Intel is apparently seeking to deepen its relationship with TSMC. The company aims on expanding its cooperation to ensure a secure supply of 3nm chip production technology while avoiding a conflict with the iPhone maker as well.
According to DigiTimes report (Via MacRumors), the known American chipmaker plans to secure the advanced 3nm process technology of the world’s largest contract chip producer. As per our previous report, the Taiwan Semiconductor Manufacturing Company had already began the pilot production of its 3nm process technology, with its mass production stage starting sometime in the fourth quarter of next year. In other words, the Cupertino based giant, Apple would likely use the technology in its 2023 iPhones and Mac.
To deepen its relations with TSMC, Team Blue is reportedly planning to send high level executives to visit Taiwan and TSMC later this month. These executives will discuss the 3nm chip process technology and its production capacity. Furthermore, through the growing relations, the company would be able to gain access to more 3nm process capacity at TSMC. This closer tie would also help it avoid any conflict with one of TSMC’s important customers, Apple.
As of right now, Apple’s latest chipset use the advanced 5nm process from TSMC, which power a number of its products lines like Macs, iPads, and iPhones. With the 3nm technology, the smartphone maker would likely be a priority customer to receive the first batch of the cutting edge chip process. So, the move from Intel arrives as no surprise, considering the world is already facing a shortage of semiconductors.
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