MediaTek has officially confirmed that it’s working on a 2 nm chip, expected to tape-out later this year. The announcement, made during the company’s keynote at Computex 2025, positions the Taiwanese chipmaker as a serious contender in the next big semiconductor transition after 3 nm.
With several smartphone chips already using 3 nm nodes, attention is now turning to the next leap in performance and efficiency. Apple is typically first to adopt leading-edge nodes from TSMC, but uncertainty surrounds its plans to adopt the 2nm node for upcoming iPhones. If Apple sticks with the refined 3 nm N3P node for its A20 chip due to production timing or cost concerns, MediaTek could become the first to bring a 2 nm smartphone SoC to market.
MediaTek confirms it’s 2 nm chip will tape-out in September 2025
At Computex, MediaTek said its 2 nm chip will tape-out in September 2025. In semiconductor development, tape-out refers to the final design being sent for manufacturing preparation. This timeline aligns with TSMC’s own plans — the foundry is expected to begin high-volume manufacturing for its N2 process in the second half of 2026.
While MediaTek didn’t confirm the name of the chip, it’s expected to be the Dimensity 9600 — the company’s next-gen flagship processor. There are no official details about the SoC yet, and it will likely remain under wraps for a while, given that it’s still over a year away from mass production.
Historically, MediaTek’s chips have been seen as cost-effective alternatives to Qualcomm’s flagship offerings. However, that may change with the Dimensity 9600. According to reports, TSMC’s N2 wafers are notoriously expensive. A rumored 10% price hike could push production costs even higher — potentially making the Dimensity 9600 one of MediaTek’s most premium and expensive offerings to date.
If all goes to plan, MediaTek’s 2 nm chip could arrive in late 2026, ushering in a new generation of high-performance Android smartphones.
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Source: MediaTek at Computex 2025
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