The buildup to the official unveiling of the Lenovo Legion Y70 gaming phone continues to gather steam. Ahead of the August 18 event, the company had previously released some details about its latest flagship. Lenovo is further showcasing the model by releasing details about the phone’s cooling mechanism.
The Legion Y70 will have a 5,047 sq. mm vapor chamber with a thickness of 0.55mm. The thickness of the profile is quite thin while the base has an overall thickness of 0.8mm without its camera. The Legion Y70 comes with a bulging 50MP camera with OIS. There are 10 layers of heat dissipating mechanisms and materials that provide excellent cooling for the device. Lenovo is also marketing the phone as having an excellent cooling system akin to a refrigerator.
As we know, the Legion Y70 is projected with strong gaming credentials but it also comes with a cool design that will also suit the average customer. While some gaming components like shoulder triggers and a gaming-centric UI are absent, the phone comes well-primed for gaming with its Snapdragon 8+ Gen 1 SoC, 16GB of RAM, and 68W fast charging support. The device’s excellent cooling mechanism also adds to the mix to make it a worthy purchase. More details will trickle in as we inch closer to the official unveiling of the Lenovo Legion Y70.
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