With the Chinese New Year holidays over, Honor has started teasing its upcoming foldable phone, the Honor Magic V6. It will be rivalled by the Oppo Find N6, which is also debuting around the same time in China as well as globally. Today, Honor rolled out the Magic V6’s first commercial to showcase its design.
Honor Magic V6 red variant revealed
Honor has introduced the Magic V6 in a new “Chitu Red” color variant, featuring a deep red rear panel paired with a gold middle frame that gives the foldable a festive and premium appearance. The back panel carries a velvet-like textured finish with star-track-inspired patterns, while the circular camera module adds to the device’s recognizable identity.
The Magic V6 is scheduled to make its global debut on March 1 at MWC 2026 in Barcelona, Spain. Apart from the new color, the brand is emphasizing improvements in build quality and reliability.
Apart from red, the Magic V6 is rumored to come in shades like gold, black, and white. Some of its color variants may feature a special eco-friendly leather material with nano-level coating designed to enhance durability against scratches, water exposure, and long-term wear. It is also said to be thinner and lighter than the previous generation.
Honor Magic V6 specifications (rumored)
According to leaks, the Honor Magic V6 could feature the Snapdragon 8 Elite Gen 5 chipset, positioning it as a high-performance foldable flagship. The top variant is expected to include a large 7,150mAh battery, which may become one of the biggest capacities seen in a foldable device, along with support for 120W wired charging and wireless charging.
its outer screen will offer a resolution of 2420 x 1080 pixels, whereas its inner display will produce resolution of 2352 x 2172 pixels. However, the exact display sizes are not known yet.
Camera rumours suggest a triple rear setup led by a 200-megapixel primary sensor, supported by an ultra-wide lens and a periscope telephoto camera offering optical zoom capabilities. Additional expected features include proprietary RF and efficiency enhancement chips, full waterproofing, Beidou satellite communication support, and a thinner and lighter design compared to the previous generation.
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