MediaTek recently unveiled the Dimensity 8400 chipset, which is the first-ever chip in its segment. The new chip will drive the Redmi Turbo 4 and Realme Neo 7 SE, which are expected to launch in January 2025 in China. The Poco X7 Pro heading to the global market will also have the new chip, as it is said to be a rebranded version of the Turbo 4. A Geekbench listing of the Turbo 4 has been spotted, revealing its performance for the first time.
Dimensity 8400’s performance revealed
A Xiaomi phone with model number 24129RT7CC was recently approved by China’s 3C certification platform. The same device, which appears to be the upcoming Redmi Turbo 4, has now popped up in Geekbench’s database.
The Dimensity 8400-powered device has managed to score 1642 points in the single-core test and 6056 points in the multi-core test. The single-core and multi-core scores are higher than the Redmi K70e, which debuted last year as the world’s first Dimensity 8300 phone. Though the Dimensity 8400 delivers excellent multi-core results, its single-core performance is somewhat underwhelming.
The Dimensity 8400 will rival the Snapdragon 7+ Gen 3 chip from the Qualcomm camp, which scores around 18XX in the single-core test and around 48XX in the multi-core test. In fact, the D8400 manages to slot itself between the Snapdragon 8 Gen 2 and Snapdragon 8 Gen 3 in terms of multi-core performance.
The Geekbench listing of the Redmi Turbo 4 further reveals that the device will be equipped with 16 GB of RAM and Android 15. The OS is expected to have a layer of HyperOS 2.0 on top.
Redmi Turbo 4 specifications (rumored)
In terms of specifications, the Redmi Turbo 4 is expected to feature a 6.67-inch OLED screen that offers a 1.5K resolution and a 120Hz refresh rate. Under the hood, the Dimensity 8400-powered phone is expected to feature up to 16 GB of RAM, up to 512 GB of storage, and a 6,000mAh or 6,550mAh battery with 90W charging. It is expected to feature a 20-megapixel front camera and an OIS-assisted 50-megapixel + 8-megapixel dual-camera system. The handset is also expected to come with other features, such as an in-screen fingerprint scanner, an IR blaster, and dual speakers.
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