Honor is reportedly working on the Honor Magic 9 series for the Chinese market. A recent leak revealed a few key details about the Honor Magic 9 Pro Max, and now a new leak has surfaced revealing key specifications of what appears to be the standard Magic 9. To recall, the Honor Magic 8 was equipped with a 6.59-inch screen, but rumors surrounding the Magic 9 suggest that it could be a compact offering with a smaller display. Here’s a look at all the details that have surfaced through the latest leak.
Honor Magic 9 key specs tipped
A new leak from tipster Digital Chat Station suggests that the Honor Magic 9 could arrive with a strong focus on battery life and compact design. The device is said to feature a 6.3-inch “small screen” form factor, with early evaluations pointing to a battery capacity of around 8,000mAh, which would be a significant upgrade for this segment.
In terms of performance, Honor is reportedly testing two chipset options: a next-generation 2nm Snapdragon 8 Elite Gen 6 (8E6) and a 3nm Snapdragon 8 Elite Gen 5 (8E5), with the final decision still under evaluation. If the company opts for the slightly older 8E5 platform, the device is still expected to retain premium features such as a periscope telephoto camera, wireless charging support, full-level water resistance, and an ultrasonic fingerprint sensor.
The display is tipped to use an LTPS panel, and choosing the 3nm chip could allow Honor to position the phone at a noticeably lower price compared to the 2nm variant, potentially making it a more accessible flagship offering.
In March, DCS claimed that the Magic 9’s rear camera setup will comprise a 200-megapixel camera featuring a 1/2.8-inch sensor, a 50-megapixel ultra-wide camera, and a 64-megapixel periscope telephoto camera equipped with a 1/2-inch sensor.
For more daily updates, please visit our News Section.
Stay ahead in tech! Join our Telegram community and sign up for our daily newsletter of top stories! 💡
Comments