Intel has officially launched high-volume manufacturing on the Intel 4 process technology at its Fab 34 facility in Leixlip, Ireland. The event, graced by Intel CEO Pat Gelsinger, marks a significant leap forward in semiconductor technology.
The Intel 4 process, employing extreme ultraviolet (EUV) lithography, represents Intel’s foray into a future brimming with cutting-edge products, from processors revolutionizing artificial intelligence in PCs to chips fueling the world’s largest data centers.
Central to this achievement is the integration of EUV lithography technology, a marvel of precision, enabling the definition of smaller and more intricate chip features. The EUV machines, provided by Dutch manufacturer ASML, represent a pinnacle of engineering, boasting mind-boggling accuracy. Each of these colossal machines, resembling a bus in size, costs around $150 million and plays a pivotal role in Intel’s quest for technological supremacy.
Ann Kelleher, Intel’s General Manager of Technology Development, emphasized the company’s progress, stating that two manufacturing processes have been successfully completed, with a third swiftly underway. The Leixlip facility stands as a testament to Intel’s unwavering commitment to innovation, boasting an intricate network of overhead robots navigating a 22km track, ensuring the seamless transport of silicon wafers from one advanced tool to another.
The Irish plant is now gearing up to produce chips, including the highly anticipated Meteor Lake PC processors. Intel’s investment in this venture has been substantial, with a staggering $18.5 billion USD spent on doubling the manufacturing space in Leixlip. This expansion aligns with Intel’s ambitious plans to deliver five generations of technology within just four years, reaffirming the company’s commitment to regaining process leadership by 2025.
The commencement of high-volume production on the Intel 4 process in Leixlip heralds a new era of innovation, where the boundaries of what’s possible in computing technology are continually pushed.
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(via)
