New rumors regarding the upcoming MediaTek mobile chips have just surfaced online. The leak has revealed the possible launch timeline for the Dimensity 9000 SoC, and the specs of the smartphone that will feature the Dimensity 8000 chip as well.
The information arrives from known tipster @DigitalChatStation the higher end Dimensity 9000 processor will be launched sometime in the first half of this year. Additionally, the new flagship chip will first appear on two or three smartphone models, which will sport a 2K display. He further added that some of these new smartphones will feature dual primary camera setup on the rear as well. For those unaware, the chip in question is based on the 4nm process from TSMC and features ARM’s Cortex X2 super core, along with Cortex A710 high performance, and Cortex A510 power efficient cores.
As of right now, it is unknown which exact models will feature the new chip, but Redmi and Oppo have confirmed that their upcoming handset (Find and K50 series respectively) will feature the Dimensity 9000 SoC. This chip even offers a number of improvements in terms of photography, so the dual primary camera module would likely take advantage of this as well. On the other hand, the tipster also revealed interesting information regarding the Dimensity 8000 chip, which is also set to launch later this year.
Apparently, a Dimensity 8000 powered smartphone will feature a 6.6 inch 120Hz display with 12GB of RAM. For photography, this device will arrive with 16 megapixel selfie shooter on the front while the rear houses a triple camera setup. This will include a 50 megapixel 1/1.5″ primary rear camera paired with another 50 megapixel lens and a 2 megapixel shooter as well. This model will be released during the Spring Festival and will target the 2,000 Yuan (roughly 315 US Dollars) segment. In other words, it will be an upper mid range handset. Keep in mind that this is still an unconfirmed report, so take it with a pinch of salt and stay tuned for more updates.
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