Despite the US sanctions, recent data released by market research firm Canalys shows that Huawei still leads the smartphone market in China. That could get eroded if the ban on the use of US technology is not lifted by the new US administration. But before that will happen, Huawei still has a fast depleting stockpile of inventory for 5nm chipsets. The company will reportedly be releasing the Mate X2 foldable smartphone soon with a 5nm chip onboard.

The source of the latest rumor about the Mate X2 is a Weibo tipster named Courage Digital King who hinted that Huawei’s new generation foldable phone models will be released soon, believed to be before the end of February.

The Mate X2 is said to adopt an in-folding design just like what Samsung utilized on its own foldable phones. However, the tipster disclosed that Huawei’s in-folding design is different from that of Samsung.  Also, the phone is said to pack a 5nm chipset that is believed to be the Hisilicon Kirin 9000 series. Expect the flagship device to also have “some very dazzling new technologies” onboard.

The Mate X2 foldable phone was earlier reported to have passed the network access audit of the Ministry of Industry and Information Technology (MIIT) and China’s 3C certification.

According to available details, the device will have a dimension of 161.8×145.8×8.2mm. It will also feature an 8.01-inch main display while the secondary screen size is 6.45 inches. The main screen will have a resolution of 2480×2220 pixels and a 120Hz refresh rate. The display will be supplied by Samsung and BOE.Huawei Mate X2

The premium foldable phone is also expected to pack a built-in 4400mAh battery, and supports 66W super flash charging. Further, it will not use UTG (ultra-thin glass), but choose scratch-resistant CPI (colorless) polyimide.

In other respects, the machine is expected to be equipped with support Bluetooth 5.1 and run EMUI 11 based on Android 10.

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