The Samsung-manufactured Snapdragon 8 Gen 1 is having a tough time keeping up its most prominent rival, MediaTek, which has lately been acing it with its latest TSMC-produced Dimensity chips. Early benchmark scores of the Dimensity 9000 were found to be higher than that of the Snapdragon 8 Gen 1, and as if that wasn’t enough, the Qualcomm flagship has now apparently been beaten by the Dimensity 8100 as well.

Tipster Digital Chat Station today shared Geekbench results of the Dimensity 8100, Snapdragon 8 Gen 1, and the Snapdragon 888, where the MediaTek chip easily beat the other two on the multi-core test. Devices used were all from realme, with the RMX3562 being the upcoming realme GT NEO3.

But the D9000 ranked last in the single-core test due to the presence of a super-powerful Cortex-X1 core on both the Qualcomm chips.

Regardless, it’s still remarkable to see a chip that isn’t even MediaTek’s best for this year beat two flagship processors from Qualcomm. MediaTek’s flagship solution for 2022 is actually the Dimensity 9000 chip, and the Dimensity 8000 series is only aimed at upper-mid-range smartphones. On top of that, the Dimensity 8000 chips use an older 5nm process compared to the cutting-edge 4nm process employed by the Snapdragon 8 Gen 1.

But Qualcomm does have another card up its sleeve. Another flagship processor from the chipmaker has been making rounds lately and judging by its SM8475 model number, it will most likely be an upgraded Snapdragon 8 Gen 1, likely a Plus version. This one will be manufactured using TSMC’s superior 4nm process as opposed to Samsung’s 4nm process used for the first-gen 8 Gen 1. It will thus be interesting to see how well the upgraded version stacks up against rivals.

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