The Google Pixel 9a is expected to be released later this year, possibly at the end of 2024. Some sources suggest it could launch in May 2025, which will be in line with the launch date of the last two generations of A series devices – the Pixel 8a and Pixel 7a.
In the latest news, Kamila Wojciechowska, a source inside Google, claims that the Pixel 9a will pack Google’s latest Tensor G4 chip but an older modem.
We have seen Google’s A series Pixel phones coming closer and closer to the base model of the flagship tear Pixel. While it sounds like a good deal, it has created confusion among users regarding their purchase decisions. Notably, the pricing of the A series devices has also increased.
According to the source, Google might be trying to clear up some of the confusion by better differentiating its A series devices from the more premium models, and using an older modem could be a step in that direction.
Pixel 9a’s Tensor G4 to adopt inferior chip packaging tech
Speaking of the Tensor G4 chip that will power the Pixel 9a, the silicon die remains the same, however, the packaging is different. For those unfamiliar, the packaging protects the die from the external environment and also interconnects it to the PCB (Printed Circuit Board). The packaging element also helps dissipate heat generated by the SoC during operation, which is crucial for maintaining a stable performance. Advanced packaging may include materials or designs that enhance thermal conductivity.
Specifically speaking, the Tensor G4 chip for the Pixel 9a has shifted to IPoP (Integrated Package on Package) from FOPLP (Fan-Out Panel Level Packaging). According to Samsung, the FOPLP is the company’s newer and more advanced packaging method, which is thinner and dissipates heat better. So, technically, the Pixel 9 series flagship devices may maintain an edge in performance and stability while the decision to shift to IPoP may make the Pixel 9a slightly less expensive to manufacture.
(Source)
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