Xiaomi is all set to unveil the Xiaomi 18 Fold later this month in China. The device will be powered by Xiaomi’s all-new Xring O3 chip, built with a 3nm manufacturing process. Ahead of the expected launch, it has emerged on Geekbench, revealing its AI capabilities.
Xiaomi 18 Fold Geekbench AI listing spotted
As can be seen above, Xiaomi’s upcoming foldable phone has now made another appearance on Geekbench, but this time the listing focuses on its AI performance. The device is identified as the Xiaomi 2608BPX34C, which is believed to be the upcoming Xiaomi 18 Fold, and the listing provides a closer look at its underlying hardware.
The Xiaomi 18 Fold scored 629 in the Single Precision test, 799 in Half Precision, and 634 in the Quantized test on Geekbench AI 1.7.0. The listing shows it has the O3 motherboard, further pointing towards Xiaomi’s upcoming Xring O3 flagship chipset. The chip is listed with a 10-core CPU, comprising four cores at 3.15GHz, four at 3.69GHz, and two performance cores reaching 4.36GHz. The listing also reveals that the device has 16GB of RAM and Android 17.
These results add another piece to the picture around Xiaomi’s next foldable, particularly as the Xring O3 is expected to bring major CPU, GPU and AI improvements. The same chipset is also showing promising numbers on the upcoming Xiaomi Pad 9 Pro Max, which has crossed the 14,000-point mark in Geekbench’s multi-core test. The tablet, listed under model number M367FC, recorded a peak score of 14,319, while another run reached 14,153 points.
The Xiaomi 18 Fold and Pad 9 Pro Max are expected to debut together. Rumors suggest that these devices will launch in the first half of this month, whereas the Xiaomi 18 lineup powered by the Snapdragon 8 Elite Gen 6 may break cover by the end of this montn.
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