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HMD looks like it’s getting ready to refresh its modular Fusion phone for Europe, and this time it’s actually tackling one of the original model’s biggest weak spots. A recent leak points to a noticeably stronger version that keeps the whole accessory system intact while upgrading the important bits.
According to the source smashx_60, the European Fusion is ditching the Snapdragon 4 Gen 2 for the more capable Qualcomm Snapdragon 7s Gen 2. Memory options jump to 8 GB or 12 GB of RAM with 256 GB of storage, and there’s virtual RAM expansion too.
The screen also gets a proper upgrade: a 6.56-inch FHD+ IPS LCD running at 120 Hz, instead of the original’s HD+ 90 Hz panel. Cameras stay mostly the same: 108 MP main (now listed with OIS in the leak), a 2 MP secondary on the back, and a 50 MP selfie camera. Battery remains a 5000 mAh unit with 33 W wired charging. The leak also mentions a four-year software update promise.
Quick reminder on the original: HMD launched the first Fusion in September 2024 as an affordable modular phone focused on repairability and those customizable “Outfits.” You snap accessories onto the rear Smart Pin for things like wireless charging, extra protection, or a ring light.
There’s even an open-source kit so people can design and 3D-print their own cases. The first model ran on the weaker Snapdragon 4 Gen 2 and a basic 90 Hz display, so the new processor and higher-res 120 Hz screen are the biggest jumps here.
The modular idea still sits at the center of it all. HMD is clearly sticking with the pitch that the Fusion can adapt to different needs instead of being a fixed-spec phone. If the specs hold up, the refreshed European version should feel a lot snappier day-to-day and look sharper on the screen.
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(Source: @smashx_60 on X)
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