Xiaomi’s next-generation Xring O3 chip is set to power two upcoming devices, the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max. Among them, the flagship tablet, reportedly carrying the model number M367FC, has already appeared on Geekbench, revealing its core specs and performance. Newer benchmark entries now show the chip crossing the 14,000 mark in multi-core performance.
Xring O3 pushes past 14K on Geekbench
The latest Geekbench listings show the Xiaomi M367FC reaching a peak multi-core score of 14,319, while another entry records 14,153. The single-core scores range from 3,474 to 3,710 across the listed results. These numbers provide an early look at the performance potential of the Xring O3 ahead of its arrival in Xiaomi’s upcoming hardware.
The Xring O3 is listed with a 10-core CPU configuration comprising four cores clocked at 3.15GHz, four at 3.69GHz, and two high-performance cores reaching 4.36GHz. Graphics are handled by a 16-core Mali-G2-Ultra-NX GPU.
Xiaomi has also claimed substantial generational gains, including up to 60% higher CPU performance and an 85% improvement in GPU performance, alongside a 64% increase in GPU power efficiency.
Unlike upcoming 2nm flagship chips from Qualcomm and MediaTek, the Xring O3 is built on a 3nm process. However, it is \ the first mobile chip to support LPDDR6 memory. The Xiaomi 18 Fold and Pad 9 Pro Max are expected to pair it with CXMT’s 16GB LPDDR6 memory, which can reach speeds of up to 12,800Mbps and deliver memory bandwidth of up to 113.8GB/s.
The chip also reportedly delivers 200 TOPS of tensor AI performance, 3.13 TFLOPS of vector AI performance, and up to 45% higher NPU performance. Xiaomi has claimed an AnTuTu score of 5.22 million, potentially making the Xring O3 the first mobile chip to cross five million points.
For more daily updates, please visit our News Section.
Stay ahead in tech! Join our Telegram community and sign up for our daily newsletter of top stories!
(via)
Comments