Recently, Honor announced the Honor 50 SE, Honor 50, and Honor 50 Pro smartphones in China. Fresh information reveals that the company could be working on a new Honor phone with Dimensity 700. Tipster Digital Chat Station has shared some of the key specs of this mysterious handset.
The tipster revealed that the next Honor phone will be featuring a 6.6-inch LCD panel with a centrally aligned punch-hole. It is unclear whether the phone supports HD+ or Full HD+ resolution. The handset will be sporting a high screen-to-body ratio.
There is no word on the battery capacity of the phone, but the leak claims that it will arrive with support for 22.5W fast charging. It will be equipped with a 64-megapixel triple camera system for photography. The other specs of the phone are yet to be revealed.
It will be Honor’s first phone to feature the Dimensity 700 chipset. The inclusion of the D700 chip suggests that it will be positioned lower than the Dimensity 900 powered Honor 50 SE. It is likely to arrive as one of the most affordable 5G phones from the brand.
Honor is also rumored to be working on the Honor X20 series of smartphones such as X20, X20 Pro, and X20 SE. A leaked photo of one of the X20 lineup phones was spotted at the beginning of this month. It is expected to arrive with specs like a 6.67-inch IPS LCD FHD+ panel with high refresh rate support, Dimensity 1200, 64-megapixel triple cameras, and a 4,200mAh battery with 22.5W fast charging.
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