Prior to the launch of the Redmi K50 Gaming Edition, the company has sent out a number of invitational boxes to various publications in China. And now, we have a look at all of what’s inside the special invitation box.
For those unaware, the Chinese smartphone maker had recently announced that it was partnering up with the Mercedes-AMG F1 racing team for the upcoming device. ITHome was one of the publications in China that has received this package and have shared images and details. The most highlighting aspect of the invitation box is a small Mercedes-AMG F1 racing car model. Looking at the model, we can see all the details of the F1 race car along with the AMG Petronas branding as well.
Apart from this, the brand even shared three packaged heat sinks as well, which is another major feature of the K50 Gaming Edition. Since it is a gaming smartphone, it arrives with top notch specs to ensure that users receive a great gaming experience. However, powerful specs also mean higher temperatures. So, it isn’t surprising that the device also has capable cooling mechanisms as well. In a previous teaser, Redmi revealed that its device will also include industry’s largest dual VC heat dissipation system, with a size of 4861mm².
Under the hood, the handset will be powered by the Qualcomm Snapdragon 8 Gen 1 chipset. The Redmi K50 Gaming Edition will sport a 6.67 inch OLED Full HD+ display with a screen resolution of 2400 x 1080 pixels, a 120Hz refresh rate, and a 480Hz touch sampling rate along with Gorilla Glass Victus protection. The device is set to be unveiled on 16th February 2022, so stay tuned as we will be covering the launch event.
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