Rapidus, a chipmaker backed by the government of Japan, has announced its new plans for advanced semiconductor technology. The company is seeking to build 2nm prototype process line by the year 2025.

In other words, the Japanese chip venture might be seeking to catch up to the world’s largest contract chipmaker, TSMC. For those unaware, the Taiwan Semiconductor Manufacturing Company is set to start risk production of its next gen 2nm process in 2024. Furthermore, mass production for this cutting edge semiconductor process is also set to begin sometime in 2025. Similarly, even Samsung is rushing to begin production of its 2nm process line by the same year.

Unfortunately, the company has only announced its prototype line’s timeline. The mass production of the advanced process is only slated to begin sometime in the late 2020s. Although, even with this schedule, the Japanese government backed firm is still not too far behind the industry giant, TSMC. The company will also officially finalize its plans regarding the site location for the prototype facility in March. Notably, this site will also be responsible for the mass production later down the road.

Some of the key factors that will influence this decision is the availability of stable water and robust electrical infrastructure. This location should also be able to “attract domestic and foreign talent easily,” as per Rapidus President Atsuyoshi Koike. He stated that “we aim to produce only advanced chips, establishing a high margin business model,” further adding that “We want to bring in engineers from areas that different companies specialize in, in order to create new value”.

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BM and Rapidus have announced a strategic partnership to build advanced semiconductor technology and ecosystem in Japan. As part of the agreement, Rapidus and IBM will further develop IBM’s breakthrough 2 nanometer (nm) node technology for implementation by Rapidus at its fab in Japan.

IBM and Rapidus Partner to Develop Advanced Semiconductor Technology in Japan

IBM and Rapidus have announced a strategic partnership to build advanced semiconductor technology and ecosystem in Japan. As part of the agreement, Rapidus and IBM will further develop IBM’s breakthrough 2 nanometer (nm) node technology for implementation by Rapidus at its fab in Japan.

Rapidus Corporation is a leading developer and manufacturer of advanced logic semiconductors, and was established with the endorsement of major Japanese companies. The company’s partnership with IBM will leverage the latter’s decades of expertise in semiconductor research and design. In 2021, IBM announced that it had developed the world’s first 2 nm node chip, which is projected to achieve 45% better performance or 75% more energy efficiency than leading 7 nm chips.

“It is my great pleasure to announce today that Rapidus has officially partnered with IBM for the joint development of 2 nm node technology,” said Atsuyoshi Koike, President and CEO of Rapidus. “This is a long-desired international collaboration, truly essential for Japan to once again play a vital role in the semiconductor supply chain. I am fully confident that this collaboration will pave the way for our goal of contribution to the well-being of humanity through advanced logic semiconductors produced with technologies jointly developed with IBM.”

The partnership is part of Japan’s initiatives to become a global leader in semiconductor research, development, and manufacturing. As part of the agreement, Rapidus scientists and engineers will work alongside IBM Japan and IBM researchers at the Albany NanoTech Complex owned and operated by NY CREATES in Albany, New York – one of the world’s most advanced semiconductor research facilities.

Rapidus is planning to deploy differentiated strategies in manufacturing, including automation and efficiency, to ensure speed to market and competitiveness. The company expects to start mass-production of its 2 nm technology in the latter half of the 2020s.

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