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New Snapdragon 821 Powered Cool Flagship Hits TENAA

by Joe 3

Coolpad and LeEco recently announced the Cool1 Dual smartphone aimed at the mid-range segment. Now, it looks like the collaboration is back with a new Cool device, as it recently passed through the network certification website TENAA.

From the design of this new smartphone, it looks like a variant of the Le Pro 3 that was announced by LeEco a while back. The back texture seems to be a bit different and the writing near the bottom now features Cool’s logo as well as ‘LeEco Inside’ tagline. Rest of the design is exactly the same as the Le Pro 3. The website reveals that there will be different color options like gold, white, silver, blue, black etc.

As for the specs, the new Cool smartphone will feature a 5.5-inch 1080p display with Snapdragon 821 (2.35GHz) inside and 4GB / 6GB RAM options. There will be three storage variants, namely 32GB, 64GB, and 128GB. Further, like the Le Pro 3, this new phone also features a large 4000mAh battery.


For camera, the phone will have a 16MP sensor at the back and an 8MP sensor up front. As for the software, it is running on Android 6.0.1.

There are no further details available about this device, but given that it has passed through TENAA, we can expect more info in the coming days. It will be interesting to see how different this Coolpad + LeEco flagship will turn out to be as compared to the Le Pro 3.


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  • Saku

    Well, I expect it to be another good collaboration Leeco and Cool.

    Cool1 is pretty solid, my friend who owns one is so much in love with it.

    • Muhammad Yasir

      i would LOVE to own the cool1 dual !

  • Assefa Hanson

    Don’t like the disgn I’m seeing here