Alongside Vivo, iQOO is preparing to release its 2024 flagship, the iQOO 13. Unlike the Dimensity 9400-powered Vivo X200 series expected this year, the iQOO flagship will feature Qualcomm’s Snapdragon 8 Gen 4 chip.
Alongside the more expensive chipset, the iQOO 13 may also introduce a single-layer motherboard supported by a redesigned heat dissipation system, according to a Weibo leak by tipster Goblue V.
Better heat dissipation means better sustained performance with iQOO 13
While details about the cooling system remain sparse, it’s likely that the redesign in iQOO 13 includes a larger VC cooling plate for better dissipation of the heat generated by the processor. This should result in improved sustained performance during heavy workloads.
As for the Snapdragon 8 Gen 4, leaked block diagrams have revealed support for LPDDR5X RAM and UFS 4.0 storage. Interestingly, there will be two versions of the chip, differentiated by CPU clock speed and cellular connectivity, but it’s unclear which variant will power the iQOO 13.
According to earlier leaks, the Snapdragon 8 Gen 4 offers a significant 56% GPU performance boost over the already capable Snapdragon 8 Gen 3, while also being more power-efficient due to TSMC’s 3nm process node.
Rumors also hint at a massive 6,150 mAh battery for iQOO 13, which is a notable upgrade from the iQOO 12‘s 5,000 mAh capacity. Thanks to silicon-anode technology, this new battery could provide longer-lasting power and better overall battery life.
While the inclusion of a redesigned cooling system and larger battery capacity is promising, these are still leaks, so readers should take the information with a pinch of salt.
On the front, the phone packs a 6.7-inch 2K AMOLED panel from BOE with a smooth 144Hz refresh rate. The local variant of the phone has already been spotted on IMEI and reports also claim that the phone will be released in India sometime in December this year.
(Source)
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