Some images and a short video making the rounds online claim to show actual internal hardware from Apple’s long-rumored foldable iPhone, and they’re popping up weeks before the thing is supposed to launch.
X user @LusiRoy7 shared a quick video showing a physical circuit board plus an AI-cleaned composite image that shows both sides of the same board. The big chip visible on it is reportedly the A20 Pro, which is what Apple is expected to use in the device.
In the image, the system-on-chip die and the DRAM sit side by side and are connected through a redistribution layer instead of being stacked with a traditional interposer. Basically, a redistribution layer is a thin routing structure built right onto the package that re-routes the connections without needing that extra silicon interposer you usually see in stacked designs.
The idea is that this side-by-side layout should help with heat and keep the whole module thin enough to fit inside a folding phone. The chip in the video looks like its top cover has been removed; earlier leaked shots of the A20 Pro showed the usual metal-colored packaging over everything.
If these are real, they’d be some of the first physical images claiming to show actual hardware from Apple’s foldable. That said, the published image is an AI-cleaned composite, so any fine chip markings should be taken with a grain of salt. The cleanup tools can sometimes invent or mess up text in blurry spots. Also worth noting: no Apple logos, model numbers, or etchings on the shielding cans show up in either the video or the image, and none of the usual reliable leakers have backed this up yet.
Like most early hardware leaks, this one is still unconfirmed. The foldable is expected sometime in September. Pricing is widely expected to clear $2,000. We’ll need more solid, independently verified details before anyone can say for sure whether this board is the real deal.
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(Source: @LusiRoy7 on X)
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