OPPO is set to launch its highly anticipated Find X6 series on March 21st. The Find X6 Pro is expected to be the main attraction of the event, with leaked images showcasing a striking camera module design that is highly recognizable.
The Find X6 Pro camera module features an “Oreo” shape design with three cameras and an LED flash. The upper part of the housing is made of glass with a glossy finish, while the lower part is made of bare metal with a matte finish. This design choice is likely to improve recognition and distinguish the OPPO Find X6 Pro from other smartphones in the market.
The partnership between OPPO and Hasselblad, the Swedish camera manufacturer, is evident in the engraved logo in the middle of the camera module. The OPPO Find X6 Pro will also be powered by the MariSilicon X chip, further enhancing the camera performance of the device.
As reported by the blogger “Digital Chat Station,” the Find X6 Pro will house Sony IMX989 + IMX890 + IMX890 triple camera unit on the back. All these sensors have a megapixel count of 50. On the front, Find X6 Pro will feature a 32-megapixel Sony IMX709.
The OPPO Find X6 Pro will also feature a Snapdragon 8 Gen2 processor, and AnTuTu’s running score is expected to exceed 1.20 million points, making it a high-performing device. Under the hood, the device is expected to house a 5,000mAh battery with 100W wired and 50W wireless fast-charging support.
In addition to the Find X6 Pro, OPPO will also launch the Find X6 and the OPPO Pad 2, which will be powered by the latest MediaTek Dimensity 9200 chipset, and the OPPO Enco Free3 wireless headphones.
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(Source)
