Chinese tipsters are claiming that the Xiaomi 14 and 14 Pro will debut as the first Snapdragon 8 Gen 3 phones on Oct. 27 in China. Qualcomm is expected to announce the new chip at the 2023 Snapdragon Summit, which will be held between Oct. 24 and Oct. 26. MediaTek, too, is said to be working on launching its next flagship chip, dubbed the Dimensity 9300. In a new Weibo post, tipster DCS revealed when the first D9300-powered phones will be released in the Chinese market.
According to the tipster, MediaTek will unveil the Dimensity 9300 chip in the next month (November). The Vivo X100 and X100 Pro are poised to become the first line of smartphones powered by the Dimensity 9300 mobile platform. Both phones are expected to debut in the same month. The X100 Pro+, featuring the Snapdragon 8 Gen 3, is likely to launch in Q1 2024.
Dimensity 9300 specifications (rumored)
The MediaTek Dimensity 9300 chipset is crafted using TSMC’s advanced 4nm process and boasts a configuration of 1 x ARM Cortex-X4 prime core, 3 x Cortex-X4 cores, and 4 x Cortex-A720 cores, delivering improved power efficiency compared to its predecessor. Notably, the Cortex-X4 ultra-large core, based on Armv9 architecture, pushes the boundaries of smartphone performance, offering a 15 percent boost over the X3, while also reducing energy consumption by 40 percent.
On the other hand, the Cortex-A720 is set to become the mainstream large core in the coming year, enhancing the sustained performance of mobile devices and serving as the primary core in the new CPU cluster. It is expected to offer maximum clocking speeds of 3.25 GHz. For graphics, the chip is said to be equipped with the latest ARM Immortalis G720 MC12 GPU.
The leaked specifications of the Dimensity 9300 chipset indicate a substantial advancement in both performance and power efficiency. This positions it as a strong contender to compete with Apple’s chips in the realm of performance, challenging the recently unveiled A17 Pro that powers the iPhone 15 Pro series.
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