Qualcomm’s upcoming Snapdragon 8 Elite 2 has already been rumored to use TSMC’s third-generation 3nm process, known as N3P. Now, a new leak suggests it won’t be the only Qualcomm chipset on this node.
Qualcomm’s expanding 3nm lineup
According to reliable leaker Digital Chat Station (DCS), another Qualcomm chipset, codenamed SM8845, will also be built on TSMC’s 3nm fabrication. While its exact identity remains unclear at the moment, it could be the successor to the Snapdragon 8s Gen 4, which is expected to launch soon.
An early report hinted that SM8845 will feature a fully custom architecture, and today’s leak reinforces that claim. DCS says the chipset will use Qualcomm’s self-developed Oryon cores which if true will distinguish it from the Snapdragon 8s Gen 4 that is expected to stick with ARM’s standard core designs.
Moreover, since the 8s Gen 4 relies on ARM cores, it likely won’t carry the Elite branding that Qualcomm has reserved for its custom-core chips. But if SM8845 does indeed feature Oryon cores, it could end up as another Elite-branded SoC.
Performance-wise, a previous report claimed that SM8845 is designed to match the benchmark scores of the Snapdragon 8 Elite (SM8750). It’s also expected to debut in the Redmi K90.
Dimensity 9500 and Dimensity 9450
Beyond Qualcomm, the leak also shares new details on MediaTek’s upcoming chips. According to Digital Chat Station, the flagship Dimensity 9500 will also be built on TSMC’s 3nm process.
More interestingly, it is said to be accompanied by another chip called the Dimensity 9450 which will use the same fabrication technology. The similarities might go beyond just the manufacturing process, as both chipsets are reportedly designed with a big-core architecture.
According to reports, both the Snapdragon 8 Elite 2 and Dimensity 9500 might arrive early this year. MediaTek is expected to launch the Dimensity 9500 around mid-2025, while Qualcomm is might unveil the Snapdragon 8 Elite 2 in early October.
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