Pro 5G, which is sold as POCO X3 GT in international markets was initially called Redmi K40 Gaming Standard Edition in its development stage.

The Redmi Note 10 Pro 5G and the Redmi K40 Gaming house chipsets from the same family, Dimensity 1100 and Dimensity 1200 to be exact. Similarly, Xiaomi Rubens is said to be powered by the unannounced Dimensity 7000 chip, which is rumored to be the toned-down version of Dimensity 9000 expected to feature inside Xiaomi Matisse.

Unfortunately, not much is known about this handset, except that it will have triple rear cameras. The setup will include a 64MP Samsung ISOCELL GW3 primary sensor.

According to its model number, the smartphone is scheduled to go official in April 2022.

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