Realme has already confirmed that it will launch the Realme X7 and X7 Pro on September 1. There are even rumours of a third model powered by the unannounced Snapdragon 860 chipset. What is interesting is that the models are all packing impressive processors coupled with the awesome designs. 
The Realme X7 Pro is said to feature a MediaTek Dimensity 1000+ processor while the X7 will be powered by a Dimensity 800U SoC. The prowess of the MediaTek mid-range SC has been showcased in a leaked AnTuTu benchmark screenshot which has emerged ahead of the launch.
The screenshot (via) shows the device was able to attain a benchmark score of 340,000. The score is pretty impressive for a mid-range chipset. It is in the same category as the Snapdragon 845 chipset which heralded the OnePlus 6 released in 2018. The phone is ranked higher than the Qualcomm Snapdragon 765G-powered OPPO Reno4 5G and the Helio P90-powered Reno3.
As a reminder, MediaTek’s Dimensity 800U is the company’s latest mid-range processor. It is based on a 7nm process and adopts an octa-core design, including 2×2.4GHz ARM Cortex A76 large cores and 6×2.0GHz ARM Cortex A55 power-efficient cores. The 5G processor teams up with an ARM Mali-G57 GPU.
The Realme X7 is expected to arrive with a thin and light design weighing just 175g. This potentially makes the phone Realme’s lightest 5G mobile phone yet.
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