MediaTek, collaborating with TSMC, announces the successful tape-out of its first 3nm Dimensity chipset, developed using TSMC’s 3nm process. Mass production of the chip starts next year, with the launch scheduled for the second half of 2024.
Performance Breakthrough: The Power of the 3nm Process
TSMC’s 3nm process technology offers notable advantages compared to its 5nm predecessor. It delivers around a 60% increase in logic density and provides an 18% speed boost at constant power or a 32% reduction in power consumption with the same performance. This technology targets high-performance computing and mobile applications, aiming to enhance performance, power efficiency, and yield.
MediaTek plans to incorporate this chip into various devices such as smartphones, tablets, and smart vehicles. This strategic move places MediaTek at the forefront of chip manufacturing, as the industry competition to adopt the 3nm process intensifies.
There are speculations suggesting that Apple might be an early adopter of TSMC’s 3nm production capacity, potentially using it for their upcoming A17 chip later this year. In contrast, accurate details about Qualcomm’s 3nm technology are limited as of now. When Qualcomm eventually launches its 3nm chip, it is expected to trigger a competitive rivalry with MediaTek.
Joe Chen, MediaTek’s President, praised the partnership with TSMC for its exceptional manufacturing capabilities. He expressed that this collaboration will enable MediaTek to demonstrate its advanced design in flagship chipsets, aiming to offer high-quality solutions to their global customers and enhance the user experience in the flagship market.
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