Earlier today (14th December 2021), the OPPO INNO Day 2021 event had officially kicked off. During this conference, the company unveiled a number of new technologies, which included its first self develop NPU chipset, the MariSilicon X.
The Chinese smartphone maker’s Founder and CEO, Chen Mingyong, showcased the new first self developed chipset. As per the official announcement, the new MariSilicon X NPU is an imaging based chipset that was independently designed and developed by the company. The senior executive stated that the chipset was named after the Mariana Trench, which is the deepest part of the world. This particular name was set to signify the great depth of the company’s “imagination” and innovation.
During the announcement, the Founder also added that tech giants need to develop core technologies to be prepared for any challenged that they might face in the future. In other words, this chip is also its step towards more self sufficiency. The new MariSilicon X is manufactured using the 6nm process from TSMC and seeks to improve imaging performance of upcoming Oppo smartphones. The company further added that the new chipset will be available in handsets starting from next year.
The new chipset will offer real time AI computing to improve energy efficiency while also offering “industry leading” ultra HDR capabilities. This chipset would also enable lossless real time RAW captures and maximize the RGBW sensor’s performance as well as offer extreme dynamic range via 20bit HDR. Notably, OPPO also officially announced that this new chipset will be featured in 2022 Find X series flagship phones, which would mark the arrival of the dual chip technology.
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