Apple may be the first company to utilize TSMC’s upcoming 2-nanometer chip technology, according to DigiTimes. 

TSMC, a major chip manufacturer, is expected to begin production of 2nm chips in the second half of 2025. The smaller transistor size associated with this technology allows for more transistors to be packed onto a single processor, which could mean faster performance and less power use.

Apple has a history of being an early adopter of TSMC’s leading-edge chip technologies. This year, for example, both the A17 Pro chip in the iPhone 15 Pro and the M3 series chips in Macs utilize TSMC’s 3-nanometer process.

Apple is again expected to be the first to try TSMC’s new 2nm process. The new node will also adopt a new manufacturing process known as gate-all-around field-effect transistors (GAAFET) with nanosheets. 

The technology should enable faster speeds and lower power consumption compared to the FinFET transistors used in current chips.

However, the shift to GAAFET comes with its own set of challenges. Specifically, TSMC will need to build new fabs and invest heavily in adapting its production process. 

Apple, as a key TSMC customer, will also likely need to make adjustments to its chip designs to accommodate the new technology.

Besides the up-and-coming 2nm node, TSMC is also refining its current 3nm process. The company has already improved its fabrication process in the new N3E and N3P chips, while it’s also working on other chips like N3X and N3AE for high-performance computing and automotive applications, respectively.

Looking even further ahead, rumors suggest TSMC is already exploring even more advanced 1.4-nanometer chips. They are expected to arrive as early as 2027. Apple, unsurprisingly, is reportedly interested in securing early access to this cutting-edge technology as well.

Related:

(VIa)

RELATED ARTICLESMORE FROM AUTHOR