MediaTek is pursuing the power consumption and efficiency of SoC (system on a chip) with more cutting-edge technology and TSMC’s second-generation 3nm process node. CEO Cai Lixing confirmed that this year’s Dimensity 9400 flagship chipset will be unveiled in October.
Dimensity 9400 reportedly offers 40% higher AI performance as compared to its predecessor
According to the company, the Dimensity 9400 is capable enough to handle most on-device large language models on the market. The CEO is also quite confident that the revenue from this flagship chipset will result in a 50% revenue increase year-over-year.
The news comes from a press conference the company held on the 31st of July. According to the company, the Dimensity 9400 will have 40% higher AI performance as compared to the predecessor. For context, the Dimensity 9300‘s AI performance is measured at 48 TOPS. According to the CEO, MediaTek is leading the market in the NPU (neural processing unit) performance of the flagship SOC. However, he also mentioned that the ASP (average price) of phones with the flagship chip will also be higher as compared to last year.
Speaking of the CPU core configuration, it is rumored that the Dimensity 9400 will lack power-efficient cores, just like its predecessor. The new chip will reportedly use ARM’s BlackHawk CPU architecture and will solely on performance cores to deliver unrivaled single-core and multi-core performance. It’s also rumored that the Dimensity 9400 will boast the largest die ever, which will be measured at 150mm² and will include 30 billion transistors. Nonetheless, we will need to look at real-life test data before commenting on the performance capability of this chip.
MediaTek and Nvidia are also collaborating on automotive chips and are expected to launch the first one in early 2025. It is said that Nvidia will provide the GPU and MediaTek will provide the CPU+ISP. With this development, CEO Cai Lixing expects that there will be significant progress in the automotive field from 2027 to 2028.
(Via)
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