MediaTek has officially taken the wraps off its latest chip for mid-range smartphones, the Dimensity 8500. The company announced the processor today at a launch event where it also introduced the Dimensity 9500s.

The Dimensity 8500 is built around an all-big-core design based on TSMC’s N4P (4nm) process. What’s interesting about this setup is that Cortex-A725 cores make up all eight CPU cores, running at different clock speeds. A prime Cortex-A725 core clocks at 3.4GHz, three high-performance Cortex-A725 cores run at 3.20GHz, and four additional Cortex-A725 cores operate at 2.20GHz.

The Dimensity 8400 also uses an all-Cortex-A725 design, but MediaTek says this second-generation all-big-core CPU delivers a 7% performance improvement. The chip also supports faster LPDDR5X memory with speeds of up to 9600Mbps, increasing memory bandwidth by as much as 12%

Dimensity 8500 brings a boost in GPU performance

Where the Dimensity 8500 makes its biggest jump is in the graphics department. The chip uses a new Mali-G720 MC8 GPU, which reportedly delivers 25% higher peak performance than the previous generation while cutting power consumption by 20% at peak load. 

The company is also touting the 8500 as the first chip in its segment to bring “realistic ray tracing” to more affordable flagship-style phones.

As for the actual gameplay, MediaTek says the GPU can deliver stable frame rates above 110fps even in outdoor environments at 35 degrees Celsius. Its Dimensity Multi-Frame Rate technology is further designed to save up to 30% power during gameplay, while MOBA titles can see power savings of up to 37%.

AI, Camera and Connectivity

It’s 2026, so it’s a violation not to talk about artificial intelligence. The Dimensity 8500 uses MediaTek’s NPU 880 for neural processing and supports on-device generative AI features such as real-time translation and image generation. The chip is also compatible with the Dimensity AI Development Kit and major global language models (LLM / MLLM). 

For optics, MediaTek is offering several AI-assisted imaging tools, including an AI Ultra-Clear Telephoto Algorithm, semantic segmentation, and AI-powered reflection and glare removal. Furthermore, you get support for cinema-grade 4K HDR video recording, zero shutter lag, and full-pixel phase detection autofocus.

On the connectivity side, the Dimensity 8500 features a 5G modem capable of download speeds up to 5.17Gbps, along with three-carrier aggregation and dual-SIM dual-standby. MediaTek’s UltraSave 3.0+ technology is also included to help reduce power consumption during network use.

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MediaTek has confirmed that it will hold a launch event on January 15 in China. The teaser released by the brand confirms that it will launch two chipsets on the said date. The Taiwanese chipmaker is expected to officially unveil the Dimensity 8500 as well as a new Dimensity 9-series chip.

Dimensity 9500s, Dimensity 8500 chipset details leaked

According to reports, MediaTek will unveil the Dimensity 8500 and Dimensity 9500s chipsets on Jan. 15. While the Dimensity 9500s will be a completely new chip, the Dimensity 8500 already powers the Honor Power 2, which has just gone official in China.

The Dimensity 8500 is built on TSMC’s N4P process and features an octa-core CPU configuration made up of one Cortex-A725 core clocked at 3.4GHz, three additional Cortex-A725 cores running at 3.20GHz, and four efficiency-focused Cortex-A725 cores operating at 2.20GHz. Graphics duties are handled by the Mali-G720 MC8 GPU.

Reports have revealed that the Dimensity 9500s is manufactured using TSMC’s more advanced N3E process. It comes with a more powerful CPU setup that includes a single Cortex-X925 core clocked at 3.73GHz, three Cortex-X4 performance cores running at 3.30GHz, and four Cortex-A720 efficiency cores at 2.40GHz. The chipset is paired with a Mali Immortalis-G925 MC12 GPU, operating at a frequency of 1612MHz.

Reports have also revealed that the upcoming Redmi Turbo 5 Max series will include two models. Likely, the base model could be powered by the Dimensity 8500 chipset, whereas the higher variant could feature the Dimensity 9500s.

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The flagship phone battle in China is almost settled for this year. What comes next is a wave of sub-flagship models to be powered by the up-and-coming chips from Qualcomm and MediaTek. 

Qualcomm is set to unveil the Snapdragon 8 Gen 5 later this year, and phones powered by it will start showing up soon after. A new leak has now given us a tentative timeframe for the launch of MediaTek’s counterpart.

MediaTek is reportedly working on two smartphone chips: the Dimensity 8500 and Dimensity 9500e. And according to tipster Digital Chat Station, the first phones powered by these chips will not launch until January next year. These phones are also said to have flagship-level specifications and large batteries.

What we know so far

As you might have guessed, the Dimensity 9500e is the more powerful of the two, running at up to 3.73GHz. It reportedly uses a CPU setup of 1× Cortex-X925, 3× Cortex-X4, and 4× Cortex-A720 cores.

The GPU is said to be an Arm G925 MP12 clocked at 1612MHz, and the chip is built on TSMC’s advanced 3nm N3E process.

Meanwhile, the Dimensity 8500 is designed for slightly more affordable phones but still carries a punch. It’s reportedly based on TSMC’s 4nm process and uses an 8-core setup built around ARM’s A725 architecture — meaning all cores are “big” cores. 

The prime core is said to reach 3.4GHz, a small but notable bump from the 3.25GHz seen in its predecessor, the Dimensity 8400. Graphics performance could also get a lift thanks to a Mali-G720 GPU tuned to around 1.5GHz. The Dimensity 8500 reportedly scores around 2.2 million points on AnTuTu. 

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A new leak from well-known tipster Digital Chat Station gives us a pretty detailed look at MediaTek’s upcoming Dimensity 8500 chip.

According to the leak, the Dimensity 8500 is built on TSMC’s 4nm process and uses an 8-core setup based on ARM’s A725 architecture. That means all cores are big cores, like the Dimensity 8400.

The prime apparently hits 3.4GHz, which is slightly higher than 3.25GHz on its predecessor. Whereas the remaining cores could also have higher clock speeds than before. 

On the graphics side, the Mali-G720 GPU is reportedly scaled up and running around 1.5GHz. It’s still early numbers, but the chip reportedly lands around 2.2 million on AnTuTu.

Digital Chat Station claims the GPU’s theoretical performance could beat Qualcomm’s Snapdragon 8 Gen 3 and 8s Gen 4 — at least on paper. Of course, theory doesn’t always match real-world gaming, heat control, or battery life, so it’s better to wait for actual phones before jumping to conclusions. 

The first wave of phones with the Dimensity 8500 is already in testing, according to the leak. One is a mid-range phone with a standard-sized display, while the other is focused on battery life with a large-capacity battery. The rollout has reportedly started quietly.

There’s also a familiar brand name tied to this chip. Back in August, the blogger hinted that the Dimensity 8500 may debut on Xiaomi’s Redmi Turbo line. Honor, OPPO, OnePlus, and vivo are expected to follow with their own models soon after. 

For context, the Redmi Turbo 4 series split its chips between MediaTek and Qualcomm — the base model launched with the Dimensity 8400-Ultra, while the Pro variant picked the Snapdragon 8s Gen 4. 

If the leak pans out, the Dimensity 8500 might slot in as the next step for Xiaomi’s mid-range performance phones. No release date yet, and no confirmation from MediaTek.

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MediaTek is prepping two new chipsets, the Dimensity 9500 and Dimensity 8500. The D9500 is expected to power next-generation flagship phones, such as the Vivo X300 series and the Oppo Find X9 lineup. The D8500, on the other hand, is expected to power mid-tier performance-focused smartphones. Today, tipster Digital Chat Station released a Weibo post to share some details about the D8500 chip and the name of the first phone that will feature it.

Dimensity 8500 to power Redmi Turbo 5, Honor, Realme, iQOO phones

According to DCS, the MediaTek Dimensity 8500 will be a 4nm chip built by TSMC. While the core CPU architecture remains largely unchanged, the Mali-G720 GPU is said to be significantly enhanced. The chip is projected to achieve an impressive AnTuTu benchmark score of over 2 million points.

The Redmi Turbo 5 is expected to be the first phone to feature the Dimensity 8500, with a launch anticipated by the end of this year or early January 2026. This is consistent with other reports that suggest the Poco X8 Pro, which is expected to arrive in the global market in January 2026, will also feature the same chipset. This is understandable, as the X8 Pro is rumored to be a rebranded version of the Redmi Turbo 5.

He added that Honor, Ouga Group (Oppo, OnePlus, and Realme), and iQOO will also launch Dimensity 8500-powered smartphones. Earlier this year, Realme unveiled the Dimensity 8400-powered Realme Neo 7 SE, whereas iQOO announced the Z10 Turbo equipped with the same chip. Therefore, it is likely that the Dimensity 8500 may also power the Realme Neo 8 SE and iQOO Z11 Turbo, expected to launch next year. All these D8500 phones are expected to feature a metal middle frame, indicating a widespread adoption of the said feature.

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