Yesterday, MediaTek unveiled the Dimensity 8400, a chipset designed to power sub-flagship phones. Redmi was the first brand to confirm that the upcoming Redmi Turbo 4, set to arrive in January 2025, will be the first phone to feature the D8400 chipset. Soon after, Realme confirmed that it will also announce a smartphone powered by the D8400.
Realme Neo 7 SE is incoming
The above poster confirms that Realme will release a phone featuring the Dimensity 8400. However, it hasn’t revealed the name of the device. Based on its positioning, the new Realme device featuring the Dimensity 8400 is likely to be part of the Neo series.
Reliable leaker Digital Chat Station claims that the upcoming Realme Neo 7 SE will feature the Dimensity 8400 processor. The inclusion of the new chip suggests that the Neo 7 SE will rival the Redmi Turbo 4 in China.
As per reports, the Turbo 4 will be rebranded as the Poco X7 in the global market. To recall, the Realme GT Neo 6 SE was rebranded as the Realme GT 6T globally. Therefore, it is likely that the Realme Neo 7 SE may get rebadged as the Realme GT 7T in markets outside of China.
As far as the chip is confirmed, the 4nm Dimensity 8400 comprises 1× 3.25GHz Cortex-A725, 3× 3.0GHz Cortex-A725, and 4× 2.1GHz Cortex-A725 cores. For graphics, the D8400 is equipped with an Immortalis-G720 MC7 GPU operating at 1300MHz.
The recently unveiled Realme Neo 7 is equipped with a massive 7,000mAh battery. Therefore, it is likely that the Neo 7 SE could be equipped with a 6,000mAh to 7,000Ah battery. Hopefully, upcoming reports will reveal more details about the 7 SE. Likely, it will be announced in January 2025 in China.
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