Samsung Electronics has announced that it has begun mass producing the latest memory solution, LPDDR5 UFS-based multichip package (uMCP). It integrates the fastest LPDDR5 DRAM with the latest UFS 3.1 NAND flash, delivering flagship-level performance to a much broader range of smartphone users.

The South Korean giant reveals that this new uMCP can deliver lightning-fast speed and high storage capacity at very low power. This would allow more consumers to immerse themselves in numerous 5G applications that were previously only available on premium flagship models. Such features include advanced photography, graphics-intensive gaming and augmented reality (AR).

The flagship-level capabilities are made possible by a nearly 50 percent improvement in DRAM performance, from 17 gigabytes per second (GB/s) to 25GB/s, and a doubling of NAND flash performance, from 1.5GB/s to 3GB/s, over the previous LPDDR4X-based UFS 2.2 solution.

It also helps in maximizing space-efficiency within a smartphone by integrating DRAM and NAND storage into a single compact package that measures only 11.5mm x 13mm, allowing more space for other features.

With DRAM capacities ranging from 6GB to 12GB and storage options from 128GB to 512GB, the Samsung uMCP can be easily customized to accommodate the diverse needs of 5G smartphones throughout the mid- and high-end segments.

So far, Samsung has successfully completed compatibility testing of the LPDDR5 uMCP with several global smartphone manufacturers and expects the uMCP-equipped devices to hit mainstream markets starting this month.

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