Xiaomi’s next-generation Xring O3 chip is set to power two upcoming devices, the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max. Among them, the flagship tablet, reportedly carrying the model number M367FC, has already appeared on Geekbench, revealing its core specs and performance. Newer benchmark entries now show the chip crossing the 14,000 mark in multi-core performance.

Xring O3 pushes past 14K on Geekbench

The latest Geekbench listings show the Xiaomi M367FC reaching a peak multi-core score of 14,319, while another entry records 14,153. The single-core scores range from 3,474 to 3,710 across the listed results. These numbers provide an early look at the performance potential of the Xring O3 ahead of its arrival in Xiaomi’s upcoming hardware.

The Xring O3 is listed with a 10-core CPU configuration comprising four cores clocked at 3.15GHz, four at 3.69GHz, and two high-performance cores reaching 4.36GHz. Graphics are handled by a 16-core Mali-G2-Ultra-NX GPU.

Xiaomi has also claimed substantial generational gains, including up to 60% higher CPU performance and an 85% improvement in GPU performance, alongside a 64% increase in GPU power efficiency.

Unlike upcoming 2nm flagship chips from Qualcomm and MediaTek, the Xring O3 is built on a 3nm process. However, it is \ the first mobile chip to support LPDDR6 memory. The Xiaomi 18 Fold and Pad 9 Pro Max are expected to pair it with CXMT’s 16GB LPDDR6 memory, which can reach speeds of up to 12,800Mbps and deliver memory bandwidth of up to 113.8GB/s.

The chip also reportedly delivers 200 TOPS of tensor AI performance, 3.13 TFLOPS of vector AI performance, and up to 45% higher NPU performance. Xiaomi has claimed an AnTuTu score of 5.22 million, potentially making the Xring O3 the first mobile chip to cross five million points.

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The post Xiaomi’s Xring O3 posts over 14K multi-core score on Geekbench with 10-core CPU appeared first on Gizmochina.

Xiaomi just officially unveiled its latest flagship mobile chipset, the Xring O3, and the early independent tests are already making headlines. Building on last year’s solid Xring O1, this new processor is getting a lot of attention for packing strong performance with better efficiency.

According to tests from Chinese outlet Xiaobai’s Tech Reviews (run on what looks like a reference design), the Xring O3 scores 3,854 in Geekbench single-core. That’s roughly in the same ballpark as the Snapdragon 8 Elite Gen 5 and Apple’s A19 Pro, and about 25% better than the previous Xring O1.

The multi-core numbers are even more eye-catching. Its 10-core CPU hits 15,086 points, well clear of the highest Snapdragon 8 Elite Gen 5 scores seen in similar tests (which stayed under 12,000 on devices like the iQOO 15 Ultra). That’s roughly a 55% jump over the Xring O1. And it’s doing all this while being more power-efficient than Qualcomm’s current top silicon.

Graphics performance follows the same trend. In 3DMark’s Steel Nomad Light test, the Xring O3 comes in more than 40% higher than current flagship chipsets and up to 90% higher than last year’s Xring O1. Again, the gains come with better efficiency on a performance-per-watt basis.

What’s especially interesting is that the Xring O3 is built on TSMC’s N3P process, not the newer N2 node that Qualcomm, Apple, and MediaTek are expected to use for their next flagships. Even so, the early data suggests Xiaomi’s chip is in a good position to compete with those upcoming designs. Xiaomi has confirmed the Xring O3 will power devices including the Xiaomi 18 Fold and the Pad 9 Pro Max.

It’s worth keeping in mind that these benchmarks were run on a prototype or reference platform, so they could reflect optimistic conditions. Real-world performance in actual shipping phones will depend on cooling, sustained power limits, and software tuning. Still, the early numbers look promising for Xiaomi’s second-generation custom silicon.

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The post Xiaomi’s Xring O3 impresses in early benchmark tests, scores 15,086 in Geekbench multi-core appeared first on Gizmochina.