New photos claiming to show the Xiaomi 18 Fold have started circulating online, and they look similar to a phone Xiaomi CEO Lei Jun was seen holding earlier this week.
The phone in the photos wears the same Red finish that Redmi picked for the K100 Pro Max. The rear camera module stretches horizontally across the top of the phone and houses three lenses and an LED flash. The leaked images also give us a better idea of the phone’s thickness.
Xiaomi has already confirmed that the 18 Fold will launch in September. It will also be the first phone to use the company’s own XRING O3 chip. Xiaomi CEO Lei Jun previously confirmed the phone as part of the company’s busy September launch schedule.
XRING O3 at the core
The XRING O3 has already attracted plenty of attention. It reportedly scored 5.22 million points on AnTuTu, making it the first mobile chip to cross the 5-million mark.
The processor uses a 10-core CPU design, with all of the cores classified as big cores instead of combining big and smaller efficiency cores. Xiaomi says the chip crossed 15,000 points in multi-core testing, which is a 60% improvement over last year’s chip.
Graphics performance is handled by the new G2-Ultra NX GPU, which is also a first for Xiaomi. The company claims it delivers an 85% increase in graphics performance while using 64% less energy.
The XRING O3 is also the first mobile chip to support LPDDR6 memory. This pushes memory bandwidth to 113.8GB/s, around 48% higher than the previous XRING O1.
Xiaomi has also built the chip around what it calls a unified fusion bus architecture and top-tier metal wiring. According to the company, this brings static latency down to 82ns. While those numbers mainly matter in benchmarks, the lower latency should also help the phone feel more responsive in everyday use.
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