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Honor is reportedly working on a wide range of new devices. Apart from the Win 2 series, which is scheduled to launch on October 21 in China, the company is also said to be developing a wide foldable and a regular foldable phone, which could be called the Magic V7 when it arrives in the Chinese market. In a new Weibo post, reliable tipster Digital Chat Station has leaked the key details of what appears to be the Magic V7.
Honor Magic V7 specifications (rumored)
According to DCS, the alleged Honor Magic V7 will feature a 6.5-inch outer display and an approximately 8.15-inch inner UTG display. For comparison, the Magic V6 features a 6.52-inch outer display and a 7.95-inch inner screen.
The Magic V7’s engineering prototype packs a 50-megapixel 1/1.28-inch SmartSens SC595 ultra-large main camera sensor equipped with variable aperture and RYYB technology, alongside an approximately 50-megapixel periscope telephoto camera.
It is also said to feature a 6,000mAh+ battery and a next-generation flagship chipset. Considering that the Magic V6 features the Snapdragon 8 Elite Gen 5, the V7 could be equipped with a Snapdragon 8 Elite Gen 6 series chip.
To recall, the Honor Magic V6 was announced in March this year and showcased at Mobile World Congress (MWC) 2026. The Magic V7 is likely to debut around the same time next year.
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