Taiwanese semiconductor manufacturer MediaTek made a grand return to the high-end mobile chip segment with the launch of the Dimensity 1000 series. The company is planning to unveil a successor to the Dimensiity 1000 SoC and earlier rumors tip the next-generation premium chipset to bear the moniker Dimensity 2000.
However, a new leak has emerged showing the device will be known by a different name. Noted tipster Ice Universe has disclosed via a Weibo post that MediaTek’s next-gen chipset will be known as Dimensity 9000 instead of the expected Dimensity 2000 naming.
This comes at the same time it is rumored that Qualcomm’s next-generation Snapdragon 898 chipset will bear a different naming scheme viz-a-viz Snapdragon 8 Gen1. There may be no reason other than the need to tweak things a bit for this rumored name change.
The alleged Dimensity 9000 is reportedly based on TSMC’s 4nm process. The CPU consists of a 3.0GHz Cortex X2 super core + three Cortex A710 cores + four Cortex A510 small cores, while the GPU is expected to be the Mali-G710 MC10 which should be behind the Adreno 730 GPU that the Snapdragon 898 will feature.
The Dimensity 9000 will likely not be as powerful as the Snapdragon 898 but will likely not be too far behind. Since it uses TSMC’s 4nm process, it may provide better power consumption than the Qualcomm chip which will be built on Samsung’s 4nm process.
MediaTek’s next-gen premium chipset is expected to make its debut in early 2022.
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