New details on Xiaomi’s upcoming chip, now expected to be called XRING O3, have surfaced through a report from Ximitime. The details were reportedly found by digging through the Mi Code database, which has previously revealed early information about the upcoming Xiaomi 17 Fold, too.
According to the report, the XRING O3 is under development under the codename “lhasa.” The chip might appear in the Xiaomi 17 Fold, which is internally called Q18, and has also appeared in IMEI database listings.
Now, compared to the earlier XRING O1, which uses a four-cluster, 10-core layout, Xiaomi may simplify the design with the XRING O3.
Xiaomi XRING O3 core setup
The XRING O3 reportedly drops the extra “big” core cluster altogether and is said to feature an octa-core design. It is said to use a combination of Prime, Titanium, and Little cores.
The Prime core could exceed the 4GHz mark, reaching up to 4.05GHz, while the Titanium cores, designed for high-performance tasks, may run at 3.42GHz.
What stands out more is the so-called Little core. Typically designed for efficiency, it’s now said to run at 3.02GHz. That’s a noticeable jump from the 1.79GHz seen on the XRING O1.
On the graphics side, the GPU is expected to reach close to 1.5GHz, up from around 1.2GHz on the previous generation. Memory speeds, however, might remain unchanged at 9600 MT/s.
The report suggests that these changes could help with background processing and multitasking, especially on larger foldable displays where multiple apps are often in use at the same time. There’s also some uncertainty around the exact core configuration, with possibilities like 1+3+4 or 1+2+5 being mentioned.
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