MediaTek is prepping two new chipsets, the Dimensity 9500 and Dimensity 8500. The D9500 is expected to power next-generation flagship phones, such as the Vivo X300 series and the Oppo Find X9 lineup. The D8500, on the other hand, is expected to power mid-tier performance-focused smartphones. Today, tipster Digital Chat Station released a Weibo post to share some details about the D8500 chip and the name of the first phone that will feature it.
Dimensity 8500 to power Redmi Turbo 5, Honor, Realme, iQOO phones
According to DCS, the MediaTek Dimensity 8500 will be a 4nm chip built by TSMC. While the core CPU architecture remains largely unchanged, the Mali-G720 GPU is said to be significantly enhanced. The chip is projected to achieve an impressive AnTuTu benchmark score of over 2 million points.
The Redmi Turbo 5 is expected to be the first phone to feature the Dimensity 8500, with a launch anticipated by the end of this year or early January 2026. This is consistent with other reports that suggest the Poco X8 Pro, which is expected to arrive in the global market in January 2026, will also feature the same chipset. This is understandable, as the X8 Pro is rumored to be a rebranded version of the Redmi Turbo 5.
He added that Honor, Ouga Group (Oppo, OnePlus, and Realme), and iQOO will also launch Dimensity 8500-powered smartphones. Earlier this year, Realme unveiled the Dimensity 8400-powered Realme Neo 7 SE, whereas iQOO announced the Z10 Turbo equipped with the same chip. Therefore, it is likely that the Dimensity 8500 may also power the Realme Neo 8 SE and iQOO Z11 Turbo, expected to launch next year. All these D8500 phones are expected to feature a metal middle frame, indicating a widespread adoption of the said feature.
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