Last week, it was revealed that Vivo will soon be launching the world’s first Hi-Fi headset at the tenth anniversary of Vivo Hi-Fi. A leak from earlier this week claimed the technology will come included in the upcoming Vivo TWS 3 series which is expected to debut alongside the Vivo X90 series on November 22. For those unaware, Hi-Fi is an acronym for high fidelity, which in this context claims to provide an improved listening experience thanks to the high accuracy of audio reproduction.

Vivo
Vivo

Now, the brand has officially teased the TWS 3 series and also confirmed that it will indeed launch on November 22 launch date. The teaser image (via) matches the renders revealed in the earlier reports. In addition to the Hi-Fi technology, the teaser also claims that the Vivo TWS 3 series will also feature 360° spatial audio. The series is expected to comprise two models – the Vivo TWS 3 and the Vivo TFS 3 Pro.

The earbuds are anticipated to have the latest LE Audio Bluetooth audio technology, support Bluetooth 5.3, the first full-link wireless true Hi-Fi in the industry, as well as intelligent ultra-wideband noise reduction, non-sensing body temperature monitoring, LC3 game low Latency, multi-device dual connection, etc.

Other than high-fidelity audio, the earbuds are expected to offer Bluetooth 5.3 connectivity with support for next-generation Bluetooth LE audio technology, wireless karaoke, slide-to-adjust volume, smart wear detection, smart voice control, pressure-sensitive control, and dual-device connection. It is anticipated to provide intelligent ultra-wideband noise reduction, Vlog 3D binaural recording, and non-sensing body temperature monitoring.

The TWS 3 is said to feature a Qualcomm S5 QCC5171 chip, 12.2mm dynamic drivers, an independent DAC chip, a DSP module, and an adaptive equalizer. It is said to come with a transmission rate of up to 1.2Mbps. More information on the Vivo TWS 3 series is expected to surface as we get closer to the official launch, so stay tuned.

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