Samsung Electronics has officially begun mass producing the world’s first 12GB double-data UFS multi-chip package. The uMCP (Multi-Chip Package) combines UFS 3.0 storage with 12GB of LPDDRX4 RAM, and will power its mid-range smartphones from 2020. The announcement was made at Samsung’s annual Tech Day event at their Device Solutions headquarters in San Jose, California.

The new combo features the four 24-gigabit RAM chips built using the 1y process. 1y is Samsung’s acronym for the second generation chipsets designed on the upgraded 10nm platform. What other manufacturers are calling the 10nm+ architecture, Samsung is calling the 1y. The LPDDRX4 RAM has been tested to reach speeds of up to 4,266Mbps. The chaebol unveiled its first batch of 12GB modules back in March 2019. However, they were based on the smaller 16-gigabit RAM chips. The latest batch is based on four 24-gigabit chips instead.

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Since Samsung is offering this technology to mid-range smartphones too, they have created an alternate device with 10GB of RAM, combining two 24-gigabit chips and two 16-gigabit chips. It is always interesting to see such innovations from the larger players. Since that opens up new opportunities for the smaller players to try something similar. Not to mention, the competition is also forced to try and up their game. After all, no manufacturer to date has offered a mid-ranger with 12GB of RAM. Such a healthy competition is always good for consumers.

Samsung is yet to officially announce the specifications of the UFS 3.0 storage. Although, they should launch a few variants based on multiple storage capacities. It is safe to assume that more players will offer 10GB and 12GB of RAM on their mid-range smartphones once Samsung has made their foray. Even though the 12GB of RAM on an Android device is an overkill, people’s needs have been evolving constantly. With mobile gaming taking the world by storm within the past two years, consumers can expect even better hardware on smartphones soon.