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The Honor Win 2 has appeared on Geekbench 6 ahead of its October 21 launch in China. The phone is listed under the model number BRM-AN00 and runs on Qualcomm’s Snapdragon 8 Elite Extreme Gen 6 chipset.
In the benchmark, the phone scores 4,141 points in single-core and 11,514 points in multi-core tests. A separate OpenCL test recorded a GPU score of 34,695.
The listing also reveals a few details about the configuration. The Honor Win 2 runs Android 17 and reports 14.82GB of available memory, suggesting it has 16GB of RAM.
Its processor has model code QTI SM8975, with eight cores arranged across three clusters — three cores run at 3.74GHz, another three reach 4.03GHz, and the two prime cores run at up to 5.01GHz. As we can guess from the layout, the chip is the Snapdragon 8 Elite Extreme Gen 6.
There is a caveat to these results, though. They come from Geekbench 6, an older version of the benchmarking tool, while Geekbench recommends Geekbench 7 for modern hardware. The scores are best compared with results from the same version, and the phone’s performance could change before launch as Honor continues to refine its software.
What else we know about the Honor Win 2
Honor has already opened pre-orders for the Win 2 through its online store in China. The phone will launch alongside two other models, the Honor Win RT 2 and Honor Win Turbo 2. Both the Win 2 and Win RT 2 have also cleared 3C certification, with the certification confirming support for 100W wired charging on the Win 2.
Moreover, a previous report suggests that the Honor Win 2 could be the only phone combining the Snapdragon 8 Elite Extreme Gen 6 with a larger-than-10,000mAh battery, a built-in cooling fan, and a 2K high-refresh-rate display.
The phone follows the original Honor Win, which launched in December 2025 with the Snapdragon 8 Elite Gen 5. The Win 2 is expected to bring a newer processor alongside the reported large battery and active cooling system. Honor will reveal the full specifications and pricing at its launch event in China on October 21.
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