Xiaomi has unveiled three new in-house chipsets for different parts of its technology ecosystem. The lineup includes the flagship Xring O3, AI-focused Xring O100, and intelligent-driving Xring D100. The Xring O3 stands out with a claimed AnTuTu score of 5.22 million, making it the first mobile SoC to cross the 5-million mark.
Xring O3 brings a major performance boost
Built on a 3nm process, the Xring O3 features a 10-core CPU that delivers up to a 60% performance improvement. It also introduces the 16-core G2-Ultra NX GPU, with graphics performance claimed to be up to 85% higher and power efficiency improved by 64%. Xiaomi says the chipset scored 5.22 million points on AnTuTu, making it the first mobile SoC to cross the 5-million mark.
The Xring O3 is also Xiaomi’s first mobile chip with LPDDR6 memory support, offering bandwidth of up to 113.8GB/s. For AI workloads, it delivers 200 TOPS of tensor performance and 3.13 TFLOPS of vector performance, while NPU performance has increased by 45%. AI acceleration is distributed across the CPU, GPU, ISP, DPU, and ADSP, with static latency rated at 82ns. Xiaomi says development took 459 days.
Xiaomi has also confirmed that the Xring O3 will power the Xiaomi 18 Fold and Pad 9 Pro Max, both of which are scheduled to launch in September in China. Readers can visit this post to know more about these devices. Ahead of the launch, the company has already started receiving pre-orders of the 18 Fold, which will sport a wide foldable design.
Xring O100 and D100 target AI and cars
The Xring O100 is built on a 6nm process and uses a near-memory AI architecture designed to reduce memory bottlenecks. It combines vertical chip and memory stacking with millions of high-speed vertical channels to provide bandwidth of up to 1.22Tbps. Xiaomi expects the chipset to be used for on-device AI across phones, cars, and robots.
The Xring D100 focuses on intelligent driving. It is Xiaomi’s first domestic 3nm intelligent-driving AI chip, featuring a 20-core CPU and 16-core NPU. It supports up to 160GB of unified memory and can run AI models with up to 200 billion parameters locally. Development is complete, with commercial availability planned for 2027.
What do you think about Xiaomi’s new chip lineup, especially the Xring O3’s claimed performance?
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